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OMB Control Number: 0694-0119
Expiration Date: [ ]
DEFENSE INDUSTRIAL BASE ASSESSMENT:
Bare Printed Circuit Board Manufacturers
SCOPE OF ASSESSMENT
The U.S. Department of Commerce, Bureau of Industry and Security (BIS), Office of Technology Evaluation, in coordination with the United States Navy, Naval Surface Warfare
Center, Crane Division (NSWC Crane) is conducting an assessment of the U.S. industrial base for manufacturing bare printed circuit board products. The primary goal of this
study is to assist the US defense community in understanding the health and competitiveness of organizations manufacturing bare printed circuit boards for commercial and U.S.
Government applications at facilities located in the United States.
The Secretary of the Navy is the DOD Defense Executive Agent for printed circuit board technology. NSWC Crane is the DOD Executive Agent technical lead for printed circuit
board and interconnect technology. NSWC Crane provides acquisition engineering, in-service engineering, and technical support for sensors, electornics, electronic warfare, and
special warfare weapons.
RESPONSE TO THIS SURVEY IS REQUIRED BY LAW
A response to this survey is required by law (50 U.S.C. App. Sec. 2155). Failure to respond can result in a maximum fine of $10,000, imprisonment of up to one year, or both.
Information furnished herewith is deemed confidential and will not be published or disclosed except in accordance with Section 705 of the Defense Production Act of 1950, as
amended (50 U.S.C App. Sec. 2155). Section 705 prohibits the publication or disclosure of this information unless the President determines that its withholding is contrary to the
national defense. Information will not be shared with any non-government entity, other than in aggregate form. The information will be protected pursuant to the appropriate
exemptions from disclosure under the Freedom of Information Act (FOIA), should it be the subject of a FOIA request.
Not withstanding any other provision of law, no person is required to respond to nor shall a person be subject to a penalty for failure to comply with a collection of information
subject to the requirements of the Paperwork Reduction Act unless that collection of information displays a currently valid OMB Control Number.
BURDEN ESTIMATE AND REQUEST FOR COMMENT
Public reporting burden for this collection of information is estimated to average 13 hours per response, including the time for reviewing instructions, searching existing data
sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other
aspect of this collection of information to BIS Information Collection Officer, Room 6883, Bureau of Industry and Security, U.S. Department of Commerce, Washington, D.C.
20230, and to the Office of Management and Budget, Paperwork Reduction Project (OMB Control No. 0694-0119), Washington, D.C. 20503.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 1 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
I
II
III
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Return to Table of Contents
TABLE OF CONTENTS
Next Page
General Instructions
Definitions
Respondent Profile
Organization Information
Mergers, Acquisitions, Divestitures, and Joint Ventures
Customers and Competitors
Interactions with the USG
Manufacturing Capabilities
Materials and Equipment
Sales
Financial Information
Research & Development
Capital Expenditures
Workforce
Competitive Factors
Cyber Security
Challenges and Outreach Interest
Certification
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
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OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section I: GENERAL INSTRUCTIONS
Next Page
Return to Table of Contents
Your facility is required to complete this bare printed circuit board survey using an Excel template, which can be downloaded from the BIS
website: http://bis.doc.gov/printedcircuitboards. If you are not able to download the survey document, at your requrest BIS staff will e-mail the
Excel survey template directly to you.
A.
For your convenience, a PDF verson of the survey and required drop-down content is available on the BIS website to aid internal data
collection. DO NOT SUBMIT the PDF version of the survey as your response to BIS. Should this occur, your facility will be required to
resubmit the survey in the requested Excel format.
Respond to every question. Surveys that are not fully completed will be returned for completion. Use the comment boxes to provide any
information to supplement responses provided in the survey form. Make sure to record a complete answer in the cell provided, even if the cell
does not appear to expand to fit all the information.
B.
DO NOT CUT AND PASTE RESPONSES WITHIN THIS SURVEY. Survey inputs should be completed by typing in responses or by use of
a drop-down menu. The use of cut and paste can corrupt the survey template. If your survey response is corrupted as a result of cut and
paste responses, a new survey will be sent to your organization for immediate completion.
C. Do not disclose any classified information in this survey form.
D.
E.
Estimates are often acceptable (and in some sections encouraged), but in sections that do not explicitly allow estimates you must contact BIS
survey support staff before including estimates.
