omb 0964-0119 pra package_microe_9904 u.s. microelectronics industry assessment survey - dropdowns

National Security and Critical Technology Assessments of the US Industrial Base

omb 0964-0119 pra package_microe_9904 u.s. microelectronics industry assessment survey - dropdowns

OMB: 0694-0119

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OMB Control No. 0694-0119

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OMB Control Number: 0694-0119
Expiration Date: September 30, 2024
DEFENSE INDUSTRIAL BASE ASSESSMENT: U.S. MICROELECTRONICS INDUSTRY

SCOPE OF ASSESSMENT
The U.S. Department of Commerce (DOC), Bureau of Industry and Security (BIS), Office of Technology Evaluation (OTE), is conducting a survey and assessment of the
capabilities of the U.S. microelectronics industrial base to support the national defense as required in Section 9904 of the National Defense Authorization Act (NDAA) of
Fiscal Year 2021 (15 USC §4654), in light of the global nature and interdependencies of the supply chain. The survey will collect information on the upstream materials and
downstream end uses associated with microelectronics production.
This survey is not part of the application for funding under Section 9902 of the 2021 NDAA (15 USC $4652).
Individual survey responses will not affect your organization's eligibility and/or consideration for CHIPS Act or other government funding.
RESPONSE TO THIS SURVEY IS REQUIRED BY LAW
A response to this survey is required by law (50 USC §4555). Failure to respond can result in a maximum fine of $10,000, imprisonment of up to one year, or both.
Information furnished herewith is deemed confidential and will not be published or disclosed except in accordance with Section 705 of the Defense Production Act of 1950,
as amended (50 USC §4555). Section 705 prohibits the publication or disclosure of this information unless the President determines that its withholding is contrary to the
national defense. Information will not be shared with any non-government entity, other than in aggregate form. The information will be protected pursuant to the appropriate
exemptions from disclosure under the Freedom of Information Act (FOIA), should it be the subject of a FOIA request.
Notwithstanding any other provision of law, no person is required to respond to nor shall a person be subject to a penalty for failure to comply with a collection of
information subject to the requirements of the Paperwork Reduction Act unless that collection of information displays a currently valid OMB Control Number.
BURDEN ESTIMATE AND REQUEST FOR COMMENT
Public reporting burden for this collection of information is estimated to average 14 hours per response, including the time for reviewing instructions, searching existing
data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or
any other aspect of this collection of information to BIS Information Collection Officer, Room 6883, Bureau of Industry and Security, U.S. Department of Commerce,
Washington, D.C. 20230, and to the Office of Management and Budget, Paperwork Reduction Project (OMB Control No. 0694-0119), Washington, D.C. 20503.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Next Page
Table of Contents

I
II
III
IV
1
2
3a
3b
3c
3d
4
5a
5b
6
7
8
9
10a
10b
11a
11b
12
13
14
15

Cover Page
Table of Contents
General Instructions
Definitions
Organization Information
Facilities and Operations
Product Capability
Production Capability
Product End Use (Estimate)
Primary Products
Outsourced Production
Material and Input Suppliers
Material and Inputs of Concern
Equipment Suppliers
Current and Future End Use
Supply Chain and Risk Management
Employment and Workforce Development
Financials
Research, Development, and Capital Expenditures
Joint Ventures and Partnerships
Technology Transfers
Competitive Factors
Long Term Investment and Development
Challenges
Certification
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119
Next Page

Previous Page
General Instructions
Your organization is required to complete this survey on the U.S. Microelectronics industrial base.
You must complete the survey using the DOC/BIS template which is Microsoft Excel based and can be downloaded at [link TBA].
A

If you are not able to download the survey document, at your request BIS staff will email the Excel survey template directly to you.
For your convenience, a PDF version of the survey and required drop-down content is available on the BIS website to aid internal data collection. DO NOT SUBMIT the
PDF version of the survey as your response to BIS. Should this occur, your organization will be required to resubmit the survey in Excel format.

This survey is not part of the application for funding under Section 9902 of the 2021 NDAA (15 USC $4652).
Individual survey responses will not affect your organization's eligibility and/or consideration for CHIPS Act or other government funding.
Any forecasts requested in this survey are understood to be speculative and for aggregate, statistical purposes.
Your organization has the option to provide a single Corporate level response or separate Business Unit/Division level responses for each of its semiconductor-related
businesses.

C
Note, if your organization is completing Business Unit/Division level surveys, any reference to "your organization" should be inferred as business unit or division. The
reporting level must remain consistent throughout the survey, unless instructed otherwise.
Respond to every question. Surveys that are not fully completed will be returned for completion. Use the comment boxes to provide any information to supplement
responses provided in the survey form. Make sure to record a complete answer in the space provided, even if the space does not appear to expand to fit all of the
D information.
Survey inputs should be completed by typing in responses or by using a drop-down menu.
E Do not disclose any U.S. Government (USG) classified information in this survey form.
F Submission of completed survey documents should be done using the designated Semiconductor Study inbox: [email protected]
Questions related to the survey should be directed to BIS survey support staff at [email protected]
G E-mail is the preferred method of contact.
You may speak with a member of the BIS survey support staff by calling (202)-482-7808.
For questions related to the overall scope of this assessment, contact [email protected] or:
Jason D. Bolton
Division Director, Industrial Studies
Defense Industrial Base Division
H
BIS/Export Administration/Office of Technology Evaluation
1401 Constitution Avenue, NW, Room 1093
Washington, DC 20230
DO NOT submit completed surveys to Mr. Bolton's postal or personal email address. All surveys must be submitted electronically to [TBD].
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Previous Page
Section 2: Facilities and Operations

Identify each of your organization's facilities in operation since 2017, including facilities that are idle/standby, closed, or planned/expected (e.g. facilities that are or will be under construction or development). Then, provide the information related to each facility, as applicable. Note, for (g), (h), (i), and (j), you may specify the metric as applicable to your organization if the default metric is not appropriate
using the dropdown menu option.
Facilities should include manufacturing facilities, design/R&D facilities, and distribution facilities. Do not include facilities that are solely engaged in sales and/or marketing activities. If you are reporting closed facilities, you only need to report facilities that have been closed within the past five years.
For column (h), “optimal 2022 capacity” is the capacity level this facility would have in 2022 if your organization were able to make this change with no cost or lead time.
Location
(a)

(b)

Operations
(c)

Facility Name
City

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A 17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

State/Province

Country

(d)

(e)

Primary Operation
Operating Status
(select from drop-down) (select from drop-down)

Dropdowns:
‐ Core IP
‐ Electronic Design Automation (EDA)
‐ Design Test and Verification
‐ Front‐End Manufacturing
‐ Assembly and/or Packaging
‐ Equipment and Tooling
‐ Materials and/or Components
‐ EMS/PCB Assembly
‐ R&D
‐ Distribution/Warehousing
‐ Other

(f)

Energy Use
(g)

(h)

(i)

(j)

Optimal 2022
Expected 2027
2022 Facility
2022 Capacity
Initial Year
Capacity
Capacity
Total Energy
(if applicable)
of
(if applicable)
(if applicable)
Usage
Operations
(yyyy)
Wafer Starts / Week Wafer Starts / Week Wafer Starts / Week Megawatt Hour
(200mm equiv.)
(200mm equiv.)
(200mm equiv.)
(MWh)

Dropdown:
‐ Operating
‐ Standby/Idle
‐ Ceased operations/Closed
‐ Planned/Expected

Dropdown:
‐ Increase
‐ Decrease
‐ No Change

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Future Outlook
(k)

Expected Facility Energy Use Change
Through 2027
(select from drop-down)
Change in
Energy Use

Reason for the Change

Dropdown:
‐ Change of energy source
‐ Upgrading of a
manufacturing process
‐ Expansion of facility's
operations
‐ Decrease in operations
‐ Other (Specify here):

(l)

(m)

(n)

Do you have any plans to
expand this facility within
the next 10 years?
(select from drop-down)

Do you have any plans to
modernize this facility
within the next 10 years?
(select from drop-down)

Explain the future outlook for this facility, as
applicable.

Dropdown:
‐ Yes, in 1 to 2 years
‐ Yes, in 3 to 4 years
‐ Yes, in 5 to 10 years
‐ No

OMB Control No. 0694-0119

Previous Page
Section 3a: Product Capability

Note: Sections 3a-3d are interconnected. In sections 3a-3c, you are asked to provide information on your organization's general product capabilities, production capabilities, and the estimated end use for each category. In section 3d, you are asked to provide more
specification on your organization's primary products within each category, as applicable.

For each product category your organization designs, manufactures, and/or distributes, indicate the appropriate participation type and provide the corresponding product category information, as applicable. For (f), (g), (h), and (i), the default metric is nanometer (nm),
however, you may specify the metric as applicable to your organization within the dropdown menu.

