Integrated Circuit Design and Fabrication Capability

National Security and Critical Technology Assessments of the US Industrial Base

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Integrated Circuit Design and Fabrication Capability

OMB: 0694-0119

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OMB Control Number: TKTK-TKTK
Expiration Date: Month/Date/Year
DEFENSE INDUSTRIAL BASE ASSESSMENT: THE U.S. INTEGRATED CIRCUIT DESIGN AND MANUFACTURING INDUSTRY

SCOPE OF ASSESSMENT
The U.S. Department of Commerce, Bureau of Industry and Security (BIS), Office of Technology Evaluation (OTE), is conducting a survey and assessment of the health and
competitiveness of the U.S. design and manufacturing infrastructure available for producing Integrated Circuit products required for meeting U.S. national security needs.
The goal of this study is to provide decision makers in the U.S. Departments of Defense, Energy, Justice, Homeland Security, and other Executive Branch agencies with
detailed information on (1) the health and status of Integrated Circuit design and manufacturing capabilities remaining in the United States; and (2) the outlook for
maintaining these activities in the future. The scope of this effort encompasses Integrated Circuit design and manufacturing resources, including the supply chain.
RESPONSE TO THIS SURVEY IS REQUIRED BY LAW
A response to this survey is required by law (50 U.S.C. App. Sec. 2155). Failure to respond can result in a maximum fine of $10,000, imprisonment of up to one year, or
both. Information furnished herewith is deemed confidential and will not be published or disclosed except in accordance with Section 705 of the Defense Production Act of
1950, as amended (50 U.S.C App. Sec. 2155). Section 705 prohibits the publication or disclosure of this information unless the President determines that its withholding is
contrary to the national defense. Information will not be shared with any non-government entity, other than in aggregate form. The information will be protected pursuant to
the appropriate exemptions from disclosure under the Freedom of Information Act (FOIA), should it be the subject of a FOIA request.
Notwithstanding any other provision of law, no person is required to respond to nor shall a person be subject to a penalty for failure to comply with a collection of information
subject to the requirements of the Paperwork Reduction Act unless that collection of information displays a currently valid OMB Control Number.
BURDEN ESTIMATE AND REQUEST FOR COMMENT
Public reporting burden for this collection of information is estimated to average 14 hours per response, including the time for reviewing instructions, searching existing data
sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any
other aspect of this collection of information to BIS Information Collection Officer, Room 6883, Bureau of Industry and Security, U.S. Department of Commerce, Washington,
D.C. 20230, and to the Office of Management and Budget, Paperwork Reduction Project (OMB Control No. TKTK-TKTK), Washington, D.C. 20503.

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

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Table of Contents
Table of Contents

Cover Page
Table of Contents
General Instructions
Definitions
Reporting Level
Organization Information
Integrated Circuit Design and Manufacturing
Rad Tolerant, Rad Hardened, Neutron Hardened IC Design & Manufacturing
Wafer Starts and Mask Production
Packaging
Software - On-Die Input/Output & Bit Cell and Memory
Performance of Design and Manufacturing Functions and Outsourcing
National Security Requirements
Materials and Equipment
Workforce
Sales
Financials
Mergers & Acquisitions, JVs
CAPEX
R&D
Export Controls
Trade and Intellectual Property
Competitiveness
Cybersecurity
Certification
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

Previous Page
Section I: General Instructions

Return to Table of Contents

Your organization is required to complete this survey of the U.S. Integrated Circuit industry using an Excel template, which can be
downloaded from the BIS website: http://bis.doc.gov/chipsurvey
A.

If you are not able to download the survey document, at your request BIS, staff will e-mail the Excel survey template directly to you.
For your convenience, a PDF version of the survey and required drop-down content is available on the BIS website to aid internal data
collection. DO NOT SUBMIT the PDF version of the survey as your response to BIS. Should this occur, your organization will be required
to resubmit the survey in the requested Excel format.
Respond to every question. Surveys that are not fully completed will be returned for completion. Use the comment boxes to provide any
information to supplement responses provided in the survey form. Make sure to record a complete answer in the cell provided, even if
the cell does not appear to expand to fit all the information.

DO NOT CUT AND PASTE RESPONSES WITHIN THIS SURVEY.
Survey inputs should be completed by typing in responses or by use of a drop-down menu. The use of cut and paste can corrupt the
survey template. If your survey response is corrupted as a result of cut and paste responses, a new survey will be sent to your
organization for immediate completion.

Do not disclose any classified information in this survey form.

Estimates are sometimes acceptable where indicated, but in sections that do not explicitly allow estimates you must contact BIS survey
support staff before including estimates.

Upon completion of the survey, final review, and certification, transmit the survey document via e-mail to: [email protected]

Questions related to the survey should be directed to BIS survey support staff at [email protected] (E-mail is the preferred method
of contact).
You may also speak with a member of the BIS survey support staff by calling (202) 482-6339
For questions related to the overall scope of this Industrial Base assessment, contact:

Brad Botwin, Director, Industrial Studies
Office of Technology Evaluation, Room 1093
U.S. Department of Commerce
1401 Constitution Avenue, NW
Washington, DC 20230
DO NOT submit completed surveys to Mr. Botwin's postal or e-mail address; all surveys must be submitted electronically to XXX

BUSINESS CONFIDENTIAL - Per Section 705(d)
of the Defense Production Act
3

OMB 0694-0119 ROCIS Submission
Previous Page
Section II: Definitions

Return to Table of Contents

Definition

Term

Applied Research

Systematic study to gain knowledge or understanding necessary to determine the means by which a recognized
and specific need may be met. This activity includes work leading to the production of useful materials, devices,
and systems or methods, including design, development, and improvement of prototypes and new processes.

Authorizing Official

Executive officer of the organization or business unit or other individual who has the authority to execute this
survey on behalf of the organization.

Basic Research

Capability

Systematic, scientific study directed toward greater knowledge or understanding of the fundamental aspects of
phenomena and of observable facts.
The ability to perform defined design and/or manufacturing steps for producing integrated circuit products within an
organization's own facilities and with its own employees with little or no outsourcing.

Investments made by an organization in buildings, equipment, property, and systems where the expense is
depreciated. This does not include expenditures for consumable materials, other operating expenses and salaries
associated with normal business operations.
Commercial and Government Entity (CAGE) Code identifies companies doing or seeking to do business with the
Commercial and Government Entity U.S. Federal Government. The code is used to support mechanized government systems and provides a
standardized method of identifying a given facility at a specific location. Find CAGE codes at
(CAGE) Code
https://cage.dla.mil/search/.
Capital Expenditures

Commercially Sensitive Information Privileged or proprietary information which, if compromised through alteration, corruption, loss, misuse, or
unauthorized disclosure, could cause serious harm to the information's owners.
(CSI)

Customer

An entity to which an organization directly delivers the product or service that the facility produces. A customer may
be another organization or another facility owned by the same parent organization. The customer may be the end
user for the item but often will be an intermediate link in the supply chain, adding additional value before
transferring the item to yet another customer.

Cyber Security

The body of technologies, processes, and practices designed to protect networks, computers, programs, and data
from attack, damage, or unauthorized access.

Data Universal Numbering System A nine-digit numbering system that uniquely identifies an individual business. Find DUNS numbers at
http://fedgov.dnb.com/webform.
(DUNS)
Development

The design, development, simulation, or experimental testing of prototype or experimental hardware or systems, to
validate technological feasibility or concept of operation, to reduce technological risk, or to provide test systems
prior to production approval.

Design

Design activity required to implement a product concept in support of the manufacture of the Integrated Circuit
product at a fabrication facility.

Facility

A facility can constitute a single building or multiple buildings functioning as a unified design, fabrication, or
packaging facility. Design, fabrication, and packing, test and assembly operations must be identified separately.
Individual wafer fabrication facilities serving distinct sets of technology nodes should be identified separately even if
operating on a single campus.

Full Time Equivalent (FTE)
Employees

Employees who work for 40 hours in a normal work week. Convert part-time employees into "full time equivalents"
by taking their work hours as a fraction of 40 hours.