Upon completion of the survey, final review, and certification on the final page,transmit the survey via e-mail to:
[email protected].
To arrange for the completed survey to be delivered on CD-ROM or DVD disc by private carrier, contact BIS survey staff.
Questions related to this Excel survey should be directed to:
F. [email protected]. (E-mail is the preferred method of contact).
You may also speak with a member of BIS survey support staff by calling: Stamen Borisson, 202-482-3893; Mark Crawford, 202-482-8239.
For questions related to the overall scope of this Defense Industrial Base assessment, contact:
Brad Botwin, Director, Industrial Studies
Office of Technology Evaluation, Room 1093
U.S. Department of Commerce
G.
1401 Constitution Avenue, NW
Washington, DC 20230
DO NOT submit completed surveys to Mr. Botwin's postal or e-mail address; all surveys must be submitted electronically to
[email protected].
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 3 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section II: Definitions
Term
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Definition
Applied Research
Systematic study to gain knowledge or understanding necessary to determine the means by which a recognized
and specific need may be met. This activity includes work leading to the production of useful materials, devices,
and systems or methods, including design, development, and improvement of prototypes and new processes.
Authorizing Official
Executive officer of the organization or business unit or other individual who has the authority to execute this
survey on behalf of the organization.
A completed, tested circuit board ready to be populated with components to create a working system.
Bare Printed Circuit Board
Basic Research
Systematic, scientific study directed toward greater knowledge or understanding of the fundamental aspects of
phenomena and of observable facts.
Board Thickness
The overall thickness of the base material, all conductive material deposited thereon, and solder mask.
Commercial and Government Entity (CAGE) Code identifies companies doing or wishing to do business with the
U.S. Federal Government. The code is used to support mechanized government systems and provides a
standardized method of identifying a given facility at a specific location. Find CAGE codes at
http://www.logisticsinformationservice.dla.mil/BINCS/begin_search.aspx.
Privileged or proprietary information which, if compromised through alteration, corruption, loss, misuse, or
Commercially Sensitive Information (CSI)
unauthorized disclosure, could cause serious harm to the organization owning it.
Commercial and Government Entity
(CAGE) Code
Customer
Any organization (external or internal entity) for which your company manufactures bare circuit board products.
Data Universal Numbering System
(DUNS)
A nine-digit numbering system that uniquely identifies an individual business. Find DUNS numbers at
http://fedgov.dnb.com/webform.
1) Regulations administered by the Bureau of Industry and Security (BIS), U.S. Department of Commerce
governing the export of dual-use technologies; 2) International Traffic in Arms Regulations (ITAR) administered
by the U.S. Department of State governing products and services provided specifically for defense applications.
Export Controls
External Cloud Service Provider
External Data Storage Provider
A service model in which a company employs an external third-party service provider to maintain, manage, and
back up business data at a remote location away from the company's operating facilities. The use of shared thirdparty storage infrastructure by businesses can reduce capital, operations, storage, and security requirements,
significantly lowering costs. Data is transmitted between the company and the cloud service provider via
networks as needed.
A business that provides external data storage services to your company for data that is not currently held in your
company's main data network work systems.
Flex
A flexible circuit board with printed circuitry on flexible base material consisting of one or more layers
Full Time Equivalent (FTE) Employees
Employees who work for 40 hours in a normal work week. Convert part-time employees into "full time
equivalents" by taking their work hours as a fraction of 40 hours.
A conductive hole with a diameter of 0.005" or less that connects layers of a multi-layer printed circuit board.
Microvias are used in blind and buried vias, but not for through-the-board connections. The term is often used to
refer to any small geometry connection holes created by laser drilling.
Microvia
North American Industry Classification
System (NAICS) Code
Planarization is a mechanical sanding/polishing process to create a flat or planar surface across copper
conductor on circuit boards.
Planarization
A sheet of base dielectric laminate incorporating reinforcing material (typically glass fabric/mat, or aramid
fabric/mat) impregnated with a resin cured to an intermediate stage (i.e. B-stage resin) where it is not fully cured.
Pre-Preg
Product/Process Development
Qualified Manufacturers' List (QML)
Qualifed Products List (QPL)
Rigid
Rigid-Flex
North American Industry Classification System (NAICS) codes identify the category of product(s) or service(s)
provided by an organization. Find NAICS codes at http://www.census.gov/epcd/www/naics.html
Conceptualization and development of a product prior to the production of the product for customers.
