U.S.-Japan Semiconductor Agreement Data Collection Program Report

U.S.-Japan Semiconductor Agreement Data Collection Program Report

OMB: 0625-0211

IC ID: 3846

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Information Collection (IC) Details

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U.S.-Japan Semiconductor Agreement Data Collection Program Report
 
No Migrated
 
Voluntary
 

Document Type Form No. Form Name Instrument File URL Available Electronically? Can Be Submitted Electronically? Electronic Capability
Form ITA-4115P No No


    

32 0
   
Private Sector Businesses or other for-profits
 
   0 %

  Approved Program Change Due to New Statute Program Change Due to Agency Discretion Change Due to Adjustment in Agency Estimate Change Due to Potential Violation of the PRA Previously Approved
Annual Number of Responses for this IC 384 0 384 0 0 0
Annual IC Time Burden (Hours) 1,152 0 1,152 0 0 0
Annual IC Cost Burden (Dollars) 0 0 0 0 0 0

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            Blank fields in records indicate information that was not collected or not collected electronically prior to July 2006.

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