The Harmonized Tariff Schedule (HTS) is the statute used to determine tariff classifications for goods imported in
Harmonized Tariff Schedule (HTS) the United States and maintained and published by the United States International Trade Commission. The HTS is
based on the International Harmonized System.
Integrated Circuit
Location
Manufacturing

Neutron Hardened

North American Industry
Classification System (NAICS)
Code

Organization

Product/Process Development

Radiation Hardened

Analog or digital devices that incorporate transistors, diodes, capacitors, resistors, and other circuit elements that
are integrated on a single substrate (chip), typically silicon.
For the purpose of this survey, a location is a single contiguous site.
The production of a working Integrated Circuit product in a fabrication facility.
Integrated Circuit products incorporating design features and/or physical characteristics that can withstand the
damaging effects of high-speed neutrons, gamma rays, and electromagnetic pulses that accompany a nuclear
weapons detonation. Most CMOS[1] technologies are inherently neutron hardened without any specific effort on
the part of an ICs designer/manufacturer. For “minority carrier” IC devices that are affected by neutron-induced
displacement damage, a level of 1X1014 n/cm2 (1MeV equivalent fluence) is the accepted standard.[2]
North American Industry Classification System (NAICS) codes identify the category of product(s) or service(s)
provided by an organization. Find NAICS codes at http://www.census.gov/epcd/www/naics.html
A company, firm, laboratory, or other entity that owns or controls one or more U.S. establishment capable of
designing and/or manufacturing Integrated Circuit products. A company may be an individual proprietorship,
partnership, joint venture, or corporation (including any subsidiary corporation in which more than 50 percent of the
outstanding voting stock is owned by a business trust, cooperative, trustee(s) in bankruptcy, or receiver(s) under
decree of any court owning or controlling one or more establishment.
Conceptualization and development of a product prior to the production of the product for customers.
Integrated Circuit products incorporating design features and/or physical characteristics that demonstrate a
capability to resist radiation-induced damage from industrial sources, electromagnetic pulses, weapons systems;
and/or charged particles in space that can damage circuitry and render a device inoperable. Some IC devices may
be considered radiation hardened when their total dose failure level exceeds >300 krad.[3] A total dose failure level
of 500krad is the standard cited in International Traffic in Arms (ITAR) regulations.[4]

OMB 0694-0119 ROCIS Submission
Integrated Circuit products incorporating design features and/or physical characteristics with limited capability to
resist radiation induced damage from industrial sources, electromagnetic pulses, industrial sources, weapons
systems, and charged particles in space that can damage circuitry and render a device inoperable. Radiation
tolerant would cover parts having a total dose failure level >100 krad but less than 300 krad.

Radiation Tolerant

Research and Development

Basic and applied research in the engineering sciences, as well as design and development of prototype products
and processes.

Semiconductor

Elemental materials such as silicon and germanium (or compounds like gallium arsenide) that possess levels of
electrical conductivity that are less than a conductor but greater than an insulator. The properties of these
materials and similar ones can be manipulated to affect conductivity through temperature and/or the use of
dopants.

Service

An intangible product (contrasted to a good, which is a tangible product). Services typically cannot be stored or
transported, are instantly perishable, and come into existence at the time they are bought and consumed.

Single-Event Effects Resistant

Single-event effects caused by a single energetic particle striking an Integrated Circuit (IC) device. Performance of
the IC device is not compromised to a point where it is inoperable or not reliable for executing a mission as a result
of latch-up, burnout, or gate rupture.

Single Source

An organization that is designated as the only accepted source for the supply of parts, components, materials, or
services, even though other sources with equivalent technical know-how and production capability may exist.

Sole Source

An organization that is the only source for the supply of parts, components, materials, or services. No alternative
U.S. or non-U.S. based suppliers exist other than the current supplier.

Supplier

An entity from which your organization obtains inputs. A supplier may be another firm with which you have a
contractual relationship, or it may be another facility owned by the same parent organization. The inputs may be
goods or services.

Trusted Access Program

A program implemented by the National Security Agency and the Defense Microelectronics Activity (DMEA) to
qualify Integrated Circuit design and manufacturing companies as “trusted” suppliers of application specific
Integrated Circuit (ASIC) products required for national security applications.

United States

The "United States" or "U.S." includes the 50 states, Puerto Rico, the District of Columbia, the island of Guam, the
Trust Territories, and the U.S. Virgin Islands.

Wafer Starts Per Week

The number of semiconductor wafers that can be processed by an Integrated Circuit production line(s) in a 7-day
period.

[1] Complimentary metal oxide semiconductor (CMOS) is a class of semiconductor used in digital logic circuits
employed in microcontrollers, microprocessors, memory, and other devices. The technology also is used in analog
circuits in sensors, transceivers, data converters and other systems.
[2] Sandia National Laboratories. A minority carrier device is a device in which current is conducted by charge
carriers of sign (positive or negative) opposite to the dopant polarity of the underlying semiconductor material. In
other words, current carried by electrons (negative) in a p-type semiconductor, or by holes in an n-type
semiconductor. In semiconductors, minority charge carriers are less abundant than majority charge carriers.
Minority carrier devices: Bipolar junction transistors, charge-coupled devices (CCDs), solar cells.
[3] Sandia National Laboratories.
[4] ITAR Part 121 – The United States Munitions List (See www.pmddtc.state.gov/consolidated_itar.htm.
[Microelectronic circuits are considered radiation hardened when they exceed all five of these standards: (1) Total
dose of 5x105 Rads (Si); (2) Dose rate upset of 5x108 Rads (Si) per second; (3) Neutron dose of 1x1014 N/cm2;
(4) Single-Event upset of 1x10minus;7 or less error/bit/day; and (5) Single-Event latch-up free and having a dose
rate latch-up of 5x108 Rads (Si) per second or greater.]

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

Table of Contents
CORPORATE LEVEL RESPONSE

Section III: Organization Reporting Profile
This survey consists of sections that must be answered at the Corporate Level and other sections that must be answered at the
Facility Level. The reporting level will be specified at the top of each section in RED. Facilities that will be responding separately
from their corporate headquarters should proceed to section 1a to begin the survey.
Description of Business Activity

Select the description of your organization's U.S. operations that that most closely reflects
its business:
Design Integrated Circuit products (fabless)
Design and Manufacture Integrated Circuit products (integrated device manufacturer)
Design and Manufacture Integrated Circuit products; and perform Package, Test & Assembly
Manufacture Integrated Circuit products (as a foundry)
Manufacture Integrated Circuit products (as a foundry) and perform Package, Test & Assembly
Design Integrated Circuit products (fabless); and perform Package, Test & Assembly
Provide Package, Test & Assembly Services

Yes/No

Other [Write In]
IC Activity

Identify the number of Integrated
Circuit-related design and
manufacturing facilities that your
organization operated in the United
States in 2016.

U.S.
Locations

Non-U.S.
Locations

Design
Manufacturing
Packaging, Test
& Assembly

Comments:
Identify all of your organization's Integrated Circuit-related Design, Manufacturing, and Packaging facilities* located in
the United States.
Facility* Name

City

State

DMEA
Certified
Trusted** Facility

Primary Scope
of Work

Yes

Design

Manufacturing
PT&A
Other

*Facilities can constitute a single building or multiple buildings functioning as a unified design, fabrication, or packaging facility. Design, fabrication,
and packing, test and assembly operations must be identified separately. Individual wafer fabrication facilities serving distinct sets of technology
nodes should be identified separately even if operating on a single campus.
** "Trusted" refers to certification from the Defense Microelectronics Activity's Trusted Accredidation Program to design or manufacture Integrated
Circuit products.

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

Table of Contents
CORPORATE LEVEL RESPONSE

Section III: Reporting Level (Cont.)
A.

If your organization is publicly traded, identify
its stock ticker symbol.

Is your organization publicly traded or privately held?
Provide the following identification codes, as applicable, for your organization.

Data Universal
Numbering System
(DUNS) Code(s)

Harmonized Tariff
Schedule (HTS) Code(s)

NAICS (6-digit) Code(s)*

Find DUNS numbers at:

Find HTS numbers at:

Find NAICS codes at:

http://fedgov.dnb.com/w
http://hts.usitc.gov
ebform
Indicate if your organization qualifies as any of the following types of business:
A small business enterprise (as defined by the Small Business Administration)
8(a) Firm (as defined by the Small Business Administration)
A historically underutilized business zone (HUB Zone)
A minority-owned business
A woman-owned business
A veteran-owned or service-disabled veteran owned business

http://www.census.gov/e
pcd/www/naics.html

Specify the industry sectors that your organization serves through the provision of design and/or manufacturing services for Integrated Circuit products
located in the United States:

Aviation systems/Avionics
Automotive
Consumer electronics
Communications
Electronic Data Processing
Energy

Yes
No
N/A

Healthcare/Medical Devices
Industrial
Military and Space
Other National Security systems
Optical/Photonics
Other [Write In]

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

Table of Contents
FACILITY LEVEL RESPONSE

Section 1a: Organization Information
This survey consists of sections that must be answered at the Corporate Level and other sections that must be answered at the Facility Level. The reporting level will be specified at the
top of each section as appropriate.

Provide the following information for your facility.
Facility Name
Street Address
City
State
Zip Code
Website
Phone Number
CAGE Code (if applicable)
Primary Business

Select the option that most closely describes this facility's
Primary Business, and indicate any "Additional Business
Lines."

