This ICR is
approved. The Agency is reminded that the collected data is
appropriate for characterizing respondent entities and their
activities only, and is not generally representative of the
industry nor suitable for development of industry-wide emissions
estimates.
Inventory as of this Action
Requested
Previously Approved
04/30/2012
36 Months From Approved
21
0
0
11,426
0
0
116,319
0
0
The U.S. Environmental Protection
Agencys (EPAs) PFC Reduction/Climate Partnership for the
Semiconductor Industry is a voluntary program that promotes
reduction of perfluorocompounds (PFCs). PFCs are the most potent
greenhouse gases (GHG) known with atmospheric lifetimes of up to
50,000 years. These unique chemical compounds are required during
two critical semiconductor manufacturing steps: plasma etching and
CVD chamber cleaning. EPAs Partnership uses a pollution prevention
approach to reduce greenhouse gas emissions and tracks progress by
collecting annual PFC emissions estimates from voluntary
participants. Partnership Companies have committed to reduce their
PFC emissions 10 percent below their 1995 baseline level by 2010.
As a Partner to the industry, EPA serves as a clearinghouse of
technical information on successful strategies for reducing PFC
emissions that are economically, technically, and environmentally
sound. EPA also helps assess the global warming potential of
potential substitute chemicals and publicly recognizes the Partner
Companies achievements. Participation in the program begins with
completion of a Memorandum of Understanding (MOU) that outlines
responsibilities of the PFC Reduction/Climate Partnership. By
joining the Partnership, a Company agrees to submit a
Company-specific annual report, identifying an overall estimate of
PFC emissions by gas, to a third party designated by the
participating Companies. The MOU also specifies that the Partner
Company will direct the designated third party to create a
confidential data depository for the information supplied by the
Partner Company. In addition, the MOU states that the Partner
Company will direct the designated third party to prepare a U.S.
Partnership Annual Report, to be submitted to EPA, that aggregates
PFC emissions estimates, and provides each Partner Companys annual
emissions by gas on a blind or anonymous basis. The Partner
Company also agrees to share with EPA and others in the
semiconductor industry information about successful PFC emission
reduction processes and technologies that the Partner Company
considers nonconfidential. This MOU applies only to PFC emissions
originating from U.S. semiconductor manufacturing sites and can be
terminated by either Party 30 days after the receipt of written
notice by the other Party with no penalties or continuing
obligations. Using the information provided through the Partnership
the EPA is able to (1) evaluate the overall PFC emission reductions
achieved by Partner Companies, (2) develop estimates for the total
U.S. semiconductor emissions, (3) identify new technologies or
processes that reduce PFC emissions, and (4) serve as a technical
clearing-house to provide industry with pertinent information on
emissions estimation and reduction strategies. The Partnership data
is a valuable resource for evaluating current and promoting future
GHG emissions reductions within the semiconductor
industry.
On behalf of this Federal agency, I certify that
the collection of information encompassed by this request complies
with 5 CFR 1320.9 and the related provisions of 5 CFR
1320.8(b)(3).
The following is a summary of the topics, regarding
the proposed collection of information, that the certification
covers:
(i) Why the information is being collected;
(ii) Use of information;
(iii) Burden estimate;
(iv) Nature of response (voluntary, required for a
benefit, or mandatory);
(v) Nature and extent of confidentiality; and
(vi) Need to display currently valid OMB control
number;
If you are unable to certify compliance with any of
these provisions, identify the item by leaving the box unchecked
and explain the reason in the Supporting Statement.