(a)

Product Category

1
2
A
3
4
5
6
7
8
9
10
11
12
13
14
15

Analog ICs
Microcontroller and Microprocessor ICs
Logic ICs
Memory ICs
Discretes
Optoelectronics
Sensors & Actuators
Printed Circuit Boards
Equipment and Tooling
Intermediate or End Product
Test and Design Verification
Assembly and/or Packaging
Other
(Specify Here)
Other
(Specify Here)
Other
(Specify Here)
Comments

Participation Type
(select from drop-down)

Dropdown:
‐ Design Only
‐ Manufacture Only
‐ Both Design and Manufacture
‐ Distribute Only

(b)
Percent (%) of
Production
(By Revenue)

(d)

Product Category Information
(e)

Primary Wafer Size
Primary Material
(select from drop-down) (select from drop-down)

Dropdown:
‐ Amorphous Silicon
‐ Bulk Silicon
‐ Silicon on Insulator
‐ Silicon Germanium
‐ Silicon on Sapphire
‐ Silicon Carbide
‐ Gallium Arsenide
‐ Gallium Nitride
‐ Indium Phosphide
‐ Antimonides
‐ Organic Technologies
‐ Carbon Based Technologies (e.g.
nanotubes)
‐ Superconducting Materials

(f)

(g)

(h)

(i)

Primary Technology
Node

Smallest Technology
Node

Largest Technology
Node

Expected Primary
Technology Node
in 2027

Nanometer (nm)

Dropdown:
‐ 300mm
‐ 200mm
‐ 150mm
‐ <=100mm
‐ Not Applicable

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Previous Page
Section 3b: Production Capability

For each product category your organization designs, manufactures, and/or distributes, estimate the percentage of each function (i.e. Design, Manufacture, Assembly/Packaging/Test, and Distribution) that is carried out by the specified locations (U.S. or Non-U.S.) and by whom (inhouse or outsourced). For the Design function, pre-existing IP blocks should be counted separately from both in-house and out-sourced design.

Total

Outsourced
(Third-Party Sales)

In House
(Direct Sales)

Distribution
Non-U.S.

U.S.

Total

Outsourced

In House

Outsourced

Total

In House

Outsourced

In House

Total

Assembly/Packaging/Test
U.S.
Non-U.S.

In House

Manufacture
Non-U.S.

U.S.
Pre-Existing
Licensed IP Blocks

Outsourced

In House

Pre-Existing
Licensed IP Blocks

Outsourced

In House

Product Category

Non-U.S.

Outsourced

Design
U.S.

1 Analog ICs

2 Microcontroller and Microprocessor ICs

3 Logic ICs

4 Memory ICs

5 Discretes

6 Optoelectronics

7 Sensors & Actuators

8 Printed Circuit Boards

9 Equipment and Tooling

10 Intermediate or End Product

11 Test and Design Verification

12 Assembly and/or Packaging

13 Other: N/A

14 Other: N/A

15 Other: N/A

Comments

OMB Control No. 0694-0119

Previous Page
Section 3c: Product End Use (Estimate)

For each product category your organization designs, manufactures, and/or distributes, estimate the percentage of revenue attributed to each commercial and defense end use, where known.
Commercial End Use
Product Category
1
2
3
A 4
5
6
7
8
9
10
11
12
13
14
15

Appliances/
Consumer
Goods

Automotive

Commercial
Aerospace

Healthcare/
Medical

Industrial

IT/Computers:
IT/Computers:
Consumer
Servers
Products

Defense End Use
Mobile
Devices

Network
Infrastructure

Other
Commercial

Foreign
Defense

U.S. Defense

Total

Unknown

0%
0%
0%
0%
0%
0%
0%
0%
0%
0%
0%
0%
0%
0%
0%

100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%

B Overall, how confident is your organization in estimating its product end-uses on a scale of 1 (Not at all confident) to 5 (Extremely confident)? Select the closest number from the scale in the dropdown.
Comments

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
0%
0%
0%
0%
0%
0%

Dropdown:
‐ 1 ‐ Not at all confident
‐ 2 ‐ Low confidence
‐ 3 ‐ Moderate confidence
‐ 4 ‐ Great confidence
‐ 5 ‐ Extremely confident

OMB Control No. 0694-0119

Section 3d: Primary Products
For each product category your organization designs, manufactures, and/or distributes, list up to the three primary product types with the highest gross revenue and provide the corresponding product type information, as applicable.
For (g), (h), (i), and (j), the default metric is nanometer (nm), however, you may specify the metric as applicable to your organization within the dropdown menu.
Product Type Information
(a)

Primary Product Type
(select from drop-down)

Product Category

1 Analog ICs

2 Microcontroller and Microprocessor ICs

3 Logic ICs

4 Memory ICs

5 Discretes

6 Optoelectronics

7 Sensors & Actuators

8 Printed Circuit Boards

9 Equipment and Tooling

10 Intermediate or End Product

11 Test and Design Verification

12 Assembly and/or Packaging

13 Other: N/A

14 Other: N/A

15 Other: N/A

1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3

(b)

(c)

Product Description

Percent (%) of
Category's
Production (By
Revenue)

(d)

Current Lead Time
(Weeks)

(e)

Primary Material
(select from drop-down)

(f)

Primary Wafer Size
(select from drop-down)

Dropdown:
‐ Amorphous
‐ Silicon Bulk
‐ Silicon Silicon on Insulator ‐
‐ Silicon Germanium
‐ Silicon on Sapphire
‐ Silicon Carbide
‐ Gallium Arsenide
‐ Gallium Nitride
‐ Indium Phosphide
‐ Antimonides
‐ Organic Technologies
‐ Carbon Based Technologies (e.g.
nanotubes)
‐ Superconducting Materials
‐ Other (Specify Here)

(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)
(write-in)

(g)

(h)

(i)

(j)

Primary Technology
Node

Smallest
Technology Node

Largest Technology
Node

Expected Primary
Technology Node
in 2027

Nanometer (nm)

Dropdown:
‐ 300mm
‐ 200mm
‐ 150mm
‐ <=100mm
‐ Not Applicable

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Dropdowns:
Analog ICs:
‐ General Purpose Analog
‐ Amplifiers/Comparators
‐ Interface
‐ Power Management
‐ Signal Conversion
‐ Application Specific Analog
‐ Consumer
‐ Computer
‐ Communications
‐ Automotive
‐ Industrial & Others

Microcontroller and
Microprocessor ICs:
‐ MOS MPU
‐ MOS MCU
‐ General Purpose MCU
‐ Automotive MCU
‐ Smart Card MCU
‐ MOS DSP

Logic ICs:
‐ Digital Bipolar
‐ MOS General Purpose Logic
‐ MOS Gate Arrays
‐ MOS Standard Cells
‐ MOS Display Drivers
‐ MOS Touch Screen Controllers
‐ MOS Special Purpose Logic
‐ Consumer
‐ Computer & Peripherals
‐ Communication
‐ Automotive
‐ Multipurpose & Other

Memory ICs:
‐ MOS DRAM
‐ MOS SRAM
‐ MOS Mask PROM &
EPROM
‐ NOR Flash Memory
‐ NAND Flash Memory
‐ Other Memory

Discretes:
‐ Diodes
‐ Small Signal and
Switching Transistors
‐ Power Transistors
‐ Rectifiers
‐ Thyristors
‐ All Other Discrete

Optoelectronics:
‐ Displays
‐ Lamps
‐ Opto Couplers & Isolators
‐ Optical Switches
‐ CCD & Other Image Sensors
‐ CMOS Image Sensors
‐ Other Optoelectronics
‐ Infrared
‐ Laser Pickup
‐ Laser Transmitter
‐ Light Sensors

Sensors & Actuators:
‐ Temperature & Other Sensors
‐ Pressure Sensors
‐ Acceleration & Yaw Rate
Sensors
‐ Magnetic Field Sensors
‐ Actuators

OMB Control No. 0694-0119

Previous Page
Section 4: Outsourced Production

For each production function your organization outsources (i.e. Design, Manufacturing, Assembly/Packaging/Test, and/or Distribution), indicate the total number of service providers your organization uses both physically located in
the U.S. and physically located outside of the U.S. Next, list up to the ten service providers most important for your organization's continued operations in each of respective functions and provide the corresponding information, as
applicable.
A) Outsourced Design (IP Licensing)
Total Number of Providers Servicing in the U.S.:

Design/IP Provider Name

Total Number of Providers Servicing Outside of the U.S.:
Primary Location of Service
Performance
(select from drop-down)

Primary Product
Category
(select from drop-down)

Percent (%) of Primary
Product Dependent
on Provider

Percent (%) of Products
Dependent Overall
on Provider

Primary Reason for
Service Provider Selection
(select from drop-down)

Availability of Alternative
Service Providers
(select from drop-down)

1
A

2
3
4
5
6
7
8
9

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls

Dropdown:
Dropdown will populate
from answers in tab 3a

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

10
B) Outsourced Manufacturing
Total Number of Providers Servicing in the U.S.:

Manufacturing Provider Name

Total Number of Providers Servicing Outside of the U.S.:
Primary Location of Service
Performance
(select from drop-down)

Primary Product
Category
(select from drop-down)

Percent (%) of Primary
Product Dependent
on Provider

Percent (%) of Products
Dependent Overall
on Provider

Primary Reason for
Service Provider Selection
(select from drop-down)

Availability of Alternative
Service Providers
(select from drop-down)

1
B

2
3
4
5
6
7
8
9

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls

Dropdown:
Dropdown will populate
from answers in tab 3a

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

C) Outsourced Assembly/Packaging/Test
Total Number of Providers Servicing in the U.S.:

Assembly/Packaging/Test Provider Name

Total Number of Providers Servicing Outside of the U.S.:
Primary Location of Service
Performance
(select from drop-down)

Primary Product
Category
(select from drop-down)

Percent (%) of Primary
Product Dependent
on Provider

Percent (%) of Products
Dependent Overall
on Provider

Primary Reason for
Service Provider Selection
(select from drop-down)

Availability of Alternative
Service Providers
(select from drop-down)

1
C

2
3
4
5
6
7
8
9

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls

Dropdown:
Dropdown will populate
from answers in tab 3a

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

10
D) Outsourced (Third-Party) Distribution
Total Number of Providers Servicing in the U.S.:

Distribution Provider Name

Total Number of Providers Servicing Outside of the U.S.:
Primary Location of Service
Performance
(select from drop-down)