A list of manufacturers who have had their products examined and tested and who have satisfied all applicable
U.S. Department of Defense qualification requirements for that product.
A list of products, or family of products, that have met the qualification requirements set forth in the applicable
specification, including appropriate product identification, tests or qualification reference, and the name and plant
address of the manufacturer and authorized distributor.
A rigid circuit board composed of resin and reinforcing material such as fiberglass that contains an electric
conductor in a defined path to connect with devices and terminal connectors.
One or more rigid circuit boards connected by a to a flexible circuit board.
Service
An intangible product (contrasted to a good, which is a tangible product). Services typically cannot be stored or
transported, are instantly perishable, and come into existence at the time they are bought and consumed.
Single Source
An organization that is designated as the only accepted source for the supply of parts, components, materials, or
services, even though other sources with equivalent technical know-how and production capability may exist.
Sole Source
An organization that is the only source for the supply of parts, components, materials, or services. No alternative
U.S. or non-U.S. based suppliers exist other than the current supplier.
Supplier
An entity from which your organization obtains inputs. A supplier may be another firm with which you have a
contractual relationship, or it may be another facility owned by the same parent organization. The inputs may be
goods or services.
United States
Via
Via Structure
The "United States" or "U.S." includes the 50 states, Puerto Rico, the District of Columbia, the island of Guam,
the Trust Territories, and the U.S. Virgin Islands.
A plated feed-through hole that is used to route a trace vertically in the board from one layer to another. Vias are
not used as connecting devices for component leads or for anchoring reinforcing material.
A description of vias (including microvias) incorporated in a multilayer circuit board product.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
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OMB 0694-0119 PRA ROCIS Submission
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Section III
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Respondent Profile
Next Page
A. Select the description that best identifies your organization:
Design
Capability
B.
What capabilities does this facility have related to the production of bare printed circuit boards?
If your organization has multiple facilities in the United States that manufacture bare printed circuit boards you must
provide separate survey responses for each facility. Indicate at right the description that best describes your
organization's circuit board manufacturing structure.
1. Organization has a single facility in the U.S.
2. Organization has multiple facilities, but only one bare circuit board manufacturing facility in the U.S.
3. Organization has multiple facilities in the U.S. with bare circuit board manufacturing capabilities.
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 5 of 36
Manufacture
Capability
Assembly
Capability
OMB 0694-0119 PRA ROCIS Submission
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Section 1a: Organization Information
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Provide the following information for this facility.
Facility/Organization Name
Street Address
City
A. State
Zip Code
Website
Phone Number
Primary CAGE Code
Provide the following information for your parent organization(s), if applicable.
Parent Organization
Parent Name
Street Address
B. City
State/Province
Country
Postal Code/Zip Code
Parent Primary CAGE Code
C. Is your organization publicly traded or privately held?
D.
Point of Contact regarding this survey:
Name
Title
If your organization is publicly traded, identify its stock ticker
symbol.
Phone Number
E-mail Address
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 6 of 36
State
OMB 0694-0119 PRA ROCIS Submission
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Section 1b: Organization Information (Cont.)
Identify and rank in descending order all entities that directly or indirectly own or have beneficial ownership of five percent or more of your organization (including parent
companies and others):
Entity Name
Percent of
Company Held
Street Address
City
A.
Please provide the following identification codes (see definitions), as applicable, to this facility.
Data Universal Numbering
System (DUNS) Code(s)
NAICS (6-digit) Code(s)*
Find DUNS numbers at:
http://fedgov.dnb.com/webform
Find NAICS codes at:
http://www.census.gov/epcd/www/naics.html
C.
Indicate if your organization qualifies as any of the following types of business:
1
2
D. 3
4
5
6
A small business enterprise (as defined by the Small Business Administration)
8(a) Firm (as defined by the Small Business Administration)
A historically underutilized business zone (HUBZone)
A minority-owned business
A woman-owned business
A veteran-owned or service-disabled veteran-owned business
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 7 of 36
State/Region
Country
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 1c: Organization Information (continued)
Return to Table of Contents
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Estimate the percentage of this facility's bare printed circuit board sales attributable to COMMERCIAL end uses:
A.
