Defense Industrial Base Assessment

---

Overview

Cover Page
Table of Contents
General Instructions
Definitions
Respondent Profile
1a
1b
1c
2
3a
3b
4a
4b
5a
5b
5c
5d
5e
6a
6b
6c
6d
7
8
9a
9b
10
11a
11b
12a
12b
12c
13a
13b
14
15

---

Sheet 1: Cover Page

Next Page

OMB Control Number: 0694-0119

Expiration Date: [ ]

DEFENSE INDUSTRIAL BASE ASSESSMENT: Bare Printed Circuit Board Manufacturers

SCOPE OF ASSESSMENT

The U.S. Department of Commerce, Bureau of Industry and Security (BIS), Office of Technology Evaluation, in coordination with the United States Navy, Naval Surface Warfare Center, Crane Division (NSWC Crane) is conducting an assessment of the U.S. industrial base for manufacturing bare printed circuit board products. The primary goal of this study is to assist the US defense community in understanding the health and competitiveness of organizations manufacturing bare printed circuit boards for commercial and U.S. Government applications at facilities located in the United States. The Secretary of the Navy is the DOD Defense Executive Agent for printed circuit board technology. NSWC Crane is the DOD Executive Agent technical lead for printed circuit board and interconnect technology. NSWC Crane provides acquisition engineering, in-service engineering, and technical support for sensors, electornics, electronic warfare, and special warfare weapons.

RESPONSE TO THIS SURVEY IS REQUIRED BY LAW

A response to this survey is required by law (50 U.S.C. App. Sec. 2155). Failure to respond can result in a maximum fine of $10,000, imprisonment of up to one year, or both. Information furnished herewith is deemed confidential and will not be published or disclosed except in accordance with Section 705 of the Defense Production Act of 1950, as amended (50 U.S.C App. Sec. 2155). Section 705 prohibits the publication or disclosure of this information unless the President determines that its withholding is contrary to the national defense. Information will not be shared with any non-government entity, other than in aggregate form. The information will be protected pursuant to the appropriate exemptions from disclosure under the Freedom of Information Act (FOIA), should it be the subject of a FOIA request. Not withstanding any other provision of law, no person is required to respond to nor shall a person be subject to a penalty for failure to comply with a collection of information subject to the requirements of the Paperwork Reduction Act unless that collection of information displays a currently valid OMB Control Number.

BURDEN ESTIMATE AND REQUEST FOR COMMENT

Public reporting burden for this collection of information is estimated to average 13 hours per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information to BIS Information Collection Officer, Room 6883, Bureau of Industry and Security, U.S. Department of Commerce, Washington, D.C. 20230, and to the Office of Management and Budget, Paperwork Reduction Project (OMB Control No. 0694-0119), Washington, D.C. 20503.

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 2: Table of Contents

Previous Page			Return to Table of Contents				Next Page
TABLE OF CONTENTS
I	General Instructions
II	Definitions
III	Respondent Profile
1	Organization Information
2	Mergers, Acquisitions, Divestitures, and Joint Ventures
3	Customers and Competitors
4	Interactions with the USG
5	Manufacturing Capabilities
6	Materials and Equipment
7	Sales
8	Financial Information
9	Research & Development
10	Capital Expenditures
11	Workforce
12	Competitive Factors
13	Cyber Security
14	Challenges and Outreach Interest
15	Certification
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 3: General Instructions

Previous Page				Return to Table of Contents							Next Page
Section I: GENERAL INSTRUCTIONS
A.	Your facility is required to complete this bare printed circuit board survey using an Excel template, which can be downloaded from the BIS website: http://bis.doc.gov/printedcircuitboards. If you are not able to download the survey document, at your requrest BIS staff will e-mail the Excel survey template directly to you. For your convenience, a PDF verson of the survey and required drop-down content is available on the BIS website to aid internal data collection. DO NOT SUBMIT the PDF version of the survey as your response to BIS. Should this occur, your facility will be required to resubmit the survey in the requested Excel format.
B.	Respond to every question. Surveys that are not fully completed will be returned for completion. Use the comment boxes to provide any information to supplement responses provided in the survey form. Make sure to record a complete answer in the cell provided, even if the cell does not appear to expand to fit all the information. DO NOT CUT AND PASTE RESPONSES WITHIN THIS SURVEY. Survey inputs should be completed by typing in responses or by use of a drop-down menu. The use of cut and paste can corrupt the survey template. If your survey response is corrupted as a result of cut and paste responses, a new survey will be sent to your organization for immediate completion.
C.	Do not disclose any classified information in this survey form.
D.	Estimates are often acceptable (and in some sections encouraged), but in sections that do not explicitly allow estimates you must contact BIS survey support staff before including estimates.
E.	Upon completion of the survey, final review, and certification on the final page, transmit the survey via e-mail to: [email protected]. To arrange for the completed survey to be delivered on CD-ROM or DVD disc by private carrier, contact BIS survey staff.
F.	Questions related to this Excel survey should be directed to: [email protected]. (E-mail is the preferred method of contact). You may also speak with a member of BIS survey support staff by calling: Stamen Borisson, 202-482-3893; Mark Crawford, 202-482-8239.
G.	For questions related to the overall scope of this Defense Industrial Base assessment, contact: Brad Botwin, Director, Industrial Studies Office of Technology Evaluation, Room 1093 U.S. Department of Commerce 1401 Constitution Avenue, NW Washington, DC 20230 DO NOT submit completed surveys to Mr. Botwin's postal or e-mail address; all surveys must be submitted electronically to [email protected].
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 4: Definitions