Additional Business Line
Additional Business Line

Integrated circuit/semiconductor product design facility
Integrated circuit/semiconductor product fabrication facility
Integrated circuit/semiconductor product packaging, assembly, and test facility
Integrated circuit/semiconductor product research and development facility
Integrated circuit/semiconductor product corporate headquarters facility
N/A

Provide the following information for your parent organization(s), if applicable. Enter N/A if no parent organization.
Parent Organization 1
Organization Name
Street Address
City
State/Province
Country
Postal Code/Zip Code
Point of Contact regarding this survey:
Name
Phone Number
Title
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Parent Organization 2

E-mail Address

State

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
FACILITY LEVEL RESPONSE

Section 2
Integrated Circuit Design & Manufacturing
2.a List this facility's Integrated Circuit Design and Manufacturing product capabilities and market types in the United States in calendar year 2016.
Design and Manufacturing Facility Market Types and Capabilities

Military/Space

Commercial

Industrial

Military/Space

Organic
Technologies

Carbon Based
Technologies (e.g.,
nanotubes)

Superconducting
Materials

Neutron Hardened

Antimonides

Industrial

Commercial

Industrial

Radiation Hardened
Military/Space

Radiation Tolerant

Commercial

Military/Space

Commercial

Industrial

Single-Event Effects Resistant

Military/Space

Commercial

Market Types

Industrial

Conventional Integrated Circuit
Products

Product Capabilities

Design/Manufacture/Both/Neither

2.b Identify this facility's Integrated Circuit-related design and manufacturing capabilities by technology node, wafer size, and material type:
Capability to Design and/or Manufacture - by Technology Node, Wafer Size & Material Type
Indium Phosphide

Gallium Nitride

Gallium Arsenide

Aluminum Gallium
Arsenide

Silicon Carbide

Silicon on Sapphire

Silicon Germanium

Silicon on Insulator

Bulk Silicon

-- by
Wafer
Size

Amorphous Silicon

(Select all that apply -- A blank response is counted as "No Capability")

Minimum
Technology
Node
Capability
[nanometers]
< 7* - 10,000

2- or 3-inch Design - Conventional
4-inch Design - Radiation Resistant
6-inch Manufacture - Conventional
8-inch Manufacture - Radiation Resistant
12-inch Both - Design

Comments:
Note: 10,000 nanometers equals 10 micrometers *Respond to this specification if your organization expects to develop a capability to work at this Technology Node by 2021.

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
CORPORATE LEVEL RESPONSE

Section 2
Integrated Circuit Design & Manufacturing - continued
2.c Specify your organization's design and manufacturing capabilities by device type with regard to the production of custom radiation-tolerant, radiation-hardened, and neutron hardened Integrated Circuit products located in the United States:
Capability to Design and/or Manufacture - by Device & Material Type

Analog/Linear Technologies

Design

Digital Logic Technologies

Manufacture

Digital Signal Processors

Both

Field Programmable Gate Arrays

Neither

One-time, Electrically Programmable Gate
Arrays
Mask Programmable Gate Arrays
Structured ASICs [a.k.a. Structured Arrays;
Platform ASICs]
Standard Cell ASICs [a.k.a. cell-based
ASICs]
Custom ASICs
MMIC** Technologies
Mixed Signal Technologies
Processors
Nonvolatile Memory
3-D Nonvolatile Memory
SRAM
DRAM - DDR3
DRAM - DDR4
IR*-Focal Plane Arrays
Anti-Tamper Technology
Display Electronics
MEMS Technologies
Optical/Photonic Technologies
RF Technologies
Other: [Write In]

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Superconducting
Materials

Carbon Based
Technologies (e.g.,
nanotubes)

Organic
Technologies

Antimonides

Indium
Phosphate

Gallium
Nitride

Gallium
Arsenide

Aluminum Gallium
Arsenide

Silicon
Carbide

Silicon on
Sapphire

Silicon
Germanium

Silicon on
Insulator

Bulk Silicon

Amorphous
Silicon

Single-Event
Effects Resistant Non-Destructive

Single-Event
Effects Resistant Destructive

Neutron Hardened

Radiation
Hardened

Radiation Tolerant

Device Type

Conventiona IC
Products

(Select all that apply -- A blank response is counted as "No capability")

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
FACILITY LEVEL RESPONSE

Section 2
Integrated Circuit Design & Manufacturing - Continued
2.d Identify this facility's design and manufacturing capabilities with regard to the production of Nonvolatile Memory devices, memory density, and access time:
Note: Do not complete this page if your organization does not design Nonvolatile Memory products. Proceed to Section 3

Capability to Design Nonvolatile Memory - by Device, Density, Read-Write Speed
Access Time
[Nano Seconds (ns)]

Memory Density
Memory Device Type
(Stand-Alone)

Erasable Programmable Read-Only Memory
(EPROM)

Design

Electrically Erasable Programmable Read-Only
Memory (EEPROM)

Manufacture

Flash - NOR*

Both

Flash - NAND

Neither

Select all that apply -- A blank response is counted as "No capability"

> 128 Gbit

64 - <128 Gbit

16 - <32 Gbit

1- <8 Gbit

256 - <1024 Mbit

64- <128 Mbit

16- <32 Mbit

1- <8 Mbit

<1 Mbit

Select all that apply - A blank response is counted as "No capability"

Write/Erase

100300ps
****

300 <700ps

700ps <1ns

Flash - NAND 3D**
Ferro Electric (FeRAM)
Magnetoresistive (MRAM)
MEMS-base (nanotube, NRAM)
Memristor***
Phase Change Memory (PCM, a.k.a. PRAM)
Polymer
Storage Class Memory (e.g., RRAM)
Super Permanent Memory (XPM)
Zero Capacitor (ZRAM)
Other [Write In]
Other [Write In]
*NOR Flash memory is able to read individual flash memory cells, and as such it behaves like a traditional read-only memory (ROM).
**Nonvolatile random access memory that can be erased electronically and rewritten up to 100,000 times.
*** A non-volatile memory technology that can change its resistance in varying levels. It can offer resistance in two states for a digital 0 or 1 or to levels in between to go beyond a binary system.
**** Pico second = 1 trillionith of a second.

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

1-<10ns

10-<20ns

20-<50ns

50-<150ns

[Provide specifications]

>150ns

Size

Time

Specify data
size: Word,
page, block,
etc.

(Write in
Spec.)

Write In

OMB 0694-0119 ROCIS Submission
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Table of Contents
CORPORATE LEVEL RESPONSE
Section 3
Rad Tolerant, Rad Hardened, Neutron Hardened IC Design & Manufacturing
3.a Identify your organization's current capabilities, previous capabilities and interest in developing capabilities in design, manufacturing or both for each of the following types of Integrated Circuit.
Previous Page

Currently (in 2017) has
capabilities to:

Type of Integrated Circuit

Had capabilities 2013-2016

Interested in developing capabilities for U.S. Government

Re-constituting Capacity
Initiating Capacity
Design
Design
Design
Design
Radiation Tolerant
Manufacture
Manufacture
Manufacture
Manufacture
Radiation Hardened
Both
Both
Both
Both
Neutron Hardened
Neither
Neither
Neither
Neither
Single-Events Effects Resistant - Destructive
Single-Event Effects Resistant - Nondestructive
Does your organization design or manufacture Radiation Tolerant, Radiation Hardened, Neutron Hardened or Single-Event Effects
Yes/No
If no, proceed to Section 4.
Resistant Integrated Circuits?
3.b Identify your organization's capabilities to design and/or manufacture custom Integrated Circuit products that are Radiation Tolerant, Radiation Hardened, Neutron Hardened or Single-Event Effects
Resistant at locations in the United States.
Capability to Design and/or Manufacture - by Material Type

Superconducting
Materials

Carbon Based
Technologies (e.g.,
nanotubes)

Organic
Technologies

Antimonides

Indium
Phosphate

Gallium
Nitride

Gallium
Arsenide

Aluminum Gallium
Arsenide

Silicon
Carbide

Silicon on
Sapphire

Silicon
Germanium

Silicon on
Insulator

Bulk Silicon

Amorphous
Silicon

(Select all that apply - A blank response is counted as "No capability")

Design

Radiation Tolerant
Manufacture

Radiation Hardened
Both

Neutron Hardened
Single-Event Effects Resistant

- Neither
Destructive

Single-Event Effects Resistant
- Non-Destructive

Radiation Tolerant: Integrated circuit products incorporating design features and/or physical characteristics with limited capability to resist effects from radiation induced damage (ionizing dose) from
industrial sources, electromagnetic pulses, weapons systems, and charged particles in space that can damage circuitry and render a device inoperable.
Radiation Hardened: Integrated circuit products incorporating design features and/or physical characteristics that demonstrate a capability to resist effects from radiation-induced damage (ionizing dose)
from industrial sources, electromagnetic pulses, weapons systems, or charged particles in space that can damage circuitry and render a device inoperable.
Neutron Hardened: Integrated circuit products incorporating design features and/or physical characteristics that can withstand the damaging effects of high-speed neutrons, gamma rays, and
electromagnetic pulses that accompany a nuclear weapons detonation.
Single-Event Effects (SEE) Resistant - Destructive: Resistant to effects caused by a single energetic particle striking an Integrated Circuit (IC) device. Performance of the IC device is not compromised to
a point where it is inoperable or not reliable for executing a mission as a result of event latch-up, burnout, or gate rupture, or snapback. [Immune to destructive SEEs up to an ion linear energy transfer
(LET) of 80 MeV.cm2/mg.]
Single-Event Effects Resistant - Non-Destructive: Resistant to effects caused by a single energetic particle striking an Integrated Circuit (IC) device. Performance of the IC device is not compromised to a
point where it is inoperable or not reliable for executing a mission as a result of event upset, transient, or functional interrupt. [Immune to non-destructive SEEs is at an LET of 30-40 MeV.cm 2/mg.]
*Organization possesses manufacturing process technology to achieve radiation tolerance, hardening, or neutron hardening.