Primary Product
Category
(select from drop-down)

Percent (%) of Primary
Product Dependent
on Provider

Percent (%) of Products
Dependent Overall
on Provider

Primary Reason for
Service Provider Selection
(select from drop-down)

Availability of Alternative
Service Providers
(select from drop-down)

1
D

2
3
4
5
6
7
8
9

Dropdown:
Dropdown will populate
from answers in tab 3a

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

OMB Control No. 0694-0119

Previous Page
Section 5: Material and Input Suppliers

For each material and input category, provide the total number of suppliers your organization uses for its facilities located in the U.S. (Part A) and its facilities located outside of the U.S. (Part B); then, provide the corresponding information for each material and
input category your organization sources, as applicable. Note, estimates for lead time and inventory levels are acceptable.
A) U.S. Facilities
Material and Input
Category
1 Wafer
a Bulk Silicon
b Other
c Other
2 Photoresist
3 Photomask
4 Gases
5 Wet Chemicals
A 6 CMP Slurry
7 PVD Targets
8 ALD/CVD Materials
9 Electroplating Metals
10 Spin-on Dielectrics
11 Leadframes
12 Packaging Substrates
13 Ceramics
14 Bonding Wire
15 Die Attach Material
16 Encapsulation Resins
17 Other
18 Other
19 Other
20 Other
B) Non-U.S. Facilities

Total # of Suppliers Percent (%) Supplied
Primary Reason for
Physically Located
by U.S Based
Supplier Selection
in the U.S.
Suppliers
(select from drop-down)

Availability of Alternate
Suppliers
(select from drop-down)

Lead Time
(Weeks)

2018 Inventory Levels
(Weeks of Supply)

2022 Inventory Levels
(Weeks of Supply)

Optimal Inventory Levels
(Weeks of Supply)

2022 Inventory Levels
(Weeks of Supply)

Optimal Inventory Levels
(Weeks of Supply)

0
(Specify Here)
(Specify Here)

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls
‐ Other

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

(Specify Here)
(Specify Here)
(Specify Here)
(Specify Here)

Material and Input
Category
1 Wafer
a Bulk Silicon
b Other
c Other
2 Photoresist
3 Photomask
4 Gases
5 Wet Chemicals
B 6 CMP Slurry
7 PVD Targets
8 ALD/CVD Materials
9 Electroplating Metals
10 Spin-on Dielectrics
11 Leadframes
12 Packaging Substrates
13 Ceramics
14 Bonding Wire
15 Die Attach Material
16 Encapsulation Resins
21 Other
22 Other
23 Other
24 Other

Total
Suppliers

Total # of Suppliers Percent (%) Supplied
Primary Reason for
Physically Located
by U.S Based
Supplier Selection
in the U.S.
Suppliers
(select from drop-down)

Availability of Alternate
Suppliers
(select from drop-down)

Lead Time
(Weeks)

2018 Inventory Levels
(Weeks of Supply)

0
(Specify Here)
(Specify Here)

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls
‐ Other

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

(Specify Here)
(Specify Here)
(Specify Here)
(Specify Here)

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Previous Page
Section 5b: Material and Inputs of Concern

For each material and input category that your organization sources, name up to three of the most essential material and inputs that your organization has difficulty acquiring. When reporting the supplier’s country, provide the country where the supplier is physically located not the country where the supplier’s headquarters are located.

Material and Input Category

1 Wafer
2 Photoresist
3 Photomask
4 Gases
5 Wet Chemicals
6 CMP Slurry
7 PVD Targets
8 ALD/CVD Materials
9 Electroplating Metals
10 Spin-on Dielectrics
A

11 Leadframes
12 Packaging Substrates

13 Ceramics

14 Bonding Wire
15 Die Attach Material
16 Encapsulation Resins
17 Other: N/A
18 Other: N/A
19 Other: N/A
20 Other: N/A
21 Other: N/A
22 Other: N/A
23 Other: N/A
24 Other: N/A

Name of Material or Input of
Concern
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3

Level of Difficulty to
Acquire
(select from drop-down)

Dropdown:
‐ None
‐ Minor
‐ Moderate
‐ Great
‐ Extreme

Primary Product Affected
(select from drop-down)

Primary Supplier
Supplier Name

Supplier Country

Secondary Supplier
Percent (%)
Supplied

Supplier Name

Supplier Country

Dropdown:
Dropdown will populate
from answers in tab 3a

Percent (%)
Supplied

Lead Time
(Weeks)

Inventory Levels (Weeks of Supply)
2018

2022

Optimal

Do you anticipate difficulties to acquire this
material/input in the future?
Level of Dificulty

Dropdown:
‐ None
‐ Minor
‐ Moderate
‐ Great
‐ Extreme

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Explain

OMB Control No. 0694-0119

Previous Page
Section 6: Equipment Suppliers
For each equipment category, provide the total number of suppliers your organization uses for its facilities located in the U.S. (Part A) and its facilities located outside of the U.S. (Part B); and provide the corresponding information, as applicable.

A) U.S. Facilities
Equipment Category
1
2
3
4
5
A
6
7
8
9
10
11
12
13
14
15

Total Number
of Suppliers

Primary Equipment
Supplier Name

Primary Supplier
Country

Description/
Specific Tool

Average Lead Time by Equipment Wafer Size
(Weeks) (as applicable)
<=150mm

200mm

300mm

Design Tools and EDA Software
Deposition
RTP and Oxidation Diffusion
Lithography
Photoresist Processing
Material Removal and Cleaning
Diffusion/Ion Implantation (doping)
Process Control (Metrology and Inspection)
Manufacturing Automation
Other Wafer Fabrication Equipment
Test and Related Equipment
Assembly Equipment
Other
(Specify Here)
Other
(Specify Here)
Other
(Specify Here)

No Size

Primary Reason for
Primary
Supplier Selection
Challenge/Concern
(select from drop-down) (select from drop-down)

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls
‐ Other

Availability of Alternate
Suppliers
(select from drop-down)

Dropdown:
‐ Aging equipment
‐ Maintenance
‐ Energy Cost
‐ Purchase Cost
‐ Regulation/Export Controls
‐ Obsolescence
‐ Throughput
‐ Other (Specify Here)

Additional Comments

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

B) Non-U.S. Facilities

Equipment Category

Total Number
of Suppliers

Primary Equipment
Supplier Name

Primary Supplier
Country

Description/
Specific Tool

Average Lead Time by Equipment Wafer Size
(Weeks) (as applicable)
<=150mm

1
2
3
4
B 5
6
7
8
9
10
11
12
13
14
15

200mm

300mm

Primary Reason for
Primary
Supplier Selection
Challenge/Concern
(select from drop-down) (select from drop-down)

Availability of Alternate
Suppliers
(select from drop-down)

Additional Comments

No Size

Dropdown:
‐ Financial Consideration
‐ Technical Specification
‐ Existing Relationship
‐ Delivery Time
‐ Proximity
‐ Quality
‐ Export Controls
‐ Other

Dropdown:
‐ Aging equipment
‐ Maintenance
‐ Energy Cost
‐ Purchase Cost
‐ Regulation/Export Controls
‐ Obsolescence
‐ Throughput
‐ Other (Specify Here)

Export Controls

Dropdown:
‐ No impact
‐ Great Impact ‐ Positively
‐ Great Impact ‐ Negatively
‐ Moderate Impact ‐ Positively
‐ Moderate Impact ‐ Negatively
‐ Low Impact ‐ Positively
‐ Low Impact ‐ Negatively

1 What is your organization's outlook for equipment supply over the next three years?

2 Indicate the impact of export controls on your production levels and provide an explanation below.

C
3 Have export controls affected your organization's equipment acquisition processes? If yes, provide an explanation below.

4 Has your organization experienced loss of sales opportunities due to export controls? If yes, provide an explanation below.

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Dropdown:
‐ Yes, positively
‐ Yes, negatively
‐ No

Dropdown:
‐ None ‐ Sole Global Source
‐ Yes ‐ U.S. Alternate Available
‐ Yes ‐ Only non‐U.S. Alternate Available

OMB Control No. 0694-0119

Section 7: Current and Future End Use
For each commercial and defense end use segment that your organization supports, provide the following estimates for both current end uses (Part A) and future/expected end uses in the next five and ten years
(Part B):
(a) the percentage (%) of your organization's total revenue attributed to the end use overall, (b) the percentage (%) of (a) attributed to U.S. sales in the end use, (c) the primary non-U.S. country of end use, (d) the total percentage
(%) of (a) attributed to its primary country of end use, and (e) the percentage (%) of the end use segment using advanced packaging.
Example: Your organization's total revenue is split 50/50 between the Automotive and Commercial Aerospace end uses. Of the percentage of total revenue attributed to each respective end use, 50% of the Automotive and 100%
of the Commercial Aerospace end use total revenue is attributed to U.S. sales. Overall, 75% of your organization's total revenue is attributed to U.S. sales across its end uses.