Previous Page		Return to Table of Contents							Next Page
Section II: Definitions
Term	Definition
Applied Research	Systematic study to gain knowledge or understanding necessary to determine the means by which a recognized and specific need may be met. This activity includes work leading to the production of useful materials, devices, and systems or methods, including design, development, and improvement of prototypes and new processes.
Authorizing Official	Executive officer of the organization or business unit or other individual who has the authority to execute this survey on behalf of the organization.
Bare Printed Circuit Board	A completed, tested circuit board ready to be populated with components to create a working system.
Basic Research	Systematic, scientific study directed toward greater knowledge or understanding of the fundamental aspects of phenomena and of observable facts.
Board Thickness	The overall thickness of the base material, all conductive material deposited thereon, and solder mask.
Commercial and Government Entity (CAGE) Code	Commercial and Government Entity (CAGE) Code identifies companies doing or wishing to do business with the U.S. Federal Government. The code is used to support mechanized government systems and provides a standardized method of identifying a given facility at a specific location. Find CAGE codes at http://www.logisticsinformationservice.dla.mil/BINCS/begin_search.aspx.
Commercially Sensitive Information (CSI)	Privileged or proprietary information which, if compromised through alteration, corruption, loss, misuse, or unauthorized disclosure, could cause serious harm to the organization owning it.
Customer	Any organization (external or internal entity) for which your company manufactures bare circuit board products.
Data Universal Numbering System (DUNS)	A nine-digit numbering system that uniquely identifies an individual business. Find DUNS numbers at http://fedgov.dnb.com/webform.
Export Controls	1) Regulations administered by the Bureau of Industry and Security (BIS), U.S. Department of Commerce governing the export of dual-use technologies; 2) International Traffic in Arms Regulations (ITAR) administered by the U.S. Department of State governing products and services provided specifically for defense applications.
External Cloud Service Provider	A service model in which a company employs an external third-party service provider to maintain, manage, and back up business data at a remote location away from the company's operating facilities. The use of shared third-party storage infrastructure by businesses can reduce capital, operations, storage, and security requirements, significantly lowering costs. Data is transmitted between the company and the cloud service provider via networks as needed.
External Data Storage Provider	A business that provides external data storage services to your company for data that is not currently held in your company's main data network work systems.
Flex	A flexible circuit board with printed circuitry on flexible base material consisting of one or more layers
Full Time Equivalent (FTE) Employees	Employees who work for 40 hours in a normal work week. Convert part-time employees into "full time equivalents" by taking their work hours as a fraction of 40 hours.
Microvia	A conductive hole with a diameter of 0.005" or less that connects layers of a multi-layer printed circuit board. Microvias are used in blind and buried vias, but not for through-the-board connections. The term is often used to refer to any small geometry connection holes created by laser drilling.
North American Industry Classification System (NAICS) Code	North American Industry Classification System (NAICS) codes identify the category of product(s) or service(s) provided by an organization. Find NAICS codes at http://www.census.gov/epcd/www/naics.html
Planarization	Planarization is a mechanical sanding/polishing process to create a flat or planar surface across copper conductor on circuit boards.
Pre-Preg	A sheet of base dielectric laminate incorporating reinforcing material (typically glass fabric/mat, or aramid fabric/mat) impregnated with a resin cured to an intermediate stage (i.e. B-stage resin) where it is not fully cured.
Product/Process Development	Conceptualization and development of a product prior to the production of the product for customers.
Qualified Manufacturers' List (QML)	A list of manufacturers who have had their products examined and tested and who have satisfied all applicable U.S. Department of Defense qualification requirements for that product.
Qualifed Products List (QPL)	A list of products, or family of products, that have met the qualification requirements set forth in the applicable specification, including appropriate product identification, tests or qualification reference, and the name and plant address of the manufacturer and authorized distributor.
Rigid	A rigid circuit board composed of resin and reinforcing material such as fiberglass that contains an electric conductor in a defined path to connect with devices and terminal connectors.
Rigid-Flex	One or more rigid circuit boards connected by a to a flexible circuit board.
Service	An intangible product (contrasted to a good, which is a tangible product). Services typically cannot be stored or transported, are instantly perishable, and come into existence at the time they are bought and consumed.
Single Source	An organization that is designated as the only accepted source for the supply of parts, components, materials, or services, even though other sources with equivalent technical know-how and production capability may exist.
Sole Source	An organization that is the only source for the supply of parts, components, materials, or services. No alternative U.S. or non-U.S. based suppliers exist other than the current supplier.
Supplier	An entity from which your organization obtains inputs. A supplier may be another firm with which you have a contractual relationship, or it may be another facility owned by the same parent organization. The inputs may be goods or services.
United States	The "United States" or "U.S." includes the 50 states, Puerto Rico, the District of Columbia, the island of Guam, the Trust Territories, and the U.S. Virgin Islands.
Via	A plated feed-through hole that is used to route a trace vertically in the board from one layer to another. Vias are not used as connecting devices for component leads or for anchoring reinforcing material.
Via Structure	A description of vias (including microvias) incorporated in a multilayer circuit board product.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 5: Respondent Profile

Previous Page			Return to Table of Contents				Next Page
Section III Respondent Profile
A.	Select the description that best identifies your organization:
B.					Design Capability	Manufacture Capability	Assembly Capability
	What capabilities does this facility have related to the production of bare printed circuit boards?
If your organization has multiple facilities in the United States that manufacture bare printed circuit boards you must provide separate survey responses for each facility. Indicate at right the description that best describes your organization's circuit board manufacturing structure. 1. Organization has a single facility in the U.S. 2. Organization has multiple facilities, but only one bare circuit board manufacturing facility in the U.S. 3. Organization has multiple facilities in the U.S. with bare circuit board manufacturing capabilities.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 6: 1a

Previous Page				Return to Table of Contents					Next Page
Section 1a: Organization Information
A.	Provide the following information for this facility.
	Facility/Organization Name
	Street Address
	City
	State
	Zip Code
	Website
	Phone Number
	Primary CAGE Code
B.	Provide the following information for your parent organization(s), if applicable.
				Parent Organization
	Parent Name
	Street Address
	City
	State/Province
	Country
	Postal Code/Zip Code
	Parent Primary CAGE Code
C.	Is your organization publicly traded or privately held?					If your organization is publicly traded, identify its stock ticker symbol.
D.	Point of Contact regarding this survey:
	Name			Title	Phone Number		E-mail Address		State
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 7: 1b

Previous Page			Return to Table of Contents					Next Page
Section 1b: Organization Information (Cont.)
A.	Identify and rank in descending order all entities that directly or indirectly own or have beneficial ownership of five percent or more of your organization (including parent companies and others):
	Entity Name			Percent of Company Held	Street Address	City	State/Region	Country
C.	Please provide the following identification codes (see definitions), as applicable, to this facility.
	Data Universal Numbering System (DUNS) Code(s)				NAICS (6-digit) Code(s)*
	Find DUNS numbers at:				Find NAICS codes at:
	http://fedgov.dnb.com/webform				http://www.census.gov/epcd/www/naics.html
D.	Indicate if your organization qualifies as any of the following types of business:
	1	A small business enterprise (as defined by the Small Business Administration)
	2	8(a) Firm (as defined by the Small Business Administration)
	3	A historically underutilized business zone (HUBZone)
	4	A minority-owned business
	5	A woman-owned business
	6	A veteran-owned or service-disabled veteran-owned business
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 8: 1c