Comments:

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
Next Page
FACILITY LEVEL RESPONSE
Section 4
Manufacturing Capabilities & Production Rates
Yes/No
Does your organization manufacture Integrated Circuits?
[If no, proceed to section 4c]
4.a 1) State the average manufacturing capacity utilization rates at your U.S. -based fabrication facility for the years 2013-2016. Then, 2) state the maximum number of wafer starts possible per week at
your manufacturing facility; 3) state the actual average wafer starts per week at your facility; and 4) indicate whether this facility will be operating through 2021.
Average Manufacturing Capacity Utilization Rates
2013

2014

2015

2016

%
%
%
*Normalized to 8-inch wafer equivalents.
**Assumes 7-days-a-week operations.
Note: a 100% utilization rate equals full operation with no downtime beyond that necessary for maintenance

2016 Maximum number of Wafer
Starts Per Week*

2016 Average Actual
Wafer Starts Per Week**

Will this Facility Operate Through
2021?

Yes/No

4.b Specify the maximum Wafer Start capacity per week of your facility in 2016 in the United States by technology node, wafer size, and material type.
Wafer Starts Per Week by Circuit Technology Node, Wafer Size & Material Type

< 7* - 10,000

2- or 3-inch Write In #
4-inch
6-inch
8-inch
12-inch

Comments:
Note: 10,000 nanometers equals 10 micrometers *Respond to this specification if your organization expects to develop a capability to work at this Technology Node by 2021.

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Superconducting
Materials

Carbon Based
Technologies
(e.g., nanotubes)

Organic
Technologies

Antimonides

Indium
Phosphate

Gallium
Nitride

Gallium
Arsenide

Aluminum Gallium
Arsenide

Silicon
Carbide

Silicon on
Sapphire

Silicon
Germanium

Silicon on
Insulator

-- by
Wafer
Size

Amorphous
Silicon

Minimum
Technology
Node Capability
[nanometers]

Bulk Silicon

(State your wafer-start-per-week capacity -- A blank response is counted as "No capability")

OMB 0694-0119 ROCIS Submission
Next Page

Table of Contents

FACILITY LEVEL RESPONSE
Section 4

Mask Production and Capability
Yes/No

Does your organization currently have captive, in-house Integrated Circuit mask-making capability?

[If no, proceed to section 5]

4.c Identify all technology nodes (nanometer ranges) for which your organization is capable of producing masks at company-owned and operated facilities located in 1) the United States; and 2) in company-owned and operated
facilities sited at non-U.S. locations.
Mask Technology Node (Nanometers)
(Select all that apply -- A blank response is counted as "No Capability")
Location

10000 6000
U.S.

<6000 <3000 3000
1500
Non-U.S.
Both

<1000 800

<800 - 500 <500 - 350 <350 - 250 <250 - 180 <180-130

<130 - 90

<90 -65

<65 - 45

<45-32

Indicate the percentages of your organization's Binary and Phase-Shift mask production that are fulfilled in-house and by external mask makers.

Binary Mask Blanks
What percent of your organization's binary
mask requirements are fulfilled by mask
production performed:

Phase-Shift Mask Blanks
by External Mask
Makers

In-House

U.S.

Non-U.S.

U.S.

Non-U.S.

What percent of your organization's
phase-shift mask requirements are
fulfilled by mask production
performed:

by External Mask
Makers

In-House

U.S.

Non-U.S.

U.S.

Non-U.S.

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

<32-28

<22-14

<10-7

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
CORPORATE LEVEL RESPONSE
Section 5:
Performance of Production Steps – Wafer Processing & Die Packaging
Yes/No
Does your organization manufacture Integrated Circuits?
[If no, proceed to section 6]

1) Identify the Integrated Circuit wafer processing and wafer die packaging steps that your organization performs at its facilities in the United States and at facilities it owns in Non-U.S. locations. 2) Identify the names of the supplier(s) that your organization
employs to perform wafer processing and die packaging activities at facilities outside the United States and provide the country locations where that work is performed. Select all that apply -- A blank response is counted as "No Capability."

Country/Countries of Company-Owned Facilities
Wafer Processing and Packaging Steps

U.S.

Non-U.S.
Location
Country #1

Country #2

Country #3

List of Suppliers
Equipment Supplier
#1

Equipment Supplier
Country #1

Wafer Thinning
Backgrinding

Yes/No

Other [Write In]
Wafer Dicing
Saw Blade
Laser Dicing
Plasma Dicing
Other [Write In]
Interconnects
Wired Bonding
Solder Bumping
Stud Bumping
Pillar
Redistribution Layer Connects
Other [Write In]
Circuit Bonding
Direct Die Film (DDF) Attach
Silver Glass Attach
Leaded Solder Attach
Gold Silicon Eutectic Attach
Wafer-to-Wafer
Other [Write In]
Substrate/Packaging
Ceramic
Organic
Through Silicon Via
Flexible
Other [Write In]
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Equipment Supplier
#2 Name

Equipment Supplier
Country #2

Equipment Supplier
#3 Name

Equipment Supplier
Country #3

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
CORPORATE LEVEL RESPONSE

On-Die INPUT/OUTPUT Integrated Circuit Devices & Enabling Firmware

Section 6a:

State the percentage of Integrated Circuit On-Die Input/Output Controllers and Firmware used by your organization in 2016 that were 1) produced internally at company facilities located in the U.S. and at Non-U.S. company
locations; 2) licensed from U.S. companies, and 3) licensed from non-U.S. companies. Secondly, identify the top three non- U.S. suppliers and countries that were sources of these controllers and firmware used in products
manufactured by your company in 2016. Select all that apply -- A blank response is counted as "No Capability."
Company Produced / Licensed On-Die Input/Output Controllers and Firmware
Internally
Internally
Licensed
Produced at
Licensed
Produced at
Type of On-die Hardware Protocol Controller &
from nonCompany
from U.S.
Company
Firmware Controlled Device
U.S.
Locations
Companies
Locations in
Companies
Outside the
U.S.
U.S.
PCI Express - Controller

Non-U.S. Countries and Suppliers
Total (must
add up to
100%)

Supplier #1
Name

Country #1

PCI Express - Firmware
Ethernet (1G, 10G, 25G, 100G) - Controller
Ethernet (1G, 10G, 25G, 100G) - Firmware
USB (1.0, 2.0, 3.0) - Controller
USB (1.0, 2.0, 3.0) - Firmware
SATA - Controller
SATA - Firmware
Thunderbolt - Controller
Thunderbolt - Firmware
Firewire - Controller
Firewire - Firmware
Memory - DDR3 and DDR4 - Controller
Memory - DDR3 and DDR4 - Firmware
ZigBee - Controller
ZigBee - Firmware
Bluetooth - Controller
Bluetooth - Firmware
802.11 - Controller
802.11 - Firmware
Other - Controller [Write in]
Other - Firmware [Write in]
Comments:

16
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Supplier #2
Name

Country #2

Supplier #3
Name

Country #3

OMB 0694-0119 ROCIS Submission

Table of Contents
CORPORATE LEVEL RESPONSE

Embedded Integrated Circuit Bit Cell and Memory Compiler Intellectual Property Sources

Section 6b:

For your analog, Application Specific Integrated Circuit and Field Programmable Gate Array products, state the percentage of embedded Integrated Circuit bit cell and memory compiler intellectual property used by your
organization in 2016 that was 1) produced internally at company facilities located in the U.S. and at Non-U.S. company locations; 2) licensed from U.S. companies, and 3) licensed from non-U.S. companies. Secondly,
identify the top three non- U.S. suppliers and countries that were sources of bit cell and memory compiler intellectual property used in products manufactured by your company in 2016. Select all that apply -- A blank
response is counted as "No Capability."
Company Produced / Licensed Bit Cell and Memory Compiler IP
Internally
Internally
Produced at
Licensed
Produced at
Company
Type of Memory Device IP
from U.S.
Company
Locations
Companies
Locations in
Outside the
U.S.
U.S.
Embedded EEPROM – Bit Cell

Country and Sources of Bit Cell, Memory Compiler IP
Licensed
from nonU.S.
Companies

Total (must
add up to
100%)

Supplier #1
Name

Country #1

Embedded EEPROM – Memory Compiler
Embedded FLASH – Bit Cell
Embedded FLASH – Memory Compiler
Embedded SRAM – Bit Cell
Embedded SRAM – Memory Compiler
Embedded DRAM – Bit Cell
Embedded DRAM – Memory Compiler
Embedded Other – Bit Cell

[Write in]

Embedded Other – Memory
[Write in]
Compiler
Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Supplier #2
Name

Country #2

Supplier #3
Name

Country #3

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
CORPORATE LEVEL RESPONSE

Section 7a
Performance of Production Functions for the Design of Integrated Circuits
Answer the questions on this page ONLY if your organization operates design facilities in the United States to produce Integrated Circuit products. If your organization does not operate design facilities in the United
States, proceed to Section 7b.
Identify practices from the list below that reflect; 1) your organization's business methods in regard to execution of the eight design functions listed along the top of this page; 2) its practices and plans on outsourcing
Integrated Circuit design.