Commercial End Use
Automotive
Commercial Aerospace
Total Commercial

(a)
Percent (%) of Total
Revenue

(b)
Percent (%) of End Use Total Revenue
from U.S. Sales

50%
50%

50%
100%

100%

75%

Next, in each Total Commercial and Total Defense row in both Part A (current end uses) and Part B (future/expected end uses), identify the primary non-U.S. country of respective total end use, the percentage (%) of total revenue
attributed to the primary country, and the percentage (%) of the respective total end use using advantaged packaging.
A) Current End Use (Estimated)
(a)
Commercial End Use

Percent (%) of Total
Revenue

(b)
Percent (%) of End Use
Total Revenue from
U.S. Sales

(c)

(d)

(e)

Primary Non-U.S. Country of End Use
(select from drop-down)

Percent (%) of End Use Total
Revenue to Primary Country

Percent (%) of End Use Using
Advanced Packaging

(B)

Appliances/Consumer Goods

0.00%
0.00%
0.00%
0.00%
0.00%
0.00%
0.00%
0.00%
0.00%
0.00%

Automotive
Commercial Aerospace
Healthcare/Medical
Industrial
IT/Computers - Personal and Consumer Products
IT/Computers - Servers
Mobile Devices
Network Infrastructure
Other
Total Commercial (Current)

Defense End Use

Percent (%) of Total
Revenue

Percent (%) of End Use
Total Revenue from
U.S. Sales

U.S. Defense
Foreign Defense
Total Defense (Current)

Primary Non-U.S. Country of End Use
(select from drop-down)

Percent (%) of End Use Total
Revenue to Primary Country

Percent (%) of End Use Using
Advanced Packaging
0.00%
0.00%

(a)

(b)
Percent (%) of End Use
Total Revenue from
U.S. Sales

B) Future/Expected End Use (Estimated)

Commercial End Use

Percent (%) of Total
Revenue
2027

2032

2027

2032

(c)

(d)

(e)

Primary Non-U.S. Country of End Use
(select from drop-down)

Percent (%) of End Use Total
Revenue to Primary Country

Percent (%) of End Use Using
Advanced Packaging

2027

2032

2027

2032

2027

2032

Appliances/Consumer Goods
Automotive
Commercial Aerospace
Healthcare/Medical
Industrial
IT/Computers - Personal and Consumer Products
IT/Computers - Servers
Mobile Devices
Network Infrastructure
Other
Total Commercial (Future/Expected)

Defense End Use

Percent (%) of Total
Revenue

Percent (%) of End Use
Total Revenue from
U.S. Sales

2027

2032

2027

2032

Primary Non-U.S. Country of End Use
(select from drop-down)
2027

2032

U.S. Defense
Foreign Defense

Percent (%) of End Use Total
Revenue to Primary Country
2027

2032

(B)
2027
0%
0%
0%
0%
0%
0%
0%
0%
0%
0%

Percent (%) of End Use Using
Advanced Packaging
2027

2032
0%
0%

Total Defense (Future/Expected)
Comments

BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Section 8: Supply Chain and Risk Management
Does your organization have a supply chain risk management (SCRM) program?
What software, subscriptions, and/or tools do your organization use to help anticipate and monitor supply chain risks (e.g. disruptions, bottlenecks, delays, etc.)?

Dropdown:

- Yes
- No

What protocols do your organization have in place to mitigate supply chain risks (e.g. bottlenecks, disruptions, delays, etc)? Please explain.

For the below supply chain practices or features, identify how your organization's activities (a) have changed since 2017 and (b) are expected to change from 2022 to 2027.

Item

1
2
3
4
5
6
7
8
9
10
11
12
13

Redundancy of suppliers
Localized supply chains
Target inventory levels
Length of supplier contracts
Length of customer contracts
Use of non-cancellable supplier contracts
Use of non-cancellable customer contracts
Number of supply chain management workers
Use of distributors
Use of supply chain modeling and forecasting
Use of shipping and receiving ports
Other
(Specify Here)
Other
(Specify Here)

Change since
2017

Explanation of Changes

Expected Changes
from 2022 to 2027

Explanation of Anticipated Changes

Dropdown:

- Increase
- Decrease
- No Change

Please describe your organization's general method for maintaining inventory levels of critical materials:

In the event of an unexpected shutdown, how long would it take your organization to resume normal levels of production? (select from dropdown)
C Identify the three materials/inputs for which your organization expects to have the greatest increase in usage/demand in the next 10 years:
Material/Input

Explanation

1
2
3
Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Dropdown:
- Less than 2 weeks
- About 2 weeks
- About 4 weeks
- About 6 weeks
- About 3 months
- About 6 months
- More than 6 months

OMB Control No. 0694-0119

Previous Page
Section 9: U.S. Employment and Workforce Development
Respond to the questions below pertaining to employment and workforce development in the U.S.
Employment Totals

Record the total number of U.S. Citizen and non-U.S. Citizen full time equivalent (FTE) employees and contractors at your U.S. facilities for each year from 2017 to present, as well as the
percentage of non-U.S. Citizen FTE employees and contractors that are H1-B Visa Holders. Then, indicate the annual turnover rate for U.S. Citizen and non-U.S. Citizen FTE employees.
2017
A

2018

2019

2020

2021

2022

Annual
Turnover Rate

1 U.S. Citizen
2 Non-U.S. Citizen
a % of H1-B Visa Holders
b % from U.S. Arms Embargoed Countries*
*As of the release of this survey this includes: Afghanistan, Belarus, Burma, Cambodia, Central African Republic, China (PRC), Congo, Cuba, Cyprus, Eritrea, Haiti, Iran, Iraq, Lebanon,
Libya, North Korea, Russia, Somalia, South Sudan, Sudan, Syria, Venezuela, and Zimbabwe

Educational Qualifications
Record the total number of current and expected full time equivalent (FTE) employees by qualification. Then, identify the primary job title associated with each educational level and key
challenges associated with recruiting or maintaining employees at each educational level.
2022

2027

Primary Job Title

2032

Explanation of Challenges Recruiting/Maintaining

B No Education Requirement
High School/GED
Certification or Partial College
B.S./B.A.
M.S./M.A.
Doctorate
Vacancies
For each occupation category that your organization employs, indicate the minimum educational qualification required, the average salary, and the average starting salary. Then, record the
number of current employees and number of current vacancies (2022) as well as the number of vacancies expected in the next 5 years (2027) and in the next 10 years (2032) in each category.

Average
Average Salary
Starting Salary
($)
($)

Minimum Educational
Qualification Required
(select from dropdown)

Occupational Categories

Current
Employees

Current
Vacancies

2022

Total Number of Employees
(Expected)
2027

2032

Manufacturing Engineers, Scientists, R&D
C

Dropdown:

Production Line Operations

- No Education Requirement
- High School/GED
- Certification or Partial College
- B.S./B.A.
- M.S./M.A.
- Doctorate

Testing and Quality Control
Information Technology/Computing
Sales, Administrative, and Management
Other

(Specify Here)

Other

(Specify Here)

Workforce Development

Dropdown:

Indicate your organization's level of difficulty
recruiting/training workers with little industry experience.

Explain:

Indicate which of the following methods you currently employ, then rank the top five by their value to your organization's recruitment/training programs:
1
2
3
4
5
6
7
8

Program
Internships
Outreach to K-12
Parternship with local high schools
Partnership with local community college
Partnership with local university
Partnership with semiconductor associations
Participation in career fairs
Direct advertising

Use

Rank

Explanation

Dropdown:
- Yes
- No

9 Outreach to specific communities (e.g., Veterans)
10 Partnership with local American Job Centers
11 Other
12 Other
D

(Specify here)
(Specify here)

Identify the skills necessary for your industry that are currently least available:

If you have had difficulty obtaining and retaining the necessary skilled workforce; what steps could and should the U.S. government pursue to assist industry prevent that difficulty in the future?

What key workforce programs are your organization undertaking to rebuild the semiconductor workforce in the U.S.?

What does your organization offer to employees as part of workforce retention efforts? (e.g. salary/wage increases, bonuses, tuition reimbursement,. etc)

What trainings or certifications does your organization cover for employees?

What percentage of your current employees has received on-the-job training related to the skills identified as necessary for the industry and how often are these trainings conducted?

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

- None
- Minor
- Moderate
- Great
- Extreme

OMB Control No. 0694-0119

Previous Page
Section 10a: Financials

Report the following financial line items for the years 2017 to present.
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
Reporting Schedule:
Income Statement (Select Line Items)

2017

2018

2019

2020

2021

2022
(Estimate)

1 Net Sales (and other revenue)
a. % of U.S. Sales
1.1. % of U.S. sales from U.S. locations
1.2. % of U.S. sales from non U.S. locations
b. % of Non-U.S. Sales
2.1. % of non-U.S. sales from U.S. locations
2.2. % of non-U.S. sales from non-U.S. locations
2 Cost of Goods Sold
3 Total Operating Income (Loss)
4 Earnings Before Interest and Taxes
5 Net Income
Balance Statement (Select Line Items)

Data Confirmation
2020 Net Sales
None

Dropdown:

- Calendar Year
- Fiscal Year

2017

2018

2019

2020

2021

2022
(Estimate)

2017

2018

2019

2020

2021

2022
(Estimate)

1 Cash
2 Inventories
B

3 Current Assets
4 Total Assets
5 Current Liabilities
6 Total Liabilities
7 Retained Earnings
8 Total Owner's Equity
Human Capital Expenditure

a. Total Salary and Wages (Including Benefits)
C 1
b. Estimated costs associated with recruitment
c. Estimated costs associated with workforce training
D On a scale of 1 to 10, estimate your organization's overall financial health (1 being imminent failure and 10 being highly profitable for the forseable future).
Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Dropdown:

-1
-2
-3
-4
-5
-6
-7
-8
-9
- 10

OMB Control No. 0694-0119

Previous Page
Section 10b: Research, Development, and Capital Expenditures
Research & Development (R&D) Expenditure

2017

2018

2019

2020

2021

2022
(Estimate)

2027
(Expected)

2032
(Expected)

2017

2018

2019

2020

2021

2022
(Estimate)

2027
(Expected)

2032
(Expected)

1 Total R&D Investment
a. % of investment in R&D carried out in the U.S.
b. % of investment in R&D carried out outside of the U.S.
Government-Funded R&D
2 Total R&D funding received from U.S. government sources
a. % of R&D funding from U.S. Federal Government
b. % of R&D funding from U.S. State and Local Governments
3 Total R&D funding received from non-U.S. government sources
a. Primary country and % of R&D funding received
A

b. Secondary country and % of R&D funding received
c. Tertiary country and % of R&D funding received
Identify your organization's top anticipated R&D priorities over the next five years and provide a brief description. Next, indicate the percent (%) of funding your organization anticipates to receive from government (both U.S. or non-U.S.), and provide the primary
Country and State source of funding, as applicable.
R&D Priority

Primary Source of Government Funding (as applicable)

Percent (%) of Funding
Anticipated from Government

Description

Country

State

% of Funding

1
2
3
4
5
Capital Expenditure (CapEx)

2017

2018

2019

2020

2021

2022
(Estimate)

2027
(Expected)

2032
(Expected)

1 a. Total CapEx Investment
b. % of investment in the U.S.
c. % of investment outside of the U.S.
Does your organization expect to use the investment tax credit included in Section 107 of the CHIPS Act of 2022 (also
known as the FABS Act)?