Estimate the percentage of this facility's bare printed circuit board sales attributable to DEFENSE end uses:
Commercial Market Segments
From the list below, estimate the percentage of this facility's bare circuit board sales attributable to each COMMERCIAL end use.
Commercial End Use
B.
% of Bare Circuit
Board Sales
Commercial End Use
Aerospace
Industrial Electronics
Automotive
Medical/Healthcare
Communications
Marine (surface and underwater)
Computers/Business Equipment
Space
Consumer Goods
Other
% of Bare Circuit
Board Sales
(specify here)
Defense Market Segments
From the list below, estimate the percentage of this facility's bare circuit board sales attributable to each DEFENSE end use.
Defense End Use
C.
% of Bare Circuit
Board Sales
Defense End Use
Aerospace
Missiles
Command, Control, Communications, Computers,
Intelligence, Surveillance and Reconnaissance (C4ISR)
Marine (surface and underwater)
Electronics
Space
Ground Vehicles
Other
(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 8 of 36
% of Bare Circuit
Board Sales
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 2: Mergers, Acquisitions, Divestitures, and Joint Ventures
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Mergers, Acquisitions, Divestitures
How many mergers, acquisitions, and divestitures has your organization had since 2012?
Identify and describe your organization's five most recent mergers, acquisitions, and divestitures, if applicable.
Organization Name
A.
Type of
Activity
Country
Primary Objective
Year
Explain
1.
2.
3.
4.
5.
Joint Ventures
How many joint ventures does your organization currently participate in?
Identify your organization's current joint venture relationships, including public/private R&D partnerships. Be sure to provide a description of the joint venture's purpose (e.g. patent licensing, co-production,
product integration, after-market support, etc.):
Year
Country
Organization/Entity Name
Primary Purpose of Relationship
Explain
Initiated
1.
2.
3.
4.
B.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
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OMB 0694-0119 PRA ROCIS Submission
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Section 3a: Customers
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Select the primary method this facility uses to find business opportunities with the U.S. Government:
A.
Explain:
Since 2012 has this facility rejected business opportunities due to any of the following?
Yes/No
Circuit board panel production run too small
Insufficient order frequency
Insufficient dollar value of job
B.
Insufficient dollar value of recurring business opportunity
Complexity of job
Customer credit rating
Additional work not needed
Other criteria
(specify here)
C.
Explain
Identify this facility's top 5 U.S. and top 5 non-U.S. direct customers by sales for the past four years. A direct customer is the immediate entity to which you sell your products/services. Customers
can include other business units/divisions within your parent organization. Indicate the type of customer and their location.
Top U.S.-Based Customers
Customer Name
Type of Customer
Customer Name
Type of Customer
Primary End Use
Customer City
Customer State
Customer City
Customer Country
1.
2.
3.
4.
5.
Top Non-U.S.-Based Customers
Primary End Use
1.
2.
3.
4.
5.
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
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OMB 0694-0119 PRA ROCIS Submission
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Section 3b: Competitors
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For each of the following factors, identify whether bare circuit board manufacturers located inside the U.S. or outside the U.S. possess competitive advantages.
Factor
Location with
Advantage
Explain
Labor Costs
Environmental Compliance Costs
Materials Costs
Equipment Costs
Building Space Costs
R&D Costs
A. Supply of Skilled Workers
Export Controls
Overall Finished Board Price
Quality
Performance
Lead Time
Reduced Process Variability
Reduced Cost
Safety Requirements
Increased Yield
Other
(specify here)
Other
(specify here)
Identify your organization's leading U.S. and non-U.S. competitors in the manufacture of bare circuit boards, and select their primary competitive attribute.
Competitor Name
State
Competitor Name
Country
Top U.S. Competitors
Primary Competitive Attribute
Explain
Top Non-U.S. Competitors
Primary Competitive Attribute
Explain
1
2
3
4
B.
5
1
2
3
4
5
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
Page 11 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 4a: Participation in USG Programs
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USG Agency Support
From the list of USG agencies below, select those this facility supports or has supported since 2012. If you support an agency that is not listed, identify it in an "Other" box.
U.S. Air Force
Department of Homeland Security
(DHS)
Other
(select from dropdown)
U.S. Army
National Aeronautics & Space
Administration (NASA)
Other
(select from dropdown)
U.S. Navy
National Oceanic & Atmospheric
Administration (NOAA)
Other
(select from dropdown)
U.S. Marine Corps
Department of Energy (DOE)
Other
(specify here)
U.S. Intelligence Community
(such as CIA, NGA, NRO, NSA)
Missile Defense Agency (MDA)
Other
(specify here)
A.
