Lender's Application Process (LAP)

OMB 1845-0032

The Lender's Application Process (LAP) is submitted by lenders who are eligible for reimbursement of interest and special allowance, as well as Federal Insured Student Loan (FISL) claims payment, under the Federal Family Education Loan Program. The information will be used by ED to update Lender Identification Numbers (LID's), lender names, addresses with 9 digit zip codes, and other pertinent information.

The latest form for Lender's Application Process (LAP) expires 2021-03-31 and can be found here.

Latest Forms, Documents, and Supporting Material

Document Name
Lender's Application Process (LAP) Form and Instruction
Law_20USC1082 (2013 edition).pdf Supplementary Document
30 day 1845-0032 LAP Supporting Statement 2018.docx Supporting Statement A
Lender's Application Process (LAP) Form and Instruction

All Historical Document Collections

201711-1845-001 Approved without change	Extension without change of a currently approved collection	2018-01-23
201501-1845-002 Approved without change	Extension without change of a currently approved collection	2015-04-07
201205-1845-001 Approved without change	Extension without change of a currently approved collection	2012-05-11
200902-1845-001 Approved without change	Revision of a currently approved collection	2009-02-12
200601-1845-001 Approved without change	Extension without change of a currently approved collection	2006-01-12
200212-1845-004 Approved with change	Extension without change of a currently approved collection	2002-12-26
200204-1845-002 Approved without change	Extension without change of a currently approved collection	2002-04-17
200002-1845-003 Approved without change	Extension without change of a currently approved collection	2000-02-11