Other (Specify
Here)

Test Vector
Generation****
*

Simulation

Functional
Verification****

Physical
Layout***

Synthesis**

Digital

Analog

Respond to All Questions

RTL Design*

Integrated Circuit Design Functions

1. In 2016 performed the following Integrated Circuit Design Steps at facilities in the
Yes/No/Not
United States that it owns and operates:
Applicable

2. Did not design at its own U.S. facilities, but contracted with other U.S.-based
organizations to perform the design tasks at their U.S. facilities.

Yes/No/Not
Applicable

3. For the 2017-2021, my organization expects to retain capability to perform the
following Integrated Circuit design steps at facilities in the United States that it owns Yes/No/Not
Applicable
and operates.
4. For 2017-2021 period, my organization will secure other U.S.-based vendors to
complete these design steps at their facilities in the United States.
5. Anticipates that the organization's capabilities to perform the following the eight
design steps facilities in the United States will:

Yes/No/Not
Applicable

Increase/Decrease/
No Change

6. Expects that its use of outsourcing in 2017-2021 will :
Increase/Decrease/
No Change

7. In 2016, my organization outsourced the following Integrated Circuit design steps
to facilities located outside of the United States that it owns and operates:
Yes/No/Unknown
8. The following Integrated Circuit design steps were out-sourced in 2016 to nonU.S. companies operating at non-U.S. locations:
9. The three primary reasons why my organization outsources Integrated Circuit
design steps to non-U's locations are:
10. In the space provided, identify the top five countries to which your
organization outsources Integrated Circuit design:

Yes/No/Unknown

Reason # 1

Reason #2

Reason #3

Country #1

Country #2

Country #3

Tariff avoidance

Lower costs

Country #4

Country #5

Proximity to customer

Market access

Availability of skilled labor

Government subsidies

Production efficiency

Other

Comments:
Complete the Next Page, Section 7b, If your organization outsources Integrated Circuit manufacturing steps to non-U.S. locations.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

<----- Reasons for Outsourcing
Joint venture

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
CORPORATE LEVEL RESPONSE

Section 7b
Performance of Production Functions for the Manufacture of Integrated Circuits
Answer the questions on this page ONLY if your organization operates manufacturing facilities in the United States to produce Integrated Circuit products. If your organization does not operate manufacturing facilities in
the United States, proceed to Section 7c.
Identify practices from the list below that reflect; 1) your organization's business methods in regard to execution of the eight manufacturing functions listed along the top of this page; 2) its practices and plans on
outsourcing Integrated Circuit manufacturing.

1. In 2016 performed the following Integrated Circuit Manufacturing Steps at
facilities in the United States that it owns and operates:
2. Did not manufacture at its own U.S. facilities, but contracted with other U.S.based organizations to perform the manufacturing tasks at their U.S. facilities.

Other (Specify
Here)

&
Final Test
Inspection

Packaging

Dicing

Wafer Sorting

E-Test

Wafer
Manufacturing
(Back End)

Respond to All Questions

Wafer
Manufacturing
(Front End)

Mask Making

Integrated Circuit Manufacturing Functions

Yes/No/Not
Applicable

3. For the 2017-2021, my organization expects to retain capability to perform the
following Integrated Circuit manufacturing steps at facilities in the United States that Yes/No/Not
Applicable
it owns and operates.
4. For 2017-2021 period, my organization will secure other U.S.-based vendors to
complete these manufacturing steps at their facilities in the United States.
5. Anticipates that the organization's capabilities to perform the following the eight
manufacturing steps facilities in the United States will:

Yes/No/Not
Applicable

Increase/Decrease/
No Change

6. Expects that its use of outsourcing in 2017-2021 will :
Increase/Decrease/
No Change

7. In 2016, my organization outsourced the following Integrated Circuit
manufacturing steps to facilities located outside of the United States that it owns
and operates:
8. The following Integrated Circuit manufacturing steps were out-sourced in 2016
to non-U.S. companies operating at non-U.S. locations:
9. The three primary reasons why my organization outsources Integrated Circuit
manufacturing steps to non-U's locations are:
10. In the space provided, identify the top five countries to which your
organization outsources Integrated Circuit manufacturing:

Yes/No/Unknown

Reason # 1

Reason #2

Reason #3

Country #1

Country #2

Country #3

Tariff avoidance

Lower costs

Joint venture

Country #4

Country #5

Proximity to customer

Market access

Availability of skilled labor

Government subsidies

Production efficiency

Other

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

<----- Reasons for Outsourcing

OMB 0694-0119 ROCIS Submission
Next Page

Table of Contents
CORPORATE LEVEL RESPONSE

Analog/Linear Technologies

Design

Digital Logic Technologies

Manufacture

Digital Signal Processors

Both

Field Programmable Gate Arrays

Neither

Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

7 - <10

14 - <22

28 - <32

32 - <45

45 - <60

65 - <90

90 - <130

130 - <180

180 - <250

250 - <350

350 - <500

500 - <800

1,000 - <1,500

1,500 - <3,000

3,000 - <6,000

Circuit Technology Node [nanometers]

10,000 - 6,000

Superconducting
Materials

Carbon Based
Technologies (e.g.,
nanotubes)

Organic
Technologies

Antimonides

Indium
Phosphate

Gallium
Nitride

Gallium
Arsenide

Aluminum Gallium
Arsenide

Silicon
Carbide

Silicon on
Sapphire

Silicon
Germanium

Silicon on
Insulator

Bulk Silicon

Amorphous
Silicon

Single-Event Effects
Resistant - NonDestructive

Single-Event Effects
Resistant Destructive

Neutron Hardened

Radiation Hardened

Radiation Tolerant

Device Types

Conventional IC
Products

Section 7c
Outsourcing of Production Steps for the Design and Manufacture of Integrated Circuits
Specify the characteristics of the Integrated Circuit products for which your organization outsources Design and/or Manufacturing Steps.
If your organization does not outsource Integrated Circuit design or manufacturing facilities in the United States, proceed to
Section 8.
Outsourced Design - by Device Type, Material, & Circuit Technology Node
(Select all that apply -- A blank response is counted as "No Capability")
Capability
Semiconductor Material Types

800 - <1,000

OMB 0694-0119 ROCIS Submission

Table of Contents
CORPORATE LEVEL RESPONSE
Section 8a:
National Security Requirements - The Trusted Access Program
1. Does your organization have in place today an ability to design or manufacture custom Integrated
Circuit products in a trusted* environment located in the United States that conforms to Department of
Defense (DOD) standards for the conduct of such work?
2. Has your organization been certified by DOD's Trusted Access Program Office at the Defense
Microelectronics Activity (DMEA) as a 'trusted' supplier of Integrated Circuit products?

Design/Manufacture/Both/Not
Applicable

Yes/No/Not Applicable

3. Is your organization planning to seek certification by DOD's Trusted Access Program Office at the
Defense Microelectronics Activity as a 'trusted' supplier of Integrated Circuit products?
4. How does your organization view the return on investment associated with expenses incurred for
securing accreditation through DMEA's Trusted Access Program?

Yes/No/Unknown

Favorably/Unfavorably/No
opinion

5. Is your organization familiar with alternatives to the current Trusted Access Program and, if so,
which do you assess most favorably? (Split manufacturing, Trust by design, Tiers of trust)

Unfamiliar/Split
Manufacturing/Tiers of
Trust/Trust by Design

6. If your organization has recently withdrawn from operating a facility from the Trusted Access Program or is planning to do so,
identify the affected facility by name and address and explain the reason for your organization's action in the space below.
Name:

Address:

Explanation:
7. If you answered "Yes" to Question 1, 2, or 3 identify the manufacturing and/or design facilities for which (1) certification has
been awarded, (2) the facilities for which certification is being sought or may be sought, and (3) the primary business activity at
that facility.
Facility Name(s)

City

State

Awarded
Certification
Yes/No

Seeking
Certification
Yes/No

Business Activity
Design
Manufacture
Package, Test, Assembly

Comments:
* "Trusted" refers to certification from the Defense Microelectronics Activity's Trusted Accreditation Program to design or manufacture Integrated Circuits.