USG Program Identification
Estimate the total number of USG programs this facility has directly or indirectly supported since 2012.
B.
Identify the USG programs this facility has supported since 2012, and indicate which types of bare circuit boards this facility has manufactured for each program.
USG Program Name
U.S. Government Agency
Bare Circuit Board Types Supporting USG Program
Rigid
Flex
Rigid-Flex
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
Page 12 of 36
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
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Section 4b: USG Interactions
Next Page
Does this facility consider itself dependent on U.S. Government programs for its continued viability?
Explain
A.
If this facility's bare circuit board manufacturing supports USG programs, whether directly or indirectly, are the associated manufacturing
lines integrated with, or separate from, its commercial manufacturing lines?
Explain
From the list below, select impacts that a sudden change in direct and/or indirect U.S. Government defense demand for electronic products containing bare circuit boards would
likely have on your organization and provide an explanation where applicable:
Business Operation
Impact of sudden
DECREASE in USG
Defense Demand
Impact of sudden
INCREASE in USG
Defense Demand
Capital Expenditures
Research & Development Expenditures
Participation in USG Contracts
B. Product/Service Costs
Organization Viability/Solvency
Personnel with Key Skills
Number of Product/Service Lines
Pursuit of Non-U.S. Customers
Level of Key Production Equipment
Movement of Operations to Non-U.S. locations
(specify here)
Other
(specify here)
Other
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 13 of 36
Explanation
OMB 0694-0119 PRA ROCIS Submission
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Return to Table of Contents
Section 5a: Manufacturing Capabilities
Identify the types of bare circuit boards that this facility is currently capable of manufacturing:
Next Page
Tin-Lead
Rigid Conventional Board (single-sided or double-sided)
Rigid Multilayer Board
Rigid High Speed Boards
Rigid High Frequency Boards
A. Rigid Microwave Boards
Flexible Conventional Board (single-sided or double-sided)
Flexible Multilayer Board
Flexible High Speed Boards
Flexible High Frequency Boards
Flexible Microwave Boards
Rigid-Flex Hybrid Boards
Integrated Circuit Package Substrates
What is the minimum inner layer (core) thickness of circuit
B.
board components that this facility can produce?
What is the maximum bare circuit board thickness that this facility
can achieve?
"Printed Electronics" refers to the use of additive printing methods on flexible substrates such as plastic, paper, epoxyfiberglass, textiles, and other electronic devices such as discrete electronic component, sensors, and others.
Does this facility manufacture printed electronics (PE)?
C.
Lead-Free
If yes, identify the PE business activities this facility engages in:
Explain:
If yes, identify the PE business sectors this facility supports:
Explain:
For each type of bare circuit board layer listed below, identify this facility's standard and minimum trace widths, based on specified copper conductor weights:
Trace Width (in inches)
0.25 oz copper
D.
0.5 oz copper
1 oz copper
2 oz copper
3-5 oz copper
6-10 oz copper
10+ oz copper
External Layer: Standard
External Layer: Minimum
Internal Layer: Standard
Internal Layer: Minimum
For each type of bare circuit board layer listed below, identify this facility's standard and minimum space widths, based on specified copper conductor weights:
Space Width (in inches)
0.25 oz copper
E.
0.5 oz copper
1 oz copper
2 oz copper
3-5 oz copper
External Layer: Standard
External Layer: Minimum
Internal Layer: Standard
Internal Layer: Minimum
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 14 of 36
6-10 oz copper
10+ oz copper
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 5b: Manufacturing Capabilities (cont.)
Return to Table of Contents
Next Page
Identify the bare circuit board manufacturing processes that this facility is capable of employing:
Capable of
Using
Process
Photo imaging
Direct imaging
Screen printing
A.
Controlled drilling/milling
Laser ablation
Fully additive plating
Z-axis interconnect technology
Embedded devices (e.g. resistors, capacitors, etc.)