Dropdown:
- Yes
- No

2 If Yes, estimate the expected total value of the applicable investment
Does your organization expect to be impacted by the corporate minimum tax included as part of the Inflation
Reduction Act of 2022?

Dropdown:

Explain:

- Yes
- No

In the table below, identify your organization's anticipated top CapEx priorities over the next five to ten years.
For each CapEx priority, select the option from the drop down menu that best aligns with your organization's investment. If the option provided do not represent your organization's investment priority, use the "Other: Specify here:" option to write in your response.
Then, provide a description of the CapEx investment priority. For example, if your organization is investing in equipment, describe the type of equipment that will be acquired through the investment.
For the Product Category, select the two product categories that will be primarily affected by the investment and the respective primary technology node. If you need to report additional product categories, use the comment section at the end of the page. When
providing the "Anticipated Total Cost ($)", indicate the overall cost of the investment, including any governemnt or third party funding.

CapEx Investment
Primary Facility

B
Priority

Product Category
(select from dropdown)

Primary Technology
Node

Year

Anticipated
Total Cost ($)

Percent (%) of Government
Funding

Country

Nanometer (nm)

Description

Primary Source of Government Funding Anticipated
(as applicable)

Dropdown:
2
3
4

- Facility renovation
- Building of a new facility
- Expansion of existing facility
- Equipment
- Other: (Specify Here)

State

Dropdown:
- Analog ICs
- Microcontroller and Microprocessor ICs
- Logic ICs
- Memory ICs
- Discretes
- Optoelectronics
- Sensors & Actuators
- PCBs
- Equipment/Tooling
- Intermediate/End Product
- Test and Design Verification
- Assembly and/or Packaging

5
Have any of your investment projections increased due to unexpected disruptions such as construction delays, licensing issues, labor shortages/increased wages, etc...? If yes, indicate the type of delay, the percent of budget increase attributed to
the delay, the number of days delayed, and provide an explanation.
Type of Delay
(select from dropdown)

Budget Increase
(%)

# of Days Delayed

Dropdown:
- Nanometer (nm)
- Other metric (specify here)

Explain

Dropdown:

1
2
3
4
5
6
7

- No access to Government Funding
- Licensing issues
- Labor shortages
- Materials Shortage
- Construction delays
- Other (Specify Here)

1 Are any of your investment plans currently on hold or pending until government funding is available?
Explain

Dropdown:

C
2 Will investment plans receive foreign funding or incentives if U.S. funding is unavailable?
Explain

- Yes
- No

Dropdown:
- Yes
- No

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Previous Page
Section 11a: Joint Ventures and Partnerships

How many joint ventures does your organization currently participate in?

Dropdown:

Identify your organization's current joint venture relationships, including public/private R&D partnerships. Explain the purpose of each joint venture (e.g. patent licensing, co-production, product integration, after-market support, etc.), as applicable.
Partner Organization/Entity Name

Country

Controlling Shareholder

Year
Initiated

Primary Purpose of Relationship
(select from dropdown)

Explain

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

- Access to financial resources

- Access to government contracts
- Access to Intellectual Property
- Access to suppliers or reduced lead times
- Broaden customer base
- Creation of new technologies or product improvements
- Develop new capabilities
- Improved access to foreign markets (required)
- Improved access to foreign markets (voluntary)
- Improved access to U.S. markets
- Other objective/purpose (Explain)
- Overcome market entry barrier/Geopolitical concerns
- R&D access/coordination
- Reduce Costs
- Risk sharing
- Shared/improved technology or skills
- Tax-related
- Vertical integration

Has your organization had any actions blocked (or failed as a result of lack of government approval) or mandated by a government entity? Such actions might include mergers, acquisitions, joint ventures,
partnerships, sales agreements, licensing agreements, etc.

Dropdown:

If yes, identify the action(s) and government(s) involved.
Actions

- Yes
- No

Explain

Government Involved

1
2
3
4
5
Has your organization received solicitations or requests for partnership from entities that are known/suspected of being state owned or affiliated with foreign government?
If yes, identify each entity and the foreign govenrment, then provide an explanation.
Entity Name
B

Explain

Foreign Government

1
2
3
4
5
Has your organization felt coerced to share technology with a JV partner or government?
If yes, provide the following information for each instance your organization felt coreced to share technology.
Entity Name

Type of Technology

Description

Did the transfer
occur?

Method of Transfer

Country
(if applicable)

Estimated Value (USD) of the
transferred technology

1
2

Dropdown:

- Yes
- No

4
5
Does your organization currently participate in any semiconductor industry consortia? If yes, please provide an explanation.
C
Explain

Dropdown:

Does your organization currently participate in any Cooperatve Research or Production Agreements? If yes, please provide an explanation.

- Yes
- No

D
Explain

Dropdown:

- Yes
- No

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Section 11b: Technology Transfers
Has your organization lost control of its IP to any entity whose primary beneficiary your organization knows or suspects is a foreign government or is affiliated with a foreign government or is
otherwise state-controlled?

Dropdown:

If yes, identify the most recent entities of such transfers, the beneficiary country, the primary method of transfer, the type of IP, and provide an explanation.
Entity Name

Beneficiary Country

1
2
3
4
5
6
7
8
9
10

Primary Method of Transfer

- Yes
- No

Explain

Type of IP

Dropdown:

- Licensing intellectual property
- Joint ventures
- Research collaborations
- Participation in scientific/technical conferences
- Information provided to potential investors
- Non-Disclosure Agreements (NDAs)
- Other (Specify Here)

- Design
- Manufacture
- Both

Has your organization experienced any unauthorized transfers of its microelectronics-related design and manufacturing intellectual property, including trade secrets or confidential business
information, from 2017 to present?
Indicate the methods by which unauthorized transfers of your organization's microelectronics-related design and manufacturing intellectual property, including trade secrets or confidential business information, occurred from 2017
to present, the suspected location of the perpetrator(s), the type of IP, trade secrets or confidential business information that was transferred, and explain.

Method

Suspected Country

Suspected Perpetrator if Known

Cybersecurity intrusions
Planting staff in your organization
Physical break-ins at organization facilities
Business partners
B Dumpster diving
Current employees (other than persons performing R&D within your organization)
Former employees
External IT system contractors
Persons performing R&D within your organization
Organization campus Wi-Fi network interceptions
Disclosure by outside industry analysts/experts
Disclosure by your bankers/financiers
Disclosure by contractors and suppliers
Violation of Non-Disclosure Agreements (NDAs)
Insertion of vulnerabilities in the supply chain
Compromised managed service provider
Phishing/spear-phishing
Other
(Specify Here)
Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Type of IP/ TradeSecrets/
Confidential Business Information

Dropdown:
- Design
- Manufacture
- Both

Explain

Dropdown:
- Yes
- No

OMB Control No. 0694-0119

Previous Page
Section 12: Competitive Factors

Estimate the current percentage of cost of sales by process step, as well as the breakout of the percentage of cost of sales carried out or sourced (a) in the U.S. and (b) outside of the U.S.
Percent (%) of Cost of Percent (%) Carried out
Sales
or sourced in U.S.

Process Step

Percent (%) Carried out
or sourced outside U.S.

Explain

1 Direct Labor
a Design Labor
b Front-End Manufacturing Labor
c Back-End Manufacturing Labor
2 Core IP
3 Fabrication as a Service (Foundry Services)
4 Material Inputs
5 Processed Inputs
6 Energy
7 Water
8
9
10
11

Test and Verification
Assembly and/or Packaging
Transportation
Other

For each of the following factors, indicate whether locating the factor inside the U.S. or outside the U.S. provides the greater competitive advantage. Next, rank your organization's top five factors (1 being the most important; 2 being the
next most important, etc.) when deciding on a location to invest on the expansion or construction of facilities, and explain.
Location with Greatest
Advantage

Factor
Labor Cost
Labor Availability
Labor Quality
Material Cost
Material Availability
Material Quality
Equipment Cost
Equipment Availability
Equipment Quality
R&D Cost
B R&D Quality
Energy Reliability
Environmental Compliance Cost
Export Control Compliance Cost
Export Control Policies
Energy Cost
Renewable Energy Accessibility
Construction Time
Construction Cost
Proximity to Customers
Tax Costs
Government Incentives
Collaboration Benefits
Ability to Protect IP
Other
Other

Country with Greatest
Advantage

Rank

Dropdown:
- U.S.
- Non-U.S
- Neither

(specify here)
(specify here)

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Explain

OMB Control No. 0694-0119

Previous Page
Section 13: Long Term Development and Investment

What factors do you consider when investing on the expansion or construction of facilities? Please list the decision making factors by importance.
Deciding Factor

Explanation

A 1
2
3
4
5

Dropdown:

Which value chain segments are most in need of government incentives and/or financial intervention? (List up to the 3 by order of importance).
Value Chain Segment
(select from dropdown)

Explanation

1
2
3

- Core IP
- Electronic Design Automation (EDA)
- Design
- Test and Verification
- Front-End Manufacturing
- Assembly and/or Packaging
- Equipment and Tooling
- Materials and/or Components
- EMS/PCB Assembly
- R&D
- Distribution/Warehousing
- Other

1 Are there any regulations preventing your organization from constructing, expanding or modernizing any facilities in the U.S.? If yes, provide an explanation.

