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Lender's Application Process (LAP)
Lender's Application Process (LAP)
OMB: 1845-0032
IC ID: 22244
OMB.report
ED/FSA
OMB 1845-0032
ICR 201205-1845-001
IC 22244
( )
⚠️ Notice: This information collection may be referencing outdated material. More recent filings for OMB 1845-0032 can be found here:
2018-01-23 - Extension without change of a currently approved collection
2015-04-07 - Extension without change of a currently approved collection
Documents and Forms
Document Name
Document Type
Lender's Application Process (LAP)
Form and Instruction
Lender Application Process
Att_Form.doc
Form and Instruction
Information Collection (IC) Details
View Information Collection (IC)
IC Title:
Lender's Application Process (LAP)
Agency IC Tracking Number:
4819
Is this a Common Form?
No
IC Status:
Modified
Obligation to Respond:
Required to Obtain or Retain Benefits
CFR Citation:
Information Collection Instruments:
Document Type
Form No.
Form Name
Instrument File
URL
Available Electronically?
Can Be Submitted Electronically?
Electronic Capability
Form and Instruction
NA
Lender Application Process
Att_Form.doc
Yes
Yes
Fillable Fileable
Federal Enterprise Architecture Business Reference Module
Line of Business:
Education
Subfunction:
Higher Education
Privacy Act System of Records
Title:
FR Citation:
Number of Respondents:
30
Number of Respondents for Small Entity:
0
Affected Public:
State, Local, and Tribal Governments
Percentage of Respondents Reporting Electronically:
95 %
Approved
Program Change Due to New Statute
Program Change Due to Agency Discretion
Change Due to Adjustment in Agency Estimate
Change Due to Potential Violation of the PRA
Previously Approved
Annual Number of Responses for this IC
30
0
0
-28
0
58
Annual IC Time Burden (Hours)
5
0
0
-4
0
9
Annual IC Cost Burden (Dollars)
0
0
0
0
0
0
Documents for IC
Title
Document
Date Uploaded
No associated records found
Blank fields in records indicate information that was not collected or not collected electronically prior to July 2006.