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
21

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
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CORPORATE LEVEL RESPONSE
Section 8b
National Security Requirements - Outlook on Future Capability to Supply Integrated Circuit Products
For each of the Integrated Circuit devices listed, indicate 1) how your organization's ability to design and/or manufacture at its United States facilities may
change in the next five years. 2) State the primary factor contributing to this change (if applicable); and 3) Identify the types of customers that would be
affected by this change.
(Select all that apply -- A blank response is counted as "No Capability")
Device Types

Integrated Circuit Design
Integrated Circuit Manufacturing
Types of Affected
Types of Affected
Future Capability
Primary Factor
Future Capability
Primary Factor
Customers
Customers

Analog/Linear Technologies
Digital Logic Technologies

Increase

Labor costs

Commercial (COTS standard Products)

Digital Signal Processors

Decrease

Cost of Modernization

Commercial(Custom Products)

Field Programmable Gate Arrays

Cease

Low order volume

Industrial (COTS standard Products)

One-time, Electrically Programmable Gate
Arrays

No Change

Manufacturing Difficulty Industrial(Custom Products)

Mask Programmable Gate Arrays

N/A

Meeting DOD
Requirements

U.S. Government Agencies - excluding DOD (Custom Products)

Structured ASICs [a.k.a. Structured Arrays;
Platform ASICs]

Regulations

DOD (Custom Products)

Standard Cell ASICs [a.k.a. cell-based
ASICs]

Technology lag

DOD (COTS standard Products)

Custom ASICs

Low Profitability

DOD (Custom Products)

MMIC** Technologies

Trusted Certification
Costs

U.S. Government Agencies - excluding DOD COTS standard Products)

Mixed Signal Technologies

Rising Commercial
Orders

Processors

Rising US Government
Orders

Nonvolatile Memory

Design Difficulty

3-D Nonvolatile Memory
SRAM
DRAM - DDR3
DRAM - DDR4
IR*-Focal Plane Arrays
Anti-Tamper Technology
Display Electronics
MEMS Technologies
Optical/Photonic Technologies
RF Technologies
Other [Write In]

Comments:

22
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production
Act

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents

CORPORATE LEVEL RESPONSE
Section 9:
Manufacturing Equipment Suppliers
For each of the listed processes, identify those used by your organization by 1) Writing in principal equipment type 2) Primary practice for maintaining equipment and 3) your organization's three primary suppliers of that equipment. If you only have one supplier, enter "None" for suppliers two and
three. A blank response will be counted as "no capability."
Primary Equipment Suppliers
- By Process
(Select all that apply -- A blank response is counted as "No Capability")
Integrated Circuit Manufacturing
Processes - Front to Back

Wet Wafer Cleaning

Type of
Type of
Type of
Equipment Equipment Equipment
#3
#2
#1

Write In

Primary
Company
Practice Equipment
Maintenance
Performed
By:

Equipment
Supplier
#1

City

State

Country

Single or
Sole
Source
Suppler

Equipment
Supplier
#2

City

Company employees

Piranha solution

Manufacturer

RCA clean

OEM Distributor

Photolithography

Third-Party Contractor

Ion implantation
Dry etching
Wet etching
Plasma strip/Ashing
Thermal treatments Rapid thermal anneal
Furnace anneals
Furnace Thermal oxidation
Rapid thermal oxidation
Epitaxy
Chemical vapor deposition (CVD)
Plasma enhanced chemical vapor deposition (PECVD)
Rapid thermal chemical vapor deposition
Physical vapor deposition (PVD)
Molecular beam epitaxy (MBE)
Electrochemical deposition (ECD)
Chemical-mechanical planarization (CMP)
Inline monitor testing at wafer level
[interstitial/ silver /kerf structures]
Wafer bumping (flip chip products only)
Through silicon via (TSV), back side thinning and
backside metal redistribution [if a 3-D chip]
Wafer functional test (testing of design structures)
Wafer backgrinding
(Smartcard, PCMCIA cards, other applications)
Die preparation Wafer mounting / Tape
Die cutting/dicing
IC packaging Die attachment/bonding
IC bonding Wire bonding (if wirebond product)
Thermosonic bonding
Wafer bonding (if a wafer level bonded assembly)
Tape Automated Bonding (TAB)
IC encapsulation Baking
Plating
Laser marking
Trim and form
IC testing
Comments:

23
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

State

Country

Single or
Sole
Source
Suppler

Equipment
Supplier
#3

City

State

Country

Single or
Sole
Source
Suppler

OMB 0694-0119 ROCIS Submission

Previous Page
Section 10
A.

Table of Contents
FACILITY LEVEL RESPONSE

Employment
Indicate the primary Integrated Circuit business line that accounts for the majority of FTE Employees
and Contractors at this facililty:

Design/Manufacture/Package, Test, and
Assembly

Record the total number of full time equivalent (FTE) employees BY FACILITY in your U.S./domestic operations by labor type for calendar years 20132016. Do not double count personnel who may perform cross-operational roles.

Reporting Schedule:
B.

2013

Calendar Year/Fiscal Year
2014
2015
2016

1
FTE Employees
2
FTE Contractors
3
Number of US Citizens
4
Number of non-US Citizens
List the top five countries (other than the U.S.) from which your location has non-U.S. citizen workers (employees or contractors), and
identify the number of each type of visa or green card holder associated with each country.
Country

H-1B

H-2B

F-1

Green Card

Total (Auto Sum)

List the number of staff located at this facility working in the positions listed below that support Integrated Circuit design or Integrated
Circuit product manufacturing (fabrication). Blanks will be interpreted as meaning that there are no personnel on site at this facility
performing the listed job function.
Occupational Category Occupational Category Occupational Category Number of
Number of
Number of
Manufacture of Integrated
Manufacture of Integrated
Design of Integrated Circuits
Staff
Staff
Staff
Circuits
Circuits

Silicon Design Architect

Environmental Engineering

Engineering Manager

Researcher

Safety Engineer

Manufacturing Manager

Quality Engineers

Planning/Procurement/Supply Chain

Facilities Engineering/Technician

Pre Silicon Validation Engineer

Statistician

Shift Manager

Post Silicon Validation Engineer

Process Engineer/Technician

Failure Analysis Engineer

Layout Engineer

Product Engineer

Integration Engineer

Debug Engineer

Reticle Engineer

Automation Engineer/Technician

Electronic Engineer

Manufacturing Technician

Factory Manager

RF/Analog Engineer

Equipment Engineer

Yield Engineer

Integration Engineer

Industrial Engineer

CAD Engineer
Thermal Engineer
Mechanical Engineer
Packaging Engineer
Program Manager

State 1) the average age of the staff
working at this location; and 2) the
percentage of this staff that is
projected to leave or retire in the next
five years.

Type of Integrated
Circuit Facility

Design/Manu
facturing

Average
Age

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
24

% Projected to
leave or retire
in next five years

OMB 0694-0119 ROCIS Submission
Previous Page

Return to Table of Contents
CORPORATE LEVEL RESPONSE

Section 11: Sales
For years 2013-2016 provide your organization's U.S. and non-U.S. sales information. For 2017, project whether your sales will increase, decrease or
remain unchanged.
Reporting Schedule:

Record $ in Thousands, e.g. $12,000.00 = survey input of $12

Calendar Year/Fiscal Year

2013

2014

Total Sales, all Customers (in $)

Total IC-Related Sales, all Customers U.S./Non-U.S. ( in $)

Total U.S. IC-Related Sales - as a % of B

Total Non-U.S. IC-Related Sales - as a % of B

Direct sales of Custom IC Products (including design services)
to U.S. Government customers (in $)

Is your organization dependent of U.S. Government sales for its ongoing viability?

2015

2016

2017*

Yes/No

Identify your organization's 1) top five commercial customers, their country location, and estimated revenue from them for 2016; 2) state the
primary type of IC product supplied (IC designs or fabricated product) sold to them and the estimated revenue for 2016 attributed to the primary
product; and 3) indicate whether the products were supplied under DMEA Trusted Access certification.
Top 5 Commercial Customers by Revenue ($)
Commercial End Customer Name

Country

Estimated 2016
Revenue - All
Product Sales

Prime Product Type
(Based on Revenue)

Estimated 2016
Revenue
-Primary Product

Drop-Down of 23 Product Classes

DMEA
Trusted
Program
Yes/No

Identify your organization's 1) top five U.S. Government customers, the associated federal agency, and estimated revenue from them for 2016;
2) state the primary type of IC product supplied (IC designs or fabricated product) sold to them and the estimated revenue for 2016 attributed to
the primary product; and 3) indicate whether the products were supplied under DMEA Trusted Access certification.
Top 5 U.S. Government Customers for Custom Products (Non-COTS) by Revenue ($)
Government End Customer Name

Federal Agency

Estimated 2016
Revenue - All
Product Sales

Prime Product Type
(Based on Revenue)
Drop-Down of 23 Product Classes

Estimated 2016
Revenue
-Primary Product

DMEA
Trusted
Program
Yes/No

Comments:
Disclosure of financial information is required for both public and private companies. All financial data is treated as Business Proprietary and
exempt from Freedom of Information Act (FOIA) requests. Providing BIS with financial information will not result in the public release of you
organization’s financial data.

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

Return to Table of Contents
CORPORATE LEVEL RESPONSE

Section 12: Financials
Provide the following Income Statement and Balance Sheet financial line items for your organization for years
2013-2016 below. Furnish full-year estimates for 2016.
(Fiscal Year/Calendar Year)

Reporting Schedule:
Income Statement (Select Line Items)
A.
B.
C.
D.
E.

2013

Net Sales (and other revenue)
Cost of Goods Sold
Total Operating Income (Loss)
Earnings Before Interest and Taxes
Net Income
Source of Balance Sheet Items:
Reporting Schedule:
Balance Sheet (Select Line Items)

A.
B.
C.
D.
E.
F.

Record $ in Thousands, e.g. $12,000.00 = survey input of $12

2014

2015

2016

(Corporate/Whole Organization)
(Fiscal Year/Calendar Year)
Record $ in Thousands, e.g. $12,000.00 = survey input of $12

2013

2014

2015

2016

Cash
Inventories
Current Assets
Total Assets
Current Liabilities
Total Liabilities
Comments:

Disclosure of financial information is required for both public and private companies. All financial data is
treated as Business Proprietary and exempt from Freedom of Information Act (FOIA) requests. Providing
BIS with financial information will not result in the public release of you organization’s financial data.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Year

Reporting of Significant One-Time Events
Instruction: Provide an explanation of any significant one-time events that would skew
assessments of the economic performance of your organization.