Dropdown:
- Yes
- No

2 What can the U.S. government do to promote higher investment of microelectronics manufacturing in the United States?

3 What can help your organization’s coordination with local economic development organizations to help facilitate investment?

4 How can the United States government help facilitate the long-term competitiveness of your organization?

B
5

What other economic clusters should the United States Government invest in to help strengthen the semiconductor industry? For example, AI, etc. How could these investments benefit
your company?

How could the United States Government stimulate R&D partnerships within the semiconductor fields and related sectors such as metals, materials, etc at research universities, etc to
help with R&D?

7 What are the most important emerging technologies that your organization is currently exploring or developing?

8 What are the most important emerging technologies for the microelectronics industry as a whole?

9 What are the main obstacles to introducing emerging technologies into broad-scale manufacturing? Are those obstacles larger or smaller in the United States? How and why?

Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Previous Page
Section 14: Challenges

Identify the issues that have impacted your organization between 2017 to present and the issues that you anticipate will impact your organization between 2023 and 2027. Then, rank your organization's top five issues for
both time frames (1 being the most important issue; 2 being the next most important issue, etc.) and explain the affirmative issues where examples and narrative will aid the U.S. Government’s understanding of your
concerns. Then, provide any suggestions for ways the U.S. Government can help mitigate the issue, if applicable.
Explanations and suggested solutions are helpful but not required.
Type of Issue
Aging equipment, facilities, or infrastructure
Aging workforce
Competition - domestic
Competition - foreign
Counterfeit parts

2017 to 2022
-Yes/No-

Rank

Dropdown:
- Yes
- No

2023 to 2027
-Yes/No-

Rank

Explanation of Issue

Dropdown:

- Yes
- No

Cyber security
Environmental regulations/remediation
Export controls/ITAR & EAR
Financing/credit availability
Government acquisition process
Government purchasing volatility
Government regulatory burden
A Healthcare
Industrial espionage - domestic
Industrial espionage - foreign
Input availability (e.g. materials)
Input quality
Intellectual property/patent infringement
Labor availability/costs
Lack of infrastructure
Lack of public R&D partnerships (e.g. universities)
Natural disasters (including disease/quarantine)
Obsolescence
Pension costs
Proximity to customers
Proximity to suppliers
Qualifications/certifications
R&D costs
Reduction in USG demand
Taxes
Trade disputes
Worker/skills retention
(specify here)
Other
(specify here)
Other
(specify here)
Other
Comments
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

Suggested USG Solution/Mitigation

OMB Control No. 0694-0119

Previous Page
Section 15: Certification

The undersigned certifies that the information herein supplied in response to this questionnaire is complete and correct to the best of his/her knowledge. It is a criminal
offense to willfully make a false statement or representation to any department or agency of the United States Government as to any matter within its jurisdiction (18 U.S.C.
1001 (1984 & SUPP. 1197))
Once this survey is complete, first save it to your computer, and then submit the document via [instructions TBA].

Organization Name
Organization's Internet Address
Name of Authorizing Official
Title of Authorizing Official
E-mail Address
Phone Number and Extension
Date Certified
In the box below, provide any additional comments or any other information you wish to include regarding this survey assessment.

How many hours did it take to complete this survey?
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

OMB Control No. 0694-0119

Previous Page
Definitions
Term

General Purpose Analog

General Purpose Analog is sub-divided into specific functional subcategories of Amplifiers/Comparators (Signal Conditioning), Signal Conversion,
Interface, and Power ManagementICs. These subcategories are defined in terms of functionality instead of a specific circuit type. A device should
be classified into one of the following subcategories depending on its primary or dominant function, regardless of the mix of circuitry used in the
device.

Interface

General Purpose Analog ICs whose primary or dominant function is to modify or shape the signal in order to ensure signal integrity for transmission
over a distance through a physical medium such as a wire, cable, waveguide, or tracks within a printed circuit board. These include devices which
shape the signal for transmission over the medium or which reconstructs the received signal after transmission to recover the intended signal
integrity. A device may be classified into this category if at least one of the following is true; the signal at the input of the device is analog in nature,
or the signal at the output of the device is analog in nature. An analog signal is defined as a signal which is continuously varying in voltage or
current over time, and is not a digital signal with discrete levels.

Power Management

General Purpose Analog ICs whose primary or dominant function is to convert, control or distribute DC power. This category includes devices
which convert a source voltage into another voltage which can be used for powering other integrated circuits and which include a management
capability to control the output voltage. AC to DC power conversion should be included in this category. General purpose LED drivers are classified
into the appropriate Regulator category. Only products which are integrated circuits should be classified in this Power Management category.
Discrete devices such as transformers, bridges and inductors used for power conversion should be classified into one of Discrete categories A-E.
Power management ICs designed for use in a specific end application should be classified into the appropriate Application Specific Analog
category of JB-JF.

Signal Conversion

Amplifiers/Comparators

Application Specific Analog

General Purpose Analog ICs whose primary or dominant function is to convert the signal from one form to another for further processing by other
ICs including digital ICs such as a microprocessor or FPGA. The signal before or after conversion should be analog. These include general
purpose devices whose primary function is Analog-to-Digital conversion, Digital-to-Analog conversion, and Voltage-to-Frequency conversion.
Discrete sample-and-hold circuits are part of this category. However, this function is generally integrated into the signal conversion circuit. Analog
switches and multiplexers which are often used with the above converters are included in this category.
General Purpose Analog ICs whose primary or dominant function is to condition or modify the incoming Analog signal to enhance it for further
processing such as signal conversion or interfacing. This category includes devices which provide functions such as signal filtering, signal
amplification, level shifting, buffering or comparison.Current sense amplifiers and trans-impedance amplifiers are included in this category
Among all analog circuits according to the general definition (seethe first paragraph of 3.4.1. Analog), this category includes those, which are
uniquely designed for a specific application and fall in one of the following categories from JB to JF. These circuits may be customer specific or
catalog products for multiple customers sharing the same application. They may be based on any technology and on any methodology of design.

Consumer

Application Specific Analog ICs designed specifically for and used in consumer applications / end equipment. Consumer end equipment is defined
as those which are intended for personal or home use, is usable by all demographics, and are generally used for entertainment, capturing/storing
of images and audio/video for personal consumption, and for home convenience. They are generally designed for use in the home but are
increasingly becoming more and more portable. Included in this category are Digital TVs (DTV), Digital Still Cameras, MP3 players, DVD players,
Set Top Boxes (STB), Game Consoles, Hi-Fi Audio/Video products, Home Entertainment Systems and White Goods.

Computer

Application Specific Analog ICs designed for and used in Computing and Computer applications including computer peripherals. ICs in this
category are reported into the following subcategories based on the function for which they are designed.

Communications
Automotive

Application Specific Analog ICs designed for and used in non-military voice and data communications end equipment and infrastructure. ICs under
this category shall be classified into one of the following subcategories depending on the application for which they are designed.
Application Specific Analog ICs designed for and used in Automotive end equipment.

Industrial & Others

Application Specific Analog ICs designed for and used in Industrial end equipment as defined below, or other applications not specified in JB-JE
above. ICs containing semiconductor sensor elements together with analog circuitry shall be classified into the appropriate category in H99Sensors, irrespective of the analog content and functions of thecircuit.

Diodes

General-purpose signal and switching diodes (rated less than 0.5 AMP), zener diodes, transient protection diodes and RF & microwave diodes.

Transistors with a power dissipation of less than 1W (the power dissipation represents, for lead mounted types, the rating at 25 degrees C free air
Small Signal and Switching Transistors or ambient temperature and, for chassis mounted types, the rating at 25 degrees C case temperature). This category includes all RF and
microwave small signal transistors, dual transistors, field effect transistors and all generalpurpose bipolar small signal transistors.

Power Transistors

Transistors with a power dissipation of 1W or more (the power dissipation represents,for lead mounted types, the rating at 25 degrees C free air or
ambient temperature; and, for chassis mounted types, the rating at 25 degrees C case temperature). This category includes RF and microwave
power transistors, bipolar general purpose power transistors, field effect general purpose power transistors, insulated gate bipolar transistors
(IGBT), Darlington power transistors, multiple chip devices which behave as a single chip device except for higher current and power rating, and
modules assembled from these transistors.

Rectifiers

Includes all discrete rectifiers (rated at 0.5 AMPS average or greater) and assemblies/modules composed thereof.

Thyristors

Includes all unidirectional and bi-directional thyristors and assemblies/modules composed primarily thereof.

All Other Discrete

Includes varactor tuning diodes, selenium rectifiers and other polycrystalline devices, and any other discrete semiconductor device not specifically
listed above.