Previous Page			Return to Table of Contents					Next Page
Section 1c: Organization Information (continued)
A.	Estimate the percentage of this facility's bare printed circuit board sales attributable to COMMERCIAL end uses:
	Estimate the percentage of this facility's bare printed circuit board sales attributable to DEFENSE end uses:
Commercial Market Segments
B.	From the list below, estimate the percentage of this facility's bare circuit board sales attributable to each COMMERCIAL end use.
	Commercial End Use			% of Bare Circuit Board Sales	Commercial End Use			% of Bare Circuit Board Sales
	Aerospace				Industrial Electronics
	Automotive				Medical/Healthcare
	Communications				Marine (surface and underwater)
	Computers/Business Equipment				Space
	Consumer Goods				Other	(specify here)
Defense Market Segments
C.	From the list below, estimate the percentage of this facility's bare circuit board sales attributable to each DEFENSE end use.
	Defense End Use			% of Bare Circuit Board Sales	Defense End Use			% of Bare Circuit Board Sales
	Aerospace				Missiles
	Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR)				Marine (surface and underwater)
	Electronics				Space
	Ground Vehicles				Other	(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 9: 2

Previous Page				Return to Table of Contents							Next Page
Section 2: Mergers, Acquisitions, Divestitures, and Joint Ventures
A.	Mergers, Acquisitions, Divestitures
	How many mergers, acquisitions, and divestitures has your organization had since 2012?
	Identify and describe your organization's five most recent mergers, acquisitions, and divestitures, if applicable.
	Organization Name			Type of Activity	Country	Year	Primary Objective				Explain
	1.
	2.
	3.
	4.
	5.
B.	Joint Ventures
	How many joint ventures does your organization currently participate in?
	Identify your organization's current joint venture relationships, including public/private R&D partnerships. Be sure to provide a description of the joint venture's purpose (e.g. patent licensing, co-production, product integration, after-market support, etc.):
	Organization/Entity Name			Country		Year Initiated	Primary Purpose of Relationship				Explain
	1.
	2.
	3.
	4.
	5.
	6.
	7.
	8.
	9.
	10.
	11.
	12.
	13.
	14.
	15.
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 10: 3a

Previous Page			Return to Table of Contents			Next Page
Section 3a: Customers
A.	Select the primary method this facility uses to find business opportunities with the U.S. Government:
	Explain:
B.	Since 2012 has this facility rejected business opportunities due to any of the following?
			Yes/No	Explain
	Circuit board panel production run too small
	Insufficient order frequency
	Insufficient dollar value of job
	Insufficient dollar value of recurring business opportunity
	Complexity of job
	Customer credit rating
	Additional work not needed
	Other criteria	(specify here)
C.	Identify this facility's top 5 U.S. and top 5 non-U.S. direct customers by sales for the past four years. A direct customer is the immediate entity to which you sell your products/services. Customers can include other business units/divisions within your parent organization. Indicate the type of customer and their location.
Top U.S.-Based Customers
Customer Name			Type of Customer	Primary End Use	Customer City	Customer State
1.
2.
3.
4.
5.
Top Non-U.S.-Based Customers
Customer Name			Type of Customer	Primary End Use	Customer City	Customer Country
1.
2.
3.
4.
5.
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 11: 3b

Previous Page				Return to Table of Contents							Next Page
Section 3b: Competitors
A.	For each of the following factors, identify whether bare circuit board manufacturers located inside the U.S. or outside the U.S. possess competitive advantages.
	Factor			Location with Advantage	Explain
	Labor Costs
	Environmental Compliance Costs
	Materials Costs
	Equipment Costs
	Building Space Costs
	R&D Costs
	Supply of Skilled Workers
	Export Controls
	Overall Finished Board Price
	Quality
	Performance
	Lead Time
	Reduced Process Variability
	Reduced Cost
	Safety Requirements
	Increased Yield
	Other		(specify here)
	Other		(specify here)
B.	Identify your organization's leading U.S. and non-U.S. competitors in the manufacture of bare circuit boards, and select their primary competitive attribute.
	Top U.S. Competitors
		Competitor Name		State	Primary Competitive Attribute		Explain
	1
	2
	3
	4
	5
	Top Non-U.S. Competitors
		Competitor Name		Country	Primary Competitive Attribute		Explain
	1
	2
	3
	4
	5
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 12: 4a

Previous Page			Return to Table of Contents					Next Page
Section 4a: Participation in USG Programs
USG Agency Support
A.	From the list of USG agencies below, select those this facility supports or has supported since 2012. If you support an agency that is not listed, identify it in an "Other" box.
	U.S. Air Force		Department of Homeland Security (DHS)		Other	(select from dropdown)
	U.S. Army		National Aeronautics & Space Administration (NASA)		Other	(select from dropdown)
	U.S. Navy		National Oceanic & Atmospheric Administration (NOAA)		Other	(select from dropdown)
	U.S. Marine Corps		Department of Energy (DOE)		Other	(specify here)
	U.S. Intelligence Community (such as CIA, NGA, NRO, NSA)		Missile Defense Agency (MDA)		Other	(specify here)
USG Program Identification
B.	Estimate the total number of USG programs this facility has directly or indirectly supported since 2012.
	Identify the USG programs this facility has supported since 2012, and indicate which types of bare circuit boards this facility has manufactured for each program.
	USG Program Name		U.S. Government Agency		Bare Circuit Board Types Supporting USG Program
					Rigid		Flex	Rigid-Flex
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 13: 4b

Previous Page			Return to Table of Contents					Next Page
Section 4b: USG Interactions
A.	Does this facility consider itself dependent on U.S. Government programs for its continued viability?
	Explain
	If this facility's bare circuit board manufacturing supports USG programs, whether directly or indirectly, are the associated manufacturing lines integrated with, or separate from, its commercial manufacturing lines?
	Explain
B.	From the list below, select impacts that a sudden change in direct and/or indirect U.S. Government defense demand for electronic products containing bare circuit boards would likely have on your organization and provide an explanation where applicable:
	Business Operation			Impact of sudden DECREASE in USG Defense Demand	Impact of sudden INCREASE in USG Defense Demand	Explanation
	Capital Expenditures
	Research & Development Expenditures
	Participation in USG Contracts
	Product/Service Costs
	Organization Viability/Solvency
	Personnel with Key Skills
	Number of Product/Service Lines
	Pursuit of Non-U.S. Customers
	Level of Key Production Equipment
	Movement of Operations to Non-U.S. locations
	Other	(specify here)
	Other	(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 14: 5a