2013
2014
2015
2016
26

OMB 0694-0119 ROCIS Submission
Previous Page
Section 13: Acquisitions, Divestitures, Mergers and Joint Ventures

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CORPORATE LEVEL RESPONSE
Acquisitions, Divestitures, and Mergers
How many Integrated Circuit-related acquisitions, divestitures and mergers has your organization been party to since 2013?

If none, a "0" must be placed in the box.

Identify your organization's five most recent Integrated Circuit-related acquisitions, divestitures and mergers, going back no more than five years. Identify the primary objective of each event listed and provide a
description.
Organization Name

Type of Activity

Country

Primary Objective

Year

Explain (optional

<---- Primary Objective Dropdown

Acquisition

Access to government contracts

Market Access

Divestiture

Access to intellectual property

R&D access/coordination

Merger

Bankruptcy restructuring

Reduce costs

Broaden customer base

Regulatory

Develop new capabilities

Tax-related

Joint Ventures

Expand Product Lines

How many Integrated Circuit-related joint ventures does your organization currently participate in?

If none, a "0" must be placed in the box.

Vertical integration
Other objective (Explain)

Identify your organization's current Integrated Circuit-related joint venture relationships, including public/private R&D partnerships. Select the primary objective of the joint venture and provide a description.
Organization Name

Country

Year

Primary Objective

Explain (optional

Cost Reduction

Market Access

Access to technology

Product Improvements

Other

Risk sharing

4
5
Have any non-U.S. governments (including sovereign wealth funds) invested, directly or indirectly, in your organization - and collectively control five
percent or more of stockholder voting shares?

<---- Primary Objective Dropdown

If you answered "yes" explain in the space below the nature of the investment and identify the non-U.S. government(s).

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Yes - Directly/Yes - Indirectly/No

OMB 0694-0119 ROCIS Submission

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Previous Page
Section 14: Capital Expenditures

CORPORATE LEVEL RESPONSE
Did your organization track capital expenditure financials between 2013 and
2016?
Capital Expenditure Reporting Schedule:

U.S.

If not, enter "0" in section B
Calendar Year/Fiscal Year

Record $ in Thousands, e.g. $12,000.00 = survey input of $12

Capital Expenditure Category

Total Capital Expenditures
1
Total Integrated Circuit-related Capital Expenditures
2
Machinery and Equipment [as a % of row 1]
3
IT, Computers, Software [as a % of row 1]
4
Land, Buildings, and Leasehold Improvements [as a % of row 1]
5
6
Other [Write In]
Lines 1 through 4 must total 100%

2013
Non-U.S.

U.S.

2014
Non-U.S.

U.S.

2015
Non-U.S.

Explain:
Rank your organization's top 3 capital expenditure priorities for 2013-2016, anticipated priorities for 2017-2021, and provide a brief description.

Replace old machinery and equipment
Improve productivity
Expand capacity
Add new capability
Upgrade technology
Meet specific customer requirements
Other [Write In]

2013-2016

2017-2021

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

2016
Non-U.S.

From 2013-2016, what was the most significant factor in dictating your organization's Capital Expenditures?

Priority
1
2
3
4
5
6
7

U.S.

Description

OMB 0694-0119 ROCIS Submission
Previous Page
Section 15: Research & Development

Table of Contents

CORPORATE LEVEL RESPONSE
A.

Does your organization perform Research and Development (R&D)?

If not, proceed to section 16

Yes/No

In Question B, record your organization's total R&D dollar expenditures for years 2013 - 2016.
In Question C, identify your organization's R&D funding sources, by percent of total R&D dollars sourced.
Note: Total annual funding sources reported (section C) can exceed total expenditures reported (section B) for a given year.
Reporting Schedule:

1
2
3
4
5

Total R&D Expenditures
Basic Research (as a percent of B1)
Applied Research (as a percent of B1)
Product/Process Development (as a percent of B1)
Total of 2 - 4 (must equal 100%)

Calendar Year/Fiscal Year
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2013
2014
2015
2016
$
%
%
%
0%
0%
0%
0%

Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2013
2014
2015
2016
1
$
Total R&D Funding Sources
2
%
Parent Company (Internal)
3
%
Total Federal Government
4
%
State and Local Government
5
%
U.S. Private Entity [includes industry, universities]
6
%
Foreign Investors [includes industry, governments]
(specify here)
%
8
Other
Total of 2 - 8 (must equal 100%)
9
0%
0%
0%
0%
1) Report the percentages of your organization's total annual R&D expenditures for supporting Integrated Circuit product design and manufacturing
activity performed in U.S. and Non-U.S. locations for 2013-2016
R&D Expenditures For Integrated Circuit Design and/or Manufacturing
(Corporate or Integrated Circuit Business Unit)

Total Integrated Circuit-Related R&D Expenditures

Percent Performed at All U.S. Locations
Percent Performed at All Non-U.S. Locations
Total Integrated Circuit R&D Expenditures

2013
%
%

2014

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

2015

2016

Data Confirmation

Total 2016 R&D
Expenditures
None

OMB 0694-0119 ROCIS Submission
Previous Page
Section 16a - Export Regulation & Trade Issues: Regulatory Impacts

Table of Contents

CORPORATE LEVEL RESPONSE
A.

Identify the Integrated Circuit-related products that your organization exports:

IC Designs

Yes/No

Partially Built ICs

Yes/No

Complete IC Products

Yes/No

Do you utilize the U.S. export control system (Export Administration Regulations [EAR]/Commerce Control List [CCL]), or
(International Traffic in Arms Regulations [ITAR]/U.S. Munitions List [USML]) for the export of Integrated Circuit-related products
and services (including design services and manufacturing)?

EAR/CCL

Yes/No

ITAR/USML

Yes/No

If you do not utilize U.S. export control licenses for Integrated Circuit -related products or services, select "No" in the box and
proceed to Section 17.

Has your organization lost export sales opportunities of Integrated Circuit-related products or
services to non-U.S. competitors because of U.S. export controls (EAR/CCL or ITAR/USML)?
If "Yes," select the total dollar amount of lost export sales opportunities from 2013-2016.

Yes/No
Lost Sales?*

Lost Export Sales Estimate

Yes/No
Yes/No

$
$

EAR/CCL
ITAR/USML

*Lost Sales: Are attributed to binding, written supply contracts (not estimates) of a stated dollar value that could not be fulfilled because a review of export regulations determined that the Integrated Circuit-related
products (designs, technology, and or manufactured devices) could not be exported to a designated customer or country.

State whether U.S. export control regulations since 2013 directly affected your organization’s Integrated Circuit business in any of the ways listed below. If "Yes," explain in the box provided
at right.
Impact
Response
Explanation

Altered your organization's Integrated Circuit-related
research and development program

Avoided the export of products or services that are subject
to EAR/CCL or ITAR/USML related controls.

Y/N
EAR/CCL
ITAR/USML
Both
N/A
EAR/CCL

ITAR/USML

Altered the composition of specific Integrated Circuitrelated business lines

Both
N/A
EAR/CCL
ITAR/USML

Located or relocated Integrated Circuit-related facilities
outside the United States due to regulatory burdens.

Non-U.S. organization's avoided buying U.S.-origin
Integrated Circuit-related products or services.

Y/N

Spurred non-U.S. organizations to offer "ITAR/USML-free"
or "EAR/CCL-free" Integrated Circuit-related products or
services.

Y/N

Both
N/A

State whether reforms in export control regulations (EAR/CCL and ITAR/USML) have affected your Integrated Circuit business:

Yes/No

For the two technologies listed below, identify how reforms in export control have affected your Integrated Circuit product business by: 1) Selecting the top three regulatory impacts from the
list below; 2) indicating from the list provided how export control reforms may have changed the range of companies and number of companies your organizations does business with as well
as your overall business volume.
Impacts of Export Control Reforms

Regulatory Impacts

Range of Trading
Companies

Number of
Trading
Countries

Business
Volume

Increase

Decrease

No Change

Technology
F.

Impact #1

Microwave Monolithic
Integrated Circuits

Impact #2

Reduced Paperwork

Wider business
opportunities

Increased Paperwork

Fewer business
opportunities

Reduced Licensing Time

Removed some
controls

Increased Licensing Time

Added some controls

Transmit/Receive Modules

Impact #3
Other #1

Other # 2

Other

Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission
Previous Page

Table of Contents
CORPORATE LEVEL RESPONSE

Section 17a - Trade and Intellectual Property Issues
From the list below, identify the methods your organization uses to transfer Integrated Circuit-related design and manufacturing intellectual property on a legal,
authorized basis to U.S. and non-U.S. destinations.
Methods

US Location(s)

Non-U.S.
Location(s)

Design IP or Manufacturing IP

Yes/No
Yes/No
Design IP
Licensing Intellectual Property
1
Manufacturing IP
Joint Ventures
2
Research collaborations
Both
3
A
Participation in scientific/technical conferences
4
Information provided to potential investors
5
Debt Financing
6
Non-Disclosure Agreements
7
Other [Write in]
8
From the list below, identify the methods by which unauthorized transfers of your company’s Integrated Circuit-related design and manufacturing intellectual property
have occurred. If yes, identify the types of IP.

