New Issue Bond Program and Temporary Credit and Liquidity Program Reporting

New Issue Bond Program and Temporary Credit and Liquidity Program

OMB: 1505-0224

IC ID: 211751

Information Collection (IC) Details

View Information Collection (IC)

New Issue Bond Program and Temporary Credit and Liquidity Program Reporting
 
No New
 
Mandatory
 

Document Type Form No. Form Name Instrument File URL Available Electronically? Can Be Submitted Electronically? Electronic Capability
Other-Spreadsheet HFA Initiative Reporting 2014_Revised 5-29-2014.xls Yes No Fillable Fileable

Economic Development Industry Sector Income Stabilization

 

66 0
   
State, Local, and Tribal Governments
 
   0 %

  Approved Program Change Due to New Statute Program Change Due to Agency Discretion Change Due to Adjustment in Agency Estimate Change Due to Potential Violation of the PRA Previously Approved
Annual Number of Responses for this IC 3,098 0 0 3,098 0 0
Annual IC Time Burden (Hours) 4,574 0 0 4,574 0 0
Annual IC Cost Burden (Dollars) 0 0 0 0 0 0

Title Document Date Uploaded
#1505-0224 Summary of Burden 1505-0224_Burden_Summary_29May2014 Final.xlsx 05/29/2014
            Blank fields in records indicate information that was not collected or not collected electronically prior to July 2006.

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