Previous Page					Return to Table of Contents						Next Page
Section 5a: Manufacturing Capabilities
A.	Identify the types of bare circuit boards that this facility is currently capable of manufacturing:
								Tin-Lead		Lead-Free
	Rigid Conventional Board (single-sided or double-sided)
	Rigid Multilayer Board
	Rigid High Speed Boards
	Rigid High Frequency Boards
	Rigid Microwave Boards
	Flexible Conventional Board (single-sided or double-sided)
	Flexible Multilayer Board
	Flexible High Speed Boards
	Flexible High Frequency Boards
	Flexible Microwave Boards
	Rigid-Flex Hybrid Boards
	Integrated Circuit Package Substrates
B.	What is the minimum inner layer (core) thickness of circuit board components that this facility can produce?						What is the maximum bare circuit board thickness that this facility can achieve?
C.	Does this facility manufacture printed electronics (PE)?					"Printed Electronics" refers to the use of additive printing methods on flexible substrates such as plastic, paper, epoxy-fiberglass, textiles, and other electronic devices such as discrete electronic component, sensors, and others.
	If yes, identify the PE business activities this facility engages in:						Explain:
	If yes, identify the PE business sectors this facility supports:						Explain:
D.	For each type of bare circuit board layer listed below, identify this facility's standard and minimum trace widths, based on specified copper conductor weights:
				Trace Width (in inches)
				0.25 oz copper	0.5 oz copper	1 oz copper	2 oz copper	3-5 oz copper	6-10 oz copper	10+ oz copper
	External Layer: Standard
	External Layer: Minimum
	Internal Layer: Standard
	Internal Layer: Minimum
E.	For each type of bare circuit board layer listed below, identify this facility's standard and minimum space widths, based on specified copper conductor weights:
				Space Width (in inches)
				0.25 oz copper	0.5 oz copper	1 oz copper	2 oz copper	3-5 oz copper	6-10 oz copper	10+ oz copper
	External Layer: Standard
	External Layer: Minimum
	Internal Layer: Standard
	Internal Layer: Minimum
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 15: 5b

Previous Page

Return to Table of Contents

Next Page

Section 5b: Manufacturing Capabilities (cont.)

A.

Identify the bare circuit board manufacturing processes that this facility is capable of employing:

Process

Capable of Using

Currently Use

Process

Capable of Using

Currently Use

Photo imaging

Thermal management structures

Direct imaging

Automated electroless copper plating

Screen printing

Automated electrolytic copper plating

Controlled drilling/milling

Direct metallization plating

Laser ablation

Hot air solder level tin-lead

Fully additive plating

Hot air solder level lead-free

Z-axis interconnect technology

LPI solder mask

Embedded devices (e.g. resistors, capacitors, etc.)

Dry film solder mask

Opto-electronic structures

Other

(specify here)

B.

Identify this facility's maximum capability for each of the following bare circuit board production factors:

Factor

Maximum per Board

Explanation

Circuit layers

Sequential laminations

Impedance structures

Stacked micro vias

Staggered micro vias

C.

Identify where the bare circuit board via fill and planarization manufacturing activities are performed for this facility:

-Yes/No-

Process Method

Explanation

This facility

Other company-owned U.S. facilities

Other company-owned non-U.S. facilities

Contractor-operated U.S. facilities

Contractor-operated non-U.S. facilities

D.

Identify which of following processes associated with via structures this facility is capable of performing:

Via Formation

-Yes/No-

Via Formation

-Yes/No-

Drilling Process

Maximum aspect ratio

Etchback

Plasma etch

Laser-formed micro via

Chemical smear removal

Laser via formation

Mechanically drilled via: through-board

Micro-via solid copper fill

Nonconductive via fill

Mechanically drilled via: controlled-depth

Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 16: 5c

Previous Page			Return to Table of Contents					Next Page
Section 5c: Manufacturing Standards
A.	Identify the standards that this facility currently employs and indicate whether you have a formal certification or apply the standards informally.
	Standard		Use	Explain
	MIL-PRF 55110
	MIL-PRF 50884
	MIL-PRF 31032
	ISO 9001
	AS 9100
	NADCAP
	IPC 1071
	IPC 6011
	IPC 6012
	IPC 6013
	IPC 6015
	IPC 6016
	IPC 6017
	IPC 6018
	Other	(specify here)
	Other	(specify here)
B.	Does this facility have an active technical review board?
	Explain:
C.	Identify the primary final circuit board inspection method this facility uses to assure that manufactured products meet performance requirements.					Are first article inspection capabilities at this facility compliant with AS 9102?
	Explain:
D.	Identify the forms of testing that this facility uses in manufacturing to assure performance and adherence to operational requirements.
	Testing Form			-Yes/No-	Testing Form			-Yes/No-
	Flying Probe				Impedance Testing with Plots
	Bed-of-Nails				Interconnect Stress Testing (IST)
	Isolation 250 Volts DC, 100 MegaOhm Minimum				Highly Accelerated Stress Testing (HAST)
	Continuity 10 Volts DC, 10 Ohm Maximum				Highly Accelerated Life Testing (HALT)
	Test all end points, no phase testing				Highly Accelerated Thermal Shock (HATS)
E.	Does this facility use Statistical Process Control with TrueChem or equivalent software specifically to control and automate the management of chemistries, coatings, and associated circuit board production processes?
	Does this facility employ Material Requirements Planning (MRP) software in the operation of its circuit board manufacturing facilities in the U.S.?
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 17: 5d