Opto-electronic structures
Capable of
Using
Process
Currently Use
Currently Use
Thermal management structures
Automated electroless copper plating
Automated electrolytic copper plating
Direct metallization plating
Hot air solder level tin-lead
Hot air solder level lead-free
LPI solder mask
Dry film solder mask
Other
(specify here)
Identify this facility's maximum capability for each of the following bare circuit board production factors:
Factor
B.
Maximum per
Board
Explanation
Circuit layers
Sequential laminations
Impedance structures
Stacked micro vias
Staggered micro vias
Identify where the bare circuit board via fill and planarization manufacturing activities are performed for this facility:
-Yes/No-
Process Method
Explanation
This facility
C. Other company-owned U.S. facilities
Other company-owned non-U.S. facilities
Contractor-operated U.S. facilities
Contractor-operated non-U.S. facilities
Identify which of following processes associated with via structures this facility is capable of performing:
Via Formation
D.
Etchback
Chemical smear removal
Micro-via solid copper fill
-Yes/No-
Via Formation
Plasma etch
Laser via formation
Nonconductive via fill
Drilling Process
-Yes/No-
Laser-formed micro via
Mechanically drilled via: through-board
Mechanically drilled via: controlled-depth
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 15 of 36
Maximum
aspect ratio
OMB 0694-0119 PRA ROCIS Submission
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Section 5c: Manufacturing Standards
Identify the standards that this facility currently employs and indicate whether you have a formal certification or apply the standards informally.
Explain
Standard
Use
MIL-PRF 55110
MIL-PRF 50884
MIL-PRF 31032
ISO 9001
AS 9100
NADCAP
IPC 1071
A.
IPC 6011
IPC 6012
IPC 6013
IPC 6015
IPC 6016
IPC 6017
IPC 6018
Other
Other
Next Page
(specify here)
(specify here)
Does this facility have an active technical review board?
B.
Explain:
C.
Identify the primary final circuit board inspection method this facility uses to
assure that manufactured products meet performance requirements.
Are first article inspection capabilities at this facility
compliant with AS 9102?
Explain:
Identify the forms of testing that this facility uses in manufacturing to assure performance and adherence to operational requirements.
Testing Form
Testing Form
-Yes/NoFlying Probe
Impedance Testing with Plots
Interconnect Stress Testing (IST)
D. Bed-of-Nails
Highly Accelerated Stress Testing (HAST)
Isolation 250 Volts DC, 100 MegaOhm Minimum
Highly Accelerated Life Testing (HALT)
Continuity 10 Volts DC, 10 Ohm Maximum
Test all end points, no phase testing
Highly Accelerated Thermal Shock (HATS)
E.
Does this facility use Statistical Process Control with TrueChem or equivalent software specifically to control and automate the management of chemistries, coatings,
and associated circuit board production processes?
Does this facility employ Material Requirements Planning (MRP) software in the operation of its circuit board manufacturing facilities in the U.S.?
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 16 of 36
-Yes/No-
OMB 0694-0119 PRA ROCIS Submission
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Section 5d: Manufacturing Production & Capacity
For each of the years 2012-2015 estimate the average weekly number of inner layers (cores) and completed circuit board panels that this facility
manufactured:
Inner Layer (Core):
A sheet of copper clad dielectric with one or both sides bearing circuit patterns.
Panel:
A.
(1) a double-sided or single-sided rigid structure (double-sided or single-sided panel) or
(2) two or more inner cores laminated together forming a multilayered, rigid structure (multilayer panel).
2012
2013
2014
2015
Average Weekly Inner Layers (Cores) Manufactured
Average Weekly Panels Manufactured
Identify the bare circuit board panel sizes that this facility can produce with its current manufacturing equipment:
B.
Panel Size:
Capability:
24x36
24x30
21x24
18x24
12x24
12x18
9x12
Other
Inner Layers
(Cores)
Panels
Explain:
C. Estimate the 2015 rated weekly manufacturing capacity of this facility in units:
How many 8-hour production shifts does this facility typically operate per day?
How many 8-hour production shifts per day COULD this facility operate practically?
How many 8-hour front-end engineering shifts does this facility typically operate per day?
D.
How many 8-hour front-end engineering shifts perd day COULD this facility operate practically?
Explain:
Estimate this facility's average manufacturing utilization rate for each of the years 2012-2015, as a percentage of production possible under a 7 dayper-week, 24-hour-per-day operation.
Note: a 100% utilization rate equals full operation with no downtime beyond that necessary for maintenance
E.