Digital Bipolar

Includes all digital logic and memory product that is made with bipolar integrated circuitry technology (TTL, ECL, DTL, IIL, RTL, etc.). Included are
general purpose logic (including CML, ECL, EFL, TTL Schottky, Advance Schottky, Standard TTL and other bipolar logic devices), Gate Array,
Standard Cell, bipolar memory and all other bipolar logic circuits (such as FPL, MPU, MCU, micro peripherals, etc.).

MOS General Purpose Logic

Devices in this classification are standard commodity catalog products, usually simple gates, flip-flop circuits and registers. These are used in a
wide range of equipment for applications in various market segments. Excluded are catalog products of any programmable device or any Special
Purpose Application Specific (ASIC) device.

MOS Gate Arrays

Devices in this classification are logic circuits consisting of fixed and regular arrangement of transistor cells forming a matrix of logic gates of
various standard densities. These devices are Customer Specific Integrated Circuits (CSIC) whose design is controlled by customer and are
usually proprietary to a specific customer. The manufacturer provides a standard library of logic gates and provides the necessary design tools
needed to generate a final metallization interconnect mask set

MOS Standard Cells

Standard Cells are circuits consisting of a user-specified arrangement of predefined and fixed sub-circuits of any function (analog, logic or memory,
etc.).

MOS Display Drivers

Devices specifically designed to control and drive flat panel displays such as LCD (liquid crystal display), PDP (plasma display panels), etc

OMB Control No. 0694-0119

MOS Touch Screen Controllers

Consumer

Controller devices which accompany touch screen displays and are capable of determining the location of single or multi-touch gestures, styli and
gloves, using capacitive, resistive or other sensing technologies. These devices are used for interfacing with user’s touches on screen displays, i.e.
the technology typically prevalent in gaming consoles, media tablets, smartphones, notebook PCs, PDAs, satellite navigation devices, digital still
cameras (DSC), etc. Touch screen controllers designed based on any technology, such as firmware, MCU, or logic circuits, should be reported into
this category L4, even though they may have been reported into other categories, such as P5 General MCU, L7a Wireless Communication, Cellular
Phone (under LA MOS Special Purpose Logic), etc.
MOS logic ICs designed specifically for use in consumer equipment such as entertainment, radio, TV, HDTV, Set Top Box, VCR, DVD Player,
personal or home appliance, camera, game, etc.

Computer & Peripherals

MOS ICs designed specifically for use in computer equipment or computer peripherals. Application specific ICs designed specifically for use in (a)
computer systems, (b) rotating computer magnetic and optical disk storage or tape mass storage media (c) other computer periphery applications
(e.g., such as printers, scanners, monitors, keyboards, mice, etc.) are reported in this category.

Communication

MOS ICs designed specifically for voice or data communications applications. These applications include telecommunication network products
such as switching equipment, multiplexing equipment, repeaters and line-conditioning equipment; customer premise equipment such as Centrex,
key systems, PBX; personal communications products (telephone sets including wireless/cellular), modems, facsimile and answering machines,
and tablets. ICs in this category are reported into the following subcategories based on the function for which they are designed.

Automotive

MOS Special Purpose Logic

Multipurpose & Other

MOS DRAM

Other Memory

MOS SRAM

ICs designed specifically for use in auto entertainment, navigation, driver information, engine controls and all other automotive applications.
The devices in this category are either (i) Application Specific Standard Products (ASSP) designed by semiconductor manufacturer or (ii) Customer
Specific Integrated Circuits (CSIC) designed by the customer, all of which are specifically designed for one of the application segments listed
below. In addition to logic circuitry, these ICs may include other functions such as analog, micro or memory, and all or part of the circuitry of the
products may be based on multiple cores, Gate Array technology, Standard Cell technology, FPL technology, or any combination thereof. Touch
Screen Controller devices shall be reported to L4 MOS Touch Screen Controller, including ASSP and CSIC, and those based on any technology.
ICs designed for multiple applications or for industrial, instrument, military or other applications
Dynamic Random Access Memory devices in which bit words (1 bit or longer word length) can be written, stored and read randomly in any desired
sequence. The memory information is volatile and is lost when the power supply voltage is removed

Electrically Erasable PROMs (except Flash Memory) and all other MOS Memory devices not defined in M1, M2, M8 and M7. Specifically includes
serial FIFOs and LIFOs as well as EAROM (Electrically Alterable ROM) and NOVRAM (Non Volatile RAM). Devices in this category are reported
into the following subcategories based on the function for which they are designed
Static Random Access Memory devices are similar to DRAMs except that SRAMs are based on a minimum four transistor memory cell which is
configured into a flip-flop circuit. Some SRAMs do not need to have the memory cells refreshed since the bit information is represented by a steady
state current in one side of the flip-flop and no current in the other, however "Pseudo SRAMs" have a built-in oscillator which enables self
refreshment. Pseudo SRAMs hence behave as a DRAM but are included in M2 for reporting purposes.
Mask Programmable Read Only Memory are non-volatile circuits which have single transistor memory cells that are locked on or off in a predetermined pattern by means of a masking procedure during the fabrication process.

MOS Mask PROM & EPROM

EPROM - Electrically Programmable Read Only Memory devices are non-volatile circuits similar to Mask PROMs except that the memory data
pattern is programmed by electrical means rather than a fixed mask. Included are OTP, One Time Programmable devices, from which the
programmed memory data pattern is not erasable. EPROMs other than OTPs have a window in the package whereby theprogrammed memory
data pattern may be erased using ultra-violet light and then electrically reprogrammed.
A type of EEPROM (Electrically Erasable and Programmable Read Only Memory) in which the memory data is electrically erased by large arrays of
bits rather than by fractions such as bit by bit, classified in the following subcategories:
2M Bit & less - NOR-Type Flash Memory containing up to and including 2 megabits of memory.
4M Bit & less (>2M) – NOR-Type Flash Memory containing more than 2 megabits and up to and including 4 megabits of memory.
8M Bit & less (>4M) – NOR-Type Flash Memory containing more than 4 megabits and up to and including 8 megabits of memory.

NOR Flash Memory

16 M Bit & less (>8M) – NOR-Type Flash Memory containing more than 8 megabits and up to and including 16 megabits of memory.
32 M Bit & less (>16M) – NOR-Type Flash Memory containing more than 16 megabits and up to and including 32 megabits of memory.
64 M Bit & less (>32M) – NOR-Type Flash Memory containing more than 32 megabits and up to and including 64 megabits of memory.
128 M Bit & less (>64M) – NOR-Type Flash Memory containing more than 64 megabits and up to and including 128 megabits of memory.
Greater than 128 M Bit – NOR-Type Flash Memory containing more than 128 megabits of memory.
A type of EEPROM (Electrically Erasable and Programmable Read Only Memory) in which the memory data is electrically erased by large arrays of
bits rather than by fractions such as bit by bit, classified in the following subcategories:

512 M Bit & less – NAND-Type Flash Memory containing up to and including 512 megabits of memory
1 G Bit & less (>512M) – NAND-Type Flash Memory containing more than 512 megabits and up to and including 1 gigabits of memory
2 G Bit & less (>1G) – NAND-Type Flash Memory containing more than 1 gigabits and up to and including 2 gigabits of memory
4 G Bit & less (>2G) – NAND-Type Flash Memory containing more than 2 gigabits and up to and including 4 gigabits of memory
NAND Flash Memory

8 G Bit & less (>4G) – NAND-Type Flash Memory containing more than 4 gigabits and up to and including 8 gigabits of memory
16 G Bit & less (>8G) – NAND-Type Flash Memory containing more than 8 gigabits and up to and including 16 gigabits of memory
32 G Bit & less (>16G) – NAND-Type Flash Memory containing more than 16 gigabits and up to and including 32 gigabits of memory
64 G Bit & less (>32G) – NAND-Type Flash Memory containing more than 32 gigabits and up to and including 64 gigabits of memory
Greater than 64 G Bit – NAND-Type Flash Memory containing more than 64 gigabits of memory

OMB Control No. 0694-0119

MOS MPU

The MPU category includes ICs which execute external instructions and perform system control functions as programmed via software with the
assembly language instructions retrieved from external memory with data read from and written to external RAM devices to perform system
functions. This set up allows the MPU to receive a variety of input commands, manipulate data, direct storage of data and initiate application
commands to the outside world. The most common usage is in Multi-Task Computer systems such as PCs. The ICs in this category include
Complex Instruction Set Computers (CISC) and Reduced Instruction Set Computers (RISC).The architecture is optimized for general-purpose data
processing and includes an instruction decoder, arithmetic logic unit, registers and additional logic to support operation per an assembly language.
There is no addressable ROM or RAM within the device, but may include dedicated registers, ROM for micro code and/or on-chip cache.

MOS MCU

These ICs are stand-alone devices, which perform dedicated or embedded computer functions within an overall electronic system without the need
of other support circuits. Like microprocessors these include an instruction decoder, arithmetic logic unit, registers and support logic (UARTs,
Counter Timers, Comparators, etc.). Unlike microprocessors, MCUs contain some form of ROM, EPROM or Flash Memory, which are programmed
to store customer-supplied instructions. The MCU also incorporates read-write memory (RAM) for temporary storage.The embedded instructions
cause the MCU to perform pre-determined tasks such as controlling functions in TV, VCR, microwave ovens and automobile engines. In more
complex applications the device may need peripheral logic devices or external memory but for simple tasks the device is self-sufficient.

General Purpose MCU

All MCUs including those designed for specific applications and general purposes, other than Smart Cards (i.e. IC cards).