Previous Page				Return to Table of Contents						Next Page
Section 5d: Manufacturing Production & Capacity
A.	For each of the years 2012-2015 estimate the average weekly number of inner layers (cores) and completed circuit board panels that this facility manufactured:
	Inner Layer (Core): A sheet of copper clad dielectric with one or both sides bearing circuit patterns. Panel: (1) a double-sided or single-sided rigid structure (double-sided or single-sided panel) or (2) two or more inner cores laminated together forming a multilayered, rigid structure (multilayer panel).
							2012	2013	2014	2015
	Average Weekly Inner Layers (Cores) Manufactured
	Average Weekly Panels Manufactured
B.	Identify the bare circuit board panel sizes that this facility can produce with its current manufacturing equipment:
	Panel Size:		24x36	24x30	21x24	18x24	12x24	12x18	9x12	Other
	Capability:
	Explain:
C.	Estimate the 2015 rated weekly manufacturing capacity of this facility in units:								Inner Layers (Cores)	Panels
D.	How many 8-hour production shifts does this facility typically operate per day?
	How many 8-hour production shifts per day COULD this facility operate practically?
	How many 8-hour front-end engineering shifts does this facility typically operate per day?
	How many 8-hour front-end engineering shifts perd day COULD this facility operate practically?
	Explain:
E.	Estimate this facility's average manufacturing utilization rate for each of the years 2012-2015, as a percentage of production possible under a 7 day-per-week, 24-hour-per-day operation. Note: a 100% utilization rate equals full operation with no downtime beyond that necessary for maintenance
	Examples: Assuming little maintenance downtime, one 8-hour shift, 5 days per week is approximately 25% capacity utilization; two 8-hour shifts, 7 days per week is approximately 65% capacity utilization.						2012	2013	2014	2015
F.	Estimate how many weeks it would take to raise this facility's production from current levels to 100% capacity utilization: If this facility already operates at 100% capacity utilization, respond with a "0".
	Estimate how many weeks it would take to raise this facility's production from current levels to 150% of your current capacity utilization:
	Explain:
G.	Identify which of the factors below would limit this facility's ability to raise its bare circuit board manufacturing utilization rate to 100% (maximum current capacity) and to 150% (50% increase from current maximum capacity) to meet a surge in demand.
	Factor				Scenario:		Explanation
					100%	150%
	1	Amount of equipment
	2	Availability of equipment
	3	Manufacturing space
	4	Availability or cost of workforce
	5	Quality control
	6	Availability of input materials
	7	Other (specify in explanation)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 18: 5e

Previous Page			Return to Table of Contents						Next Page
Section 5e: Manufacturing Production & Capacity (continued)
A.	How does this facility anticipate the range of bare circuit board product lines it manufactures will change by 2020?
	Board Type		Anticipated Change	Explain
	Rigid Conventional Board (single-sided or double-sided)
	Rigid Multilayer Board
	Rigid High Speed Boards
	Rigid High Frequency Boards
	Rigid Microwave Boards
	Flexible Conventional Board (single-sided or double-sided)
	Flexible Multilayer Board
	Flexible High Speed Boards
	Flexible High Frequency Boards
	Flexible Microwave Boards
	Rigid-Flex Hybrid Boards
	Integrated Circuit Package Substrates
B.	How does this facility anticipate it's front-end engineering processing capabilities will change by 2020?
	End Use		Anticipated Change	Explain
	Commercial
	Defense
C.	1	Does this facility have its own staff on site to perform front-end engineering for manufacturing bare circuit boards?
	2	Does this facility perform front-end engineering for manufacturing bare circuit boards as a service to other companies that may have bare circuit boards manufactured elsewhere?
	3	Does this facility outsource any front-end engineering for bare circuit board products manufactured at this facility?
		If yes, does your company notify customers in advance that it outsources front-end engineering for manufacturing bare circuit boards?
		If this facility outsources front-end engineering for bare circuit board products, indicate the country or countries (including the United States) to which this service is outsourced:
		End Use	-Yes/No-	Country 1		Country 2		Country 3
		Commercial
		Defense
D.	Identify the three biggest factors causing production bottlenecks at this facility.
	1			Explain:
	2			Explain:
	3			Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 19: 6a

Previous Page			Return to Table of Contents									Next Page
Section 6a: Materials & Equipment
A.	For each of the inputs below, state whether you have experienced sourcing problems and identify the principal manufacturers of each material that this facility uses in manufacturing bare circuit boards.
	Material			Total Number of Manufacturers Used	Sourcing Problems			Manufacturers
					Availability is a Concern	Experienced Supply Chain Disruptions Since 2012		Two Principal Manufacturer Names		Country of Manufacture
	Laminate for use in rigid conventional boards							1
								2
	Laminate for use in rigid multilayer boards							1
								2
	Laminate for use in rigid high speed, high frequency, and microwave boards							1
								2
	Laminate for use in flex boards							1
								2
	Laminate for use in rigid-flex boards							1
								2
	Copper foil							1
								2
	Other foils							1
								2
	Embedded passives, formed, resistors, and capacitors (active or passive) - tin-lead							1
								2
	Embedded passives, formed, resistors, and capacitors (active or passive) - lead free							1
								2
	Through-hole and via preparation for plating material							1
								2
	Electrolytic plating material							1
								2
	Via fill, conductive, and non-conductive material							1
								2
	Solder mask							1
								2
	Finish materials							1
								2
	Solder							1
								2
	Etchant							1
								2
	Drill bits							1
								2
	Other	(specify here)						1
								2
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 20: 6b

Previous Page				Return to Table of Contents					Next Page
Section 6b: Materials & Equipment (continued)
A.	1	If this facility were no longer able to purchase circuit board laminate from your current suppliers, for how many weeks could you continue normal operations?
	2	How many weeks would it take this facility to obtain material from a new supplier of laminate?
	3	Does the reduction in the number of companies in the U.S. that manufacture circuit board laminates and other circuit board-related materials create material supply problems for this facility?
		Explain:
	4	How confident is this facility that it would be able to obtain on a timely basis the material necessary to rapidly ramp up bare circuit board production in the event of a national emergency?
		Explain:
B.	Which statement best describes this facility's general method for maintaining inventory levels of laminate and related materials required for the production of circuit boards?
	Explain:
C.	Does this facility use either of the following practices for assuring the availability of circuit board-related materials?
	1	On-site stocking agreements through which distributors keep a quantity of materials at this facility.
	2	Local stocking agreements through which distributors maintain supply warehouses in close proximity to this facility.
	Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 21: 6c

Previous Page					Return to Table of Contents					Next Page
Section 6c: Materials & Equipment (continued)
A.	From the list below identify how many of each type of equipment this facility has. Then, estimate its average age, and indicate your primary concern about continued/future use of this equipment
	Equipment			Number of Functioning Units On Site	Estimated Average Age (in years)	Primary Concern		Explain
	Photo film processing
	Photo resist application
	Photo resist exposure
	Photo resist exposure-laser
	Photo resist exposure-LED
	Develop etch & strip equipment
	Automatic optical inspection
	Inner layer treatment & layup
	Lamination
	Drilling - mechanical
	Drilling - laser
	Desmear
	Electroless copper
	Electrolytic copper
	Chemical cleaning
	Solder mask
	Final finish
	Legend print
	Routing
	Electrical testing
	Quality control measurement
	Via fill
	Scoring
	Other	(specify here)
	Other	(specify here)
	Other	(specify here)
B.						U.S.	Non-U.S.	Explanation
	Has this facility had trouble obtaining parts for U.S. or non-U.S. equipment?
	Has this facility had trouble obtaining service on U.S. or non-U.S. equipment?
C.	Are there bare circuit board products that this facility is unable to manufacture due to the limitations of installed equipment?						Explain:
	Have you had or do you anticipate having difficulty obtaining new equipment for manufacturing tin-lead bare circuit boards?						Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 22: 6d