Examples: Assuming little maintenance downtime, one 8-hour shift, 5 days per week is approximately 25%
capacity utilization; two 8-hour shifts, 7 days per week is approximately 65% capacity utilization.
2012
2013
2014
2015
Estimate how many weeks it would take to raise this facility's production from current levels to 100% capacity utilization:
If this facility already operates at 100% capacity utilization, respond with a "0".
F.
Estimate how many weeks it would take to raise this facility's production from current levels to 150% of your current capacity
utilization:
Explain:
Identify which of the factors below would limit this facility's ability to raise its bare circuit board manufacturing utilization rate to 100% (maximum
current capacity) and to 150% (50% increase from current maximum capacity) to meet a surge in demand.
Scenario:
Explanation
Factor
100%
150%
1 Amount of equipment
G. 2 Availability of equipment
3 Manufacturing space
4 Availability or cost of workforce
5 Quality control
6 Availability of input materials
7 Other (specify in explanation)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 17 of 36
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 5e: Manufacturing Production & Capacity (continued)
How does this facility anticipate the range of bare circuit board product lines it manufactures will change by 2020?
Board Type
Anticipated
Change
Next Page
Explain
Rigid Conventional Board (single-sided or double-sided)
Rigid Multilayer Board
Rigid High Speed Boards
Rigid High Frequency Boards
A.
Rigid Microwave Boards
Flexible Conventional Board (single-sided or double-sided)
Flexible Multilayer Board
Flexible High Speed Boards
Flexible High Frequency Boards
Flexible Microwave Boards
Rigid-Flex Hybrid Boards
Integrated Circuit Package Substrates
How does this facility anticipate it's front-end engineering processing capabilities will change by 2020?
End Use
B.
Anticipated
Change
Explain
Commercial
Defense
1 Does this facility have its own staff on site to perform front-end engineering for manufacturing bare circuit boards?
2
Does this facility perform front-end engineering for manufacturing bare circuit boards as a service to other companies that may have bare circuit boards
manufactured elsewhere?
Does this facility outsource any front-end engineering for bare circuit board products manufactured at this facility?
If yes, does your company notify customers in advance that it outsources front-end engineering for manufacturing bare circuit boards?
C.
3
If this facility outsources front-end engineering for bare circuit board products, indicate the country or countries (including the United States) to which this service is
outsourced:
End Use
-Yes/No-
Country 1
Country 2
Commercial
Defense
Identify the three biggest factors causing production bottlenecks at this facility.
D.
1
Explain:
2
Explain:
3
Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 18 of 36
Country 3
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 6a: Materials & Equipment
Return to Table of Contents
Next Page
For each of the inputs below, state whether you have experienced sourcing problems and identify the principal manufacturers of each material that this facility uses in manufacturing bare circuit boards.
Sourcing Problems
Material
Laminate for use in rigid conventional boards
Laminate for use in rigid multilayer boards
Laminate for use in rigid high speed, high frequency,
and microwave boards
Laminate for use in flex boards
Laminate for use in rigid-flex boards
Copper foil
Other foils
A. Embedded passives, formed, resistors, and
capacitors (active or passive) - tin-lead
Embedded passives, formed, resistors, and
capacitors (active or passive) - lead free
Through-hole and via preparation for plating material
Electrolytic plating material
Via fill, conductive, and non-conductive material
Solder mask
Finish materials
Solder
Etchant
Drill bits
Other
(specify here)
Manufacturers
Total Number of
Experienced
Manufacturers Availability is Supply Chain
Used
a Concern
Disruptions
Since 2012
Two Principal Manufacturer Names
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 19 of 36
Country of Manufacture
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 6b: Materials & Equipment (continued)
If this facility were no longer able to purchase circuit board laminate from your current suppliers, for how many weeks could
1
you continue normal operations?
Next Page
2 How many weeks would it take this facility to obtain material from a new supplier of laminate?
A.
3
Does the reduction in the number of companies in the U.S. that manufacture circuit board laminates and other circuit board-related materials create
material supply problems for this facility?
Explain:
4
How confident is this facility that it would be able to obtain on a timely basis the material necessary to rapidly ramp up bare
circuit board production in the event of a national emergency?
Explain:
Which statement best describes this facility's general method for maintaining inventory levels of laminate and related materials required for the production of circuit boards?
B.