Automotive MCU

MCUs designed for application in automotive entertainment, navigation, driver information, engine controls and all other automotive applications.
Automotive MCUs are classified into (I) P5x Infotainment (Information & Entertainment Systems) and (II) P5y Other Automotive

Smart Card MCU

MCUs specifically designed for use in Smart Cards (i.e. IC cards). Total of the Smart Card MCU is classified into the following three (3) sets of
subcategories, i.e. (i) by Data Bus, (ii) by Application, and (iii) by Interface.

MOS DSP

Displays

Light Sensors

Lamps

Unlike other processors, which usually are embedded in some digital Microcomputer system, DSPs are most commonly used in analog systems to
process real time data. Such systems require conversion of the analog signals to digital and hence the systems need A-D and DA converters,
which may be integrated on the chip of the DSP used in such systems. The DSPs use parallel multipliers with separate program and data areas
(Harvard type architecture), which provide very high-speed performance required in "Sum-of-Product" operations.
Single or Multiple Digit character displays are reported as complete assemblies.
Monolithic and assembled modules that detect presence of light and change it into electrical voltages or currents. Such devices include discrete
and combo sensors, such as Ambient Light Sensors (ALS), Proximity Sensors (including IR LED Emitter in a same package), Color Sensors
(RGB), Ultraviolet Sensors, Heart Rate Sensors, etc.
Discrete solid-state light source (visible only) of any size, shape, color and light intensity.

Opto Couplers & Isolators

The device consisting of optical emitting die (mostly infrared) and a silicon detector which is optically coupled with the emitter. The device may be a
phototransistor, opto triac or opto IC, integrated into a single package. Coupling devices are designed for signal transmission between two
electrically separated circuits. Isolaters perform galvanic and electrical isolation between input and output circuitry by using isolating material. The
change of the output signal is driven by the change of the input signal. These devices are primarily used to protect the microcontroller from
interferences from the power side of the circuitry, in such applications as power supplies, line receivers, computer interfaces, etc.

Optical Switches

Transmissive switches include an emitting die (mostly infrared) and a detector located on the opposite side of the optical axes in a single package,
and the light path is broken or modified by an external physical object. Transmissive switches are used for small distances and narrow objects.
Reflective switches have the emitter positioned next to the detector, and the signal transmission goes by reflection of a dedicated media. Reflective
switches are used for a wide range of distances and objects of different shapes. Interrupters convert mechanical movements into electrical signals.
With these devices, the change of the output signal is made by interrupt or reflection of an infrared beam with a media.

CCD & Other Image Sensors

CCD and all Image Sensors not included under F5b below.

CMOS Image Sensors

Image sensors in CMOS technology including ancillary analog and/or digital circuit functions on the same chip.

Other Optoelectronics

All other optoelectronics devices not specifically listed above, including fiber optic components and solar cells.

Infrared
Laser Pickup
Laser Transmitter
Temperature & Other Sensors
Pressure Sensors
Acceleration & Yaw Rate Sensors
Magnetic Field Sensors
Actuators

Infrared emitters and all detectors. Includes both discrete devices and assembled modules.
Devices generating coherent radiation whose wavelength is generally 0.8um and less, mainly used for optical disk drives.
Devices generating coherent radiation whose wavelength is generally greater than 0.8um, mainly used for optical communications.
All devices for measurement of temperature in gases, liquids or solids, and all other non-optical sensors not included in H2, H3, H4 and H6.
All devices for direct measurement of pressure.
All devices for direct measurement of acceleration and yaw rate or spin rate.
All devices for measuring any kind of magnetic field
Devices with the primary purpose to translate electrical signals into physical actions. These devices may also contain complex digital and/or analog
circuitry that controls the specific actions. This includes, but is not limited to, ink jet nozzles, micro mirrors, solid-state relays, and SAW filters

Applied Research

A systematic study to gain knowledge or understanding necessary to determine the means by which a recognized and specific need may be met.
This activity includes work leading to the production of useful materials, devices, and systems or methods, including design, development, and
improvement of prototypes and new processes.

Authorizing Official

An executive officer of the organization or business unit or another individual who has the authority to execute this survey on behalf of the
organization.

Bare Printed Circuit Board
Basic Research
Capability
Capital Expenditures

A completed, tested circuit board ready to be populated with components to create a working system.
A systematic, scientific study directed toward greater knowledge or understanding of the fundamental aspects of phenomena and of observable
facts.
The ability to perform standardized design and/or manufacturing steps for producing integrated circuit products within an organization's own
facilities and its own employees with little or no outsourcing.
Investments made by an organization in buildings, equipment, property, and systems where the expense is depreciated. This does not include
expenditures for consumable materials, other operating expenses, and salaries associated with normal business operations.

Commercial and Government Entity
(CAGE) Code

A unique identifier for companies doing or seeking to do business with the U.S. Federal Government. The code supports mechanized government
systems and provides a standardized method of identifying a given facility at a specific location. Find CAGE codes at https://cage.dla.mil/search/.

Customer

An entity to which an organization directly delivers the product or service that the facility produces. A customer may be another organization or
another facility owned by the same parent organization. The customer may be the end user for the item but often will be an intermediate link in the
supply chain, adding additional value before transferring the item to yet another customer.

OMB Control No. 0694-0119

Cybersecurity
Data Universal Numbering System
(DUNS)

The body of technologies, processes, and practices designed to protect networks, computers, programs, and data from attack, damage, or
unauthorized access.
A nine-digit numbering system that uniquely identifies an individual business. Find DUNS codes at http://fedgov.dnb.com/webform.

Development

The design, simulation, and testing of a prototype, including experimental software or hardware systems, to validate technological feasibility or
concept of operation in order to reduce technological risk, or provide test systems prior to production approval.

Design Facility

A facility with personnel who use design software, intellectual property blocks, supporting computer systems, and other information technology to
create integrated circuit designs.

Export Controls

1) Regulations administered by the Bureau of Industry and Security (BIS), U.S. Department of Commerce governing the export of dual-use
technologies; 2) International Traffic in Arms Regulations (ITAR) administered by the U.S. Department of State governing products and services
provided specifically for defense applications.

Foundry

For the purpose of this survey a foundry is considered to be a facility that manufactures integrated circuit products for outside organizations as a
business. Foundries are: 1) businesses dedicated solely to manufacturing integrated circuit products for fabless integrated circuit companies and
other businesses; and/or 2) organizations that chiefly design and manufacture their own integrated circuit products, but that also operate a
business of manufacturing IC products for other entities for a fee.

Full Time Equivalent (FTE) Employees

Employees who work for 40 hours in a normal work week. Convert part-time employees into "full time equivalents" by taking their work hours as a
fraction of 40 hours.

Integrated Circuit (IC)
Manufacturing

Analog or digital devices that incorporate transistors, diodes, capacitors, resistors, and other circuit elements that are integrated on a single
substrate (chip), typically silicon.
The production of a working integrated circuit product at a fabrication facility.

Manufacturing Facility

A facility that transforms integrated circuit designs into integrated circuit devices using an array of fabrication equipment including photolithography,
deposition, etch, wafer dicing, and testing tools. These facilities produce functioning die as an end-product, devices that may be built with
electronics-grade silicon or compound semiconductor materials, including gallium arsenide, gallium nitride, indium phosphide, and others.

Non-U.S. Company

For the purpose of this survey, a non-U.S. company is an organization (publicly traded, privately held, for profit, not-for-profit, or non-profit) that is
domiciled at a location outside of the United States. Companies that are a business unit of a parent organization with legal domicile located outside
of the United States are non-U.S. companies.

North American Industry Classification A unique identifier for the category of product(s) or service(s) provided by an organization. Find NAICS codes at
http://www.census.gov/epcd/www/naics.html
System (NAICS) Code

Organization

Outsource
Product/Process Development
Research and Development

Semiconductor

Service
Single Source
Sole Source
Supplier
United States
Wafer Starts Per Week

A company, firm, laboratory, or other entity that owns or controls one or more U.S. establishment(s) capable of designing and/or manufacturing
integrated circuit products. A company may be an individual proprietorship, partnership, joint venture, or corporation including any subsidiary
corporation in which more than 50 percent of the outstanding voting stock is owned by a business trust, cooperative, trustee(s) in bankruptcy, or
receiver(s) under decree of any court owning or controlling one or more establishment.
To obtain goods and/or services by contract from a supplier (domestic or foreign) outside the organization.
Conceptualization and development of a product prior to the production of the product for customers.
Basic and applied research in the engineering sciences, as well as design and development of prototype products and processes.
Elemental materials such as silicon and germanium (or compounds like gallium arsenide) that possess levels of electrical conductivity that are less
than a conductor but greater than an insulator. The properties of these materials and similar ones can be manipulated to affect conductivity
through temperature and/or the use of dopants.
An intangible product (contrasted to a good, which is a tangible product). Services typically cannot be stored or transported, are instantly
perishable, or come into existence at the time they are bought and consumed.
An organization that is designated as the only accepted source for the supply of parts, components, materials, or services, even though other
sources with equivalent technical know-how and production capability may exist.
An organization that is the only source for the supply of parts, components, materials, or services. No alternative U.S. or non-U.S. based suppliers
exist other than the current supplier.
An entity from which your organization obtains inputs, which may be goods or services. A supplier may be another firm with which you have a
contractual relationship, or it may be another facility owned by the same parent organization.
The "United States" or "U.S." includes the 50 states, Puerto Rico, the District of Columbia, Guam, the Trust Territories, and the U.S. Virgin Islands.
The number of semiconductor wafers that can be processed by an integrated circuit production line in a 7-day period.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act

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