Previous Page				Return to Table of Contents				Next Page
Section 6d: Materials & Equipment (continued)
A.	Between 2012 and 2015 did this facility encounter product failures that are suspected or confirmed to be attributed to counterfeit materials used in building bare circuit boards?
		If so, identify the types of circuit board materials that were suspected or confirmed to be counterfeit products and explain the impact of the counterfeit.
		Prepreg			Explain:
		Laminate			Explain:
		Soldermask			Explain:
		Other	(specify here)		Explain:
B.	Does this facility buy materials for the manufacture of bare circuit boards from sources other than the original manufacturer or its authorized distributor?
		If so, what practices do you regularly use to verify that the materials are genuine and perform to specifications?
		Systematic testing of inventory
		Confirm production lots and production dates with the original manufacturer
		Check authenticity of standards organization certification labels/trademarks
		Other	(specify here)
		Other	(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 23: 7

Previous Page

Return to Table of Contents

Next Page

Section 7: Sales

Provide this facility's sales information for the 2012-2015 to U.S. and non-U.S. customers. Note: "U.S." means U.S. domestic sales; "Non-U.S." means export sales from U.S. locations. Government sales include both direct and indirect sales to government customers. All sales with government end uses should be reported as government sales.

Source of Sales Data:

Reporting Schedule:

Record in $ Thousands, e.g. $12,000.00 = survey input $12

2012

2013

2014

2015

Data Confirmation

U.S.

Non-U.S.

U.S.

Non-U.S.

U.S.

Non-U.S.

U.S.

Non-U.S.

Total Listed 2015 Sales

A.

Total Sales (in $)

None

Total Government Sales [as a % of line A]

B

All Circuit Board-Related Sales - including design, manufacture, and assembly (in $)

All Circuit Board-Related Government Sales [as a % of line B]

B

Bare Circuit Board Manufacturing Sales - excluding design and assembly (in $)

Bare Circuit Board Government Sales [as a % of line C]

Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

`

---

Sheet 24: 8

Previous Page			Return to Table of Contents			Next Page
Section 8: Financials
Provide the following financial line items for your facility/organization below. Note: Facility level data is preferred. If you do not keep this information at a location level, provide data at the closest level available.
Source of Income Statement Items:
Reporting Schedule:
Income Statement (Select Line Items)			Record $ in Thousands, e.g. $12,000.00 = survey input of $12					Data Confirmation
			2012	2013	2014	2015		2015 Net Sales
A.	Net Sales (and other revenue)							None
B.	Cost of Goods Sold
C.	Total Operating Income (Loss)
D.	Earnings Before Interest and Taxes
E.	Net Income
Source of Balance Sheet Items:
Reporting Schedule:
Balance Sheet (Select Line Items)			Record $ in Thousands, e.g. $12,000.00 = survey input of $12
			2012	2013	2014	2015
A.	Cash
B.	Inventories
C.	Total Current Assets
D.	Total Assets
E.	Total Current Liabilities
F.	Total Liabilities
G.	Retained Earnings
H.	Total Owner's Equity
Note: Total Assets must equal Total Liabilities plus Total Owner's Equity
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 25: 9a

Previous Page			Return to Table of Contents				Next Page
Section 9a: Research & Development
A.	Does this facility/organization conduct research and development (R&D)?				If No, proceed to Section 10.
In Question B, record this facility's total dollar R&D expenditure and type of R&D expenditure for each of the years 2012 to 2015. In Question C, identify this facility's R&D funding sources, by percent of total R&D dollars sourced. Note: Facility level data is preferred. If you do not keep this information at a facility level, provide data at the closest level available.
Source of R&D Data:
			Reporting Schedule:
B.				Record $ in Thousands, e.g. $12,000.00 = survey input of $12
				2012	2013	2014	2015
	1	Total R&D Expenditures							Data Confirmation
	2	Basic Research (as a percent of B1)							Total 2015 R&D Expenditures
	3	Applied Research (as a percent of B1)							None
	4	Product/Process Development (as a percent of B1)
	5	Total of 2 - 4 (must equal 100%)		0%	0%	0%	0%
	6	Bare Circuit Board R&D Expenditures (as a percent of B1)
	7	Defense-Related Bare Circuit Board R&D Expenditures (as a percent of B1)
C.				Record $ in Thousands, e.g. $12,000.00 = survey input of $12
				2012	2013	2014	2015
	1	Total R&D Funding Sources
	2	Internal/Self-Funded/IRAD (as a percent of C1)
	3	Total Federal Government (as a percent of C1)
	4	Total State and Local Government (as a percent of C1)
	5	Universities - Public and Private (as a percent of C1)
	6	U.S. Industry, Venture Capital, Non-Profit (as a percent of C1)
	7	Non-U.S. Investors (as a percent of C1)
	8	Other	(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 26: 9b

Previous Page				Return to Table of Contents						Next Page
Section 9b: Research & Development (continued)
A.	Identify this facility/organization's anticipated top R&D priorities over the next five years and provide a brief explanation.
		Priority			Description
	1
	2
	3
	4
	5
B.	Identify the key factors driving this facility's investment in research and development and explain how these factors shape this facility's research and development projects.
	Factor			-Yes/No-	Explain
	Need for competitive advantage
	Customer requirements
	Industry roadmap
	Other		(specify here)
	Other		(specify here)
	Other		(specify here)
C.	From 2012-2015, were your organization's R&D expenditures adversely impacted by reductions in U.S. Government defense spending?
	Explain:
D.	Are there specific R&D areas related to bare circuit board manufacturing that DOD could support to improve board performance?
	Explain:
E.	What advanced bare circuit board-related technologies should DOD support in order to better enable manufacturers to meet future national security requirements?
	1			Explain:
	2			Explain:
	3			Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 27: 10

Previous Page			Return to Table of Contents				Next Page
Section 10: Capital Expenditures
Record this facility's capital expenditures corresponding to the select categories below. Note: Facility level data is preferred. If you do not keep this information at a location level, provide data at the closest level available.
Source of Capital Expenditure Data:
Capital Expenditure Reporting Schedule:									Data Confirmation
Capital Expenditure Category				Record $ in Thousands, e.g. $12,000.00 = survey input of $12					Total 2015 Capital Expenditures
				2012	2013	2014	2015
A	Total Capital Expenditures								None
	1	Machinery, Equipment, and Vehicles [as a % of A]
	2	IT, Computers, Software [as a % of A]
	3	Land, Buildings, and Leasehold Improvements [as a % of A]
	4	Other (specify)
	5	Other (specify)
	Lines 1 through 5 must total 100%			0%	0%	0%	0%
	6	Bare circuit board-related capital expenditures [as a % of A]
B	From 2012-2015, were your organization's bare circuit board-related capital expenditures adversely impacted by reductions in U.S. Government defense spending?
	Explain:
C	Identify your facility/organization's anticipated top bare circuit board-related capital expenditure priorities over the next five years and provide a brief explanation.
	Priority			Description
	1
	2
	3
	4
	5
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 28: 11a