Methods

US Location(s)

Non-U.S.
Location(s)

Yes/No

Design IP or Manufacturing IP

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

Cyber security intrusions
Planting staff in your company
Physical break-ins at company facilities
Business partners
Dumpster Diving
Former employees
Employees
External IT System Contractors
Persons performing R&D with your company
Company campus Wi-Fi Network Interceptions
Persons speaking to outside industry analysts/experts
Persons speaking with your bankers/financiers
Persons speaking with contractors and suppliers
Violation of Non-Disclosure Agreements
Other [Write in]

In the years 2013-2016, did your organization experience unauthorized transfers of Integrated Circuitrelated design and/or manufacturing Intellectual Property?

Design IP
Manufacturing IP
Both

If “Yes,” report the number of instances this occured for Design IP and Manufacturing IP?

Does your company know the country location(s) of the most frequent perpetrators of the
unauthorized transfers of your company’s Integrated Circuit-related intellectual property? If
“Yes” identify the countries.

Was the intellectual property subject to any the following export control
regulations:

Yes/No

CCL/EAR

Type of IP
Design/Manufacturing/Both/Neither
Design IP

Manufacturing IP

Country

Yes/No/Not
applicable

USML/ITAR

U.S. Department of Defense

Yes/No

U.S. Department of Commerce
U.S. Department of State
5

Did your organization report the incident(s) to the:

Federal Bureau of Investigation
State/Local police authorities
U.S. Department of Energy
Other [Write In]

In the past five years has your organization experienced a loss of access to critical Integrated Circuitrelated Intellectual Property?

Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Yes/No/Not applicable

OMB 0694-0119 ROCIS Submission
Return to Table of Contents

Previous Page
Section 17b: Trade and Intellectual Property Issues

CORPORATE LEVEL RESPONSE
Identify all trade practices and requirements that your organization has encountered at any time since 2013 in countries where it currently conducts business or seeks to do business directly or indirectly through third parties. Then, identify up
to three countries where these practices or requirements have been encountered and whether they persist to date.
Trade Practices

Yes/No

Country #1

Persists Today?

Tariffs on the Integrated Circuit-related products and services that your organization sells

Yes

National trade policy to phase out the use of Integrated Circuit-related products designed or
made outside of their country

N/A

Yes/No

Country #1

Persists Today?

Transfer of Integrated Circuit-related device intellectual property (trade secrets, patents, etc.)

Yes

Transfer of Integrated Circuit-related manufacturing process intellectual property (trade secrets,
patents, etc.)

N/A

Threats to boycott your organization’s products unless your organization allows substantial
investment by entities from that country

Country #2

Persists Today?

Country #3

Persists Today?

Country #2

Persists Today?

Country #3

Persists Today?

Manipulation of your organization's publicly traded stock as a consequence of refusing to transfer
intellectual property or establish design and/or manufacturing operations in that country
Denied timely access to the country’s market

Comments:
Conditional Trade Requirements

Outsource design of Integrated Circuit-related products to their country

Establish Integrated Circuit-related design operations in their country

Outsource the manufacture of Integrated Circuit-related products to their country

Establish Integrated Circuit-related manufacturing operations in their country

Required investment/equity from non-US companies in order to maintain market access
Mandatory joint ventures as means to achieve transfers on design and/or manufacturing
intellectual property and know-how

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission
Return to Table of Contents

Previous Page
Section 18: Competitiveness

CORPORATE LEVEL RESPONSE
Rank your organization's top five issues affecting the long-term competitiveness of your organization and provide an explanation.
Issue

Aging equipment, facilities, or infrastructure
Aging workforce
Competition - domestic
Competition - foreign
Counterfeit parts
Cybersecurity
Environmental regulations/remediation - U.S.
Environmental regulations/remediation - non-U.S.
Export controls; ITAR/USML; EAR/CCL
Forced localization
Government acquisition processes
Government purchasing volatility
Government regulatory burden
Healthcare costs
Health and safety regulations
Imports
Industrial Espionage
Intellectual property/patent infringement
Labor availability/costs
Material input availability
Product obsolescence
Pension costs
Proximity to customers
Proximity to suppliers
R&D costs
Reduction in commercial demand
Reduction in USG demand
Taxes
Worker/skills retention
Other
(specify)
Other
(specify)

2013-2016

2017-2021

1
2
3
4
5

Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Explanation (optional):

OMB 0694-0119 ROCIS Submission
Table of Contents
CORPORATE LEVEL RESPONSE

Section 19: Cyber Security
Estimate your organization's spending on physical and cyber security, in thousands of dollars, and state the number of security incidents your organization has recorded in each year.
Reporting Schedule:
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2013
2014
2015
2016*
A.
Incidents
Expenditures
Incidents
Expenditures
Incidents
Expenditures
Incidents
Expenditures
#
$
#
$
#
$
#
$
1
Cyber Security
#
$
#
$
#
$
#
$
2
Physical Security
* Furnish full year estimates for 2016 if data is unavailable.
Is your organization aware of Defense Federal Acquisition Regulation Supplement (DFARS) 252.204-7009, Limitations on the Use or Disclosure of Third-Party Contractor
Reported Cyber Incident Information?
Yes/No
1
http://www.acq.osd.mil/dpap/dars/dfars/html/current/252204.htm
B.
Explain:
Who is responsible for administering your organization's internal computer network(s)?
2
Dropdown
Who is responsible for administering your organization's external computer network(s)?
3
Dropdown
Is the computer or computer network that houses your organization's Commercially Sensitive Information (CSI) connected to the Internet, either directly or via an intermediary
network or server?
1

Does your organization either restrict or prohibit your external cloud service or external data storage provider(s) from storing Commercially Sensitive
Information (CSI) outside of the U.S.?
2
Estimate the percentage of your organization's Commercially Sensitive Information (CSI) that is stored with:

Yes/No

*This includes customer/client information, financial information and records, human resources information, intellectual property information, internal communications,
manufacturing and production line information, patent and trademark information, research and development information, regulatory/compliance information, and supplier/supply
chain information.

Does your organization use the following cloud-based security
protocols?

External Cloud Service Restrict/Prohibit/No/Un
Providers
known
External Data Storage Restrict/Prohibit/No/Un
Providers
known
External Cloud Service
Providers

(% Entry Only)

External Data Storage
Providers

(% Entry Only)

Advanced
authentication
(biometrics, tokens
etc.)

End-point protection

Identity and access
management

Real-time
monitoring/analytics

Threat intelligence

Other (specify)

Explain:
Does your organization have structured methods for protecting the following
types of Commercially Sensitive Information (see definitions)?

Explain

Customer/client information
Financial information and records
Human resources information/employee data
Information subject to export control regulations (EAR and/or ITAR)
Intellectual property related information
4

Internal communications including negotiation points, merger and acquisition
plans, and/or corporate strategy
Manufacturing and production line information
Patent and trademark information
Regulatory/compliance Information
Research and development (R&D) related information
Supply chain and sourcing information
Other (specify)

1
2
3
4
5

Using the drop-down lists and free-text entries below, indicate the type(s) and severity of any cybersecurity events that have occurred at this organization from 2013-2016.
Event
Impact Level
Explain (incident and follow-up)
Frequency
(Choose from Drop-Down)
Severe
Write in
#
(Choose from Drop-Down)
Moderate
(Choose from Drop-Down)
Low
Other Cybersecurity Event
(Specify)
None
Other Cybersecurity Event
(Specify)

Note: The FBI encourages recipients to report information concerning suspicious or criminal activity to their local FBI field office or the FBI's 24/7 Cyber Watch (CyWatch). Field office contacts can be identified at
http://www.fbi.gov/contact-us/field . CyWatch can be contacted by phone at 855-292-3937 or e-mail at [email protected] . When available, each report submitted should include the date, time, location, type of
activity, number of people, and type of equipment used for the activity, the name of the submitting organization, and a designated point of contact.
Comments:

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB 0694-0119 ROCIS Submission

Previous Page
Section 20: Certification

Return to Table of Contents

The undersigned certifies that the information herein supplied in response to this questionnaire is complete and correct to the best of his/her knowledge. It is a criminal offense to willfully make
a false statement or representation to any department or agency of the United States Government as to any matter within its jurisdiction (18 U.S.C.A. 1001 (1984 & SUPP. 1197)).
Once this survey is complete, submit it via e-mail to: [email protected]. Be sure to retain a copy for your records and to facilitate any necessary edits or clarifications.
Organization Name
Organization's Internet Address
Name of Authorizing Official
Title of Authorizing Official
E-mail Address
Phone Number and Extension
Date Certified
In the box below, provide any additional comments or any other information you wish to include regarding this survey assessment.

How many hours did it take to complete this survey?
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

File Type	application/pdf
File Title	2016 IC Survey_OMB.xlsx
Author	jverwey
File Modified	2016-12-09
File Created	2016-12-09