Previous Page				Return to Table of Contents						Next Page
Section 11a: Workforce
Record the total number of full time equivalent (FTE) employees in your U.S.-based operations for the 2012-2015 period. Then, estimate the percentage of these employees that perform the occupations indicated in part A, lines a-i Note: Facility level data is preferred. If you do not keep this information at a location level, provide data at the closest level available.
Source of Workforce Data:
Reporting Schedule:
A							2012	2013	2014	2015
	1	Circuit Board-Related Full Time Equivalent (FTE) Employees
		a	Administrative, Management, & Legal Staff [as a % of line 1]
		b	Engineers, Scientists, and R&D Staff [as a % of line 1]
		c	Facility & Maintenance Staff [as a % of line 1]
		d	Information Technology Professionals [as a % of line 1]
		e	Marketing & Sales [as a % of line 1]
		f	Production Line Workers [as a % of line 1]
		g	Testing Operators, Quality Control, and Support Technicians [as a % of line 1]
		h	Other	(specify here)
		i	Other	(specify here)
		Lines a through i must total 100%					0%	0%	0%	0%
B	Does this facility have difficulty hiring and/or retaining any types of employees? If yes, identify which occupations, type of difficulty, and provide an explanation.
	Occupation			Difficulty		Explanation
	Chemist
	Chemical Engineer
	Electrical Engineer
	Mechanical Engineer
	Industrial Engineer
	Safety Engineer
	Graphic Arts Engineer
	Process Engineer
	Product Engineer
	CAM Software - Job Tooling Tech
	Imaging Tech
	Silk Screening Tech
	Plating Tech
	Electrical Testing Tech
	Mechanical Drilling Tech
	Laser Drilling Tech
	Testing Tech
	Other		(specify here)
C	Identify the key workforce issues you anticipate in the next five years.
	Issue				-Yes/No-	Explanation
	Finding U.S. citizens
	Finding qualified workers
	Finding experienced workers
	Finding workers able to get security clearances
	Attracting workers to location
	Significant portion of workforce retiring
	Employee turnover
	Other		(specify here)
	Other		(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 29: 11b

Previous Page				Return to Table of Contents							Next Page
Section 11b: Workforce (continued)
A.	What percentage of this facility's technical staff do you expect to retire within the next five years?
	What percentage of this facility's technical staff do you expect to have to replace over the next five years?
	Explain:
B	First, estimate the total number of employees you have with each level of work experience and estimate the percentage that are U.S. citizens. Then, for each technical role, estimate the number of employees you have with each level of work experience.
				Applicable Working Experience
				Over 20 Years		11-20 Years		6-10 Years		Five or Fewer Years
	All Employees		# of Employees
			% U.S. Citizens
	Note: Double counting is permitted for this section. For example, if an employee serves as both a mechanical drilling tech and a laser drilling tech, she would be included in both lines.
				# of Employees		# of Employees		# of Employees		# of Employees
	Chemist
	Chemical Engineer
	Electrical Engineer
	Mechanical Engineer
	Industrial Engineer
	Safety Engineer
	Graphic Arts Engineer
	Process Engineer
	Product Engineer
	CAM Software - Job Tooling Tech
	Imaging Tech
	Silk Screening Tech
	Plating Tech
	Electrical Testing Tech
	Mechanical Drilling Tech
	Laser Drilling Tech
	Testing Tech
	Other		(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 30: 12a

Previous Page				Return to Table of Contents					Next Page
Section 12a: Competitive Factors
A.	What is the primary, if any, significant change in operations that is expected at this facility in the next five years?
	Explain:
B.	1	Have recent changes in environmental control regulations adversely affected this facility's capability to compete against circuit board manufacturers in other countries?
		Explain:
	2	Will environmental regulations force this facility to cease manufacturing tin-lead circuit boards?
		If yes, what year is this facility expected to cease producing tin-lead circuit boards?			Comments:
	3	Do environmental regulations cause this facility to keep smaller quantities of circuit board manufacturing materials in inventory than what you might otherwise consider optimal?
		Explain:
C.	Indicate whether the following factors affect this facility's interest in USG business.
	Factor			Reduce Interest in USG Business	May Cause Facility to Stop Producing for USG	Explain
	Paperwork/Requirements
	Slow Payment
	Small Production Lots
	Insufficient Profit Margin
	Infrequent Orders
	Intellectual Property Protection
	One-off orders
	Other		(specify here)
D.	Indicate how DOD requirements to use MIL-PRF-31032 standards affect your costs relative to other existing standards?
				Estimated Change Relative to MIL-P-50884C	Estimated Change Relative to IPC-6012 Class 3	Explain
	Direct change in fixed costs per slash sheet
	Change in recurring costs for maintenance
	Added administrative cost of compliance
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 31: 12b

Previous Page			Return to Table of Contents					Next Page
Section 12b: Competitive Factors (continued)
A.	To what extent is this facility's continued ability to manufacture bare circuit boards for USG customers dependent on the viability of your commercial circuit board business?
	Explain
	To what extent is this facility's continued ability to manufacture bare circuit boards for commercial customers dependent on the viability of your USG business?
	Explain
	Is the return-on-investment (ROI) associated with this facility's DEFENSE-RELATED bare circuit board manufacturing business sufficient relative to capital requirements and business risk?
	Is the return-on-investment (ROI) associated with this facility's COMMERCIAL bare circuit board manufacturing business sufficient relative to capital requirements and business risk?
	Explain
B.	What level of overall industry consolidation do you expect to occur in the U.S. bare circuit board industry in the next five years?
	What two key factors do you see driving such a consolidation?
	Explain:
	What level of foreign acquisition of U.S. bare circuit board manufacturers do you expect in the next five years?
	Explain:
C.	Which of the following impacts do you anticipate from consolidation in the number of U.S. bare circuit board manufacturing facilities?
	Impact		-Yes/No-	Explain
	Fewer U.S. materials manufacturers
	Greater dependence on non-U.S. materials
	Higher material costs
	Pricing advantage for larger board manufacturers
	Small companies less able to compete
	Reduced domestic board capability
	Shrinkage in manufacturing workforce
	Increased market share for non-U.S. companies
	Higher prices for bare board customers
	Other
	Other
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 32: 12c

Previous Page			Return to Table of Contents					Next Page
Section 12c: Competitive Factors (continued)
A.	What impact would each of the following potential USG actions have on your business?
	Action			Expected Impact on Organization	Explanation
	Increased funding of targeted bare circuit board manufacturing technology R&D
	DOD requirement that electronic systems (not ITAR controlled) use circuit boards made in manufacturing facilities located in the U.S.
	DOD adds circuit board laminate and related materials to the Defense National Stockpile
	USG requirement that circuit boards produced for critical systems be manufactured with laminate and related materials made in the U.S.
	DOD requirement for designated types of defense systems to use bare circuit boards manufactured in the U.S. by certified "trusted" suppliers
	DOD requirement that bare circuit board manufacturers of products for designated defense systems be registered on the Qualified Manufacturers List (QML) and/or Qualified Products List (QPL)
	Other	(specify here)
	Other	(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 33: 13a

Previous Page			Return to Table of Contents				Next Page
Section 13a: Cyber Security
A.	Does your organization's internal network connect to the Internet?					Internal Network (drop-down)
B.	Indicate who is responsible for your organization's internal IT networks:
	Indicate who is responsible for your organization's external IT networks:
C.	Does this facility have defined, structured methods for actively protecting the following types of Commercially Sensitive Information (see definitions)?
	Commercially Sensitive Information (CSI) Type			-Yes/No-	Explanation
	Customer/client information
	Financial information and records
	Human resources information/employee data
	Information subject to export control regulations (EAR and/or ITAR)
	Intellectual property related information
	Internal communications including negotiation points, merger and acquisition plans, and/or corporate strategy
	Manufacturing and production line information
	Patent and trademark information
	Regulatory/compliance information
	Research and development (R&D) related information
	Supply chain and sourcing information
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 34: 13b

Previous Page			Return to Table of Contents					Next Page
Section 13b: Cyber Security (continued)
A.	Have recent cyber incidents across the marketplace caused your organization to increase its information security budget?
B.	Estimate the percentage of your organization's commercially sensitive information that is stored with:						External Cloud Service Providers
							External Data Storage Providers
	Does your organization restrict or prohibit your external cloud service or external data storage provider(s) from storing commercially sensitive information outside of the U.S.?
C.	Indicate the level of impact each of the following types of events attributed to malicious cyber activity has had on this facility since 2012.
	Event				Impact Level	Explanation
	User idle time and lost productivity because of downtime or systems performance delays
	Disruption to normal operations because of system availability problems
	Damage or theft of IT assets and infrastructure
	Incurred cost of damage assessment and remediation
	Business interruption
	Exfiltration of CSI data
	Theft of personnel information
	Damage to software and/or source code
	Theft of software and/or source code
	Damage to company production capabilities or systems
	Destruction of information asset
	Reputation loss, market share, and brand damages
	Other		(specify here)
	Other		(specify here)
	Other		(specify here)
Note: The FBI encourages recipients to report information concerning suspicious or criminal activity to their local FBI field office or the FBI's 24/7 Cyber Watch (CyWatch). Field office contacts can be identified at http://www.fbi.gov/contact-us/field. CyWatch can be contacted by phone at 855-292-3937 or e-mail at [email protected]. When available, each report submitted should include the date, time, location, type of activity, number of people, and type of equipment used for the activity, the name of the submitting company or organization, and a designated point of contact.
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 35: 14

Previous Page			Return to Table of Contents				Next Page
Section 14: Challenges and Outreach
A.	Identify the issues that have or are expected to impact this facility. In column A, identify all issues that currently are affecting your business in an adverse way or that are expected to do so in the future. In column B, rank your top five issues (one being the most important) by selecting numbers one through five, using each rank exactly once. In column C, provide an explanation for the relevant issues.
	Type of Issue			A	B	C
				Impact	Rank Top 5	Explanation
	Aging equipment, facilities, or infrastructure
	Aging workforce
	Competition - domestic
	Competition - foreign
	Counterfeit parts
	Cyber security
	Environmental regulations/remediation - domestic
	Environmental regulations/remediation - foreign
	Export controls/ITAR & EAR
	Government acquisition process
	Government purchasing volatility
	Government regulatory burden
	Healthcare costs
	Health and safety regulations
	Intellectual property/patent infringement
	Labor availability/costs
	Material input availability
	Obsolescence
	Pension costs
	Proximity to customers
	Proximity to suppliers
	Qualifications/certifications
	Quality of material inputs
	R&D costs
	Reduction in commercial demand
	Reduction in USG demand
	Taxes
	Worker/skills retention
	Other	(specify here)
B.	There are many federal and state government programs and services available to assist your organization to better compete in the global marketplace. If your organization would like more information regarding these government programs, select the specific areas of interest below. The Commerce Department will follow-up with your organization regarding your selections.
	Continuous Improvement/ Lean Manufacturing			Market Expansion/Business Growth
	Cyber Security			Product Design
	Design for Assembly			Prototyping
	Design for Manufacturability			Quality Management and Control
	Energy and Environmentally Conscious Manufacturing			Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) contracts
	Export Assistance			Supply Chain Optimization
	Export Licensing (ITAR/EAR)			Technology Acceleration
	Government Procurement Guidelines			Vendor/Material Sourcing
	Other	(specify here)		Other	(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

---

Sheet 36: 15

Org ID:

Previous Page

Return to Table of Contents

xx

Section 15: Certification

xx

The undersigned certifies that the information herein supplied in response to this questionnaire is complete and correct to the best of his/her knowledge. It is a criminal offense to willfully make a false statement or representation to any department or agency of the United States Government as to any matter within its jurisdiction (18 U.S.C.A. 1001 (1984 & SUPP. 1197)) Once this survey is complete, submit it via e-mail to: [email protected]. Be sure to retain a copy for your records and to facilitate any necessary edits or clarifications.

Verification Metrics

Facility Name

Organization Name

Sales/Net Sales

Organization's Internet Address

Revenue per Employee

Name of Authorizing Official

Income Progression

Title of Authorizing Official

Cash/Current Assets

E-mail Address

Current/Total Assets

Phone Number and Extension

Current/Total Liabilities

Date Certified

R&D Sources

In the box below, provide any additional comments or any other information you wish to include regarding this survey assessment.

Cyber, Physical Expenditures

xx

How many hours did it take to complete this survey?

Completion Estimate

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act