Explain:
Does this facility use either of the following practices for assuring the availability of circuit board-related materials?
1 On-site stocking agreements through which distributors keep a quantity of materials at this facility.
C.
2 Local stocking agreements through which distributors maintain supply warehouses in close proximity to this facility.
Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 20 of 36
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 6c: Materials & Equipment (continued)
Next Page
From the list below identify how many of each type of equipment this facility has. Then, estimate its average age, and indicate your primary concern about continued/future use of this equipment
Equipment
Number of
Functioning
Units On Site
Estimated
Average Age
(in years)
Primary Concern
Explain
Photo film processing
Photo resist application
Photo resist exposure
Photo resist exposure-laser
Photo resist exposure-LED
Develop etch & strip equipment
Automatic optical inspection
Inner layer treatment & layup
Lamination
Drilling - mechanical
A. Drilling - laser
Desmear
Electroless copper
Electrolytic copper
Chemical cleaning
Solder mask
Final finish
Legend print
Routing
Electrical testing
Quality control measurement
Via fill
Scoring
(specify here)
Other
(specify here)
Other
(specify here)
Other
U.S.
Non-U.S.
B. Has this facility had trouble obtaining parts for U.S. or non-U.S. equipment?
Has this facility had trouble obtaining service on U.S. or non-U.S. equipment?
C.
Are there bare circuit board products that this facility is unable to manufacture due
to the limitations of installed equipment?
Explain:
Have you had or do you anticipate having difficulty obtaining new equipment for
manufacturing tin-lead bare circuit boards?
Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 21 of 36
Explanation
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 6d: Materials & Equipment (continued)
Between 2012 and 2015 did this facility encounter product failures that are suspected or confirmed to be attributed
to counterfeit materials used in building bare circuit boards?
Next Page
If so, identify the types of circuit board materials that were suspected or confirmed to be counterfeit products and explain the
impact of the counterfeit.
Prepreg
Explain:
Laminate
Explain:
Soldermask
Explain:
Other
Explain:
A.
(specify here)
Does this facility buy materials for the manufacture of bare circuit boards from sources other than the original
manufacturer or its authorized distributor?
If so, what practices do you regularly use to verify that the materials are genuine and perform to specifications?
Systematic testing of inventory
B.
Confirm production lots and production dates with the original manufacturer
Check authenticity of standards organization certification labels/trademarks
Other
(specify here)
Other
(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 22 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 7: Sales
Return to Table of Contents
Next Page
Provide this facility's sales information for the 2012-2015 to U.S. and non-U.S. customers.
Note: "U.S." means U.S. domestic sales; "Non-U.S." means export sales from U.S. locations.
Government sales include both direct and indirect sales to government customers. All sales with government end uses should be reported as government sales.
Source of Sales Data:
Reporting Schedule:
2012
U.S.
Non-U.S.
Record in $ Thousands, e.g. $12,000.00 = survey input $12
2013
2014
U.S.
Non-U.S.
U.S.
Non-U.S.
A. Total Sales (in $)
Total Government Sales [as a % of line A]
B
All Circuit Board-Related Sales - including design, manufacture, and
assembly (in $)
All Circuit Board-Related Government Sales [as a % of line B]
B
Bare Circuit Board Manufacturing Sales - excluding design and
assembly (in $)
Bare Circuit Board Government Sales [as a % of line C]
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
Page 23 of 36
2015
U.S.
Non-U.S.
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Return to Table of Contents
Section 8: Financials
Provide the following financial line items for your facility/organization below.
Next Page
Note: Facility level data is preferred. If you do not keep this information at a location level, provide data at the closest
level available.
Source of Income Statement Items:
Reporting Schedule:
Income Statement (Select Line Items)
A.
B.
C.
D.
E.
Net Sales (and other revenue)
Cost of Goods Sold
Total Operating Income (Loss)
Earnings Before Interest and Taxes
Net Income
Source of Balance Sheet Items:
Reporting Schedule:
Balance Sheet (Select Line Items)
A.
B.
C.
D.
E.
F.
G.
H.
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2012
2013
2014
2015
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2012
2013
2014
2015
Cash
Inventories
Total Current Assets
Total Assets
Total Current Liabilities
Total Liabilities
Retained Earnings
Total Owner's Equity
Note: Total Assets must equal Total Liabilities plus Total Owner's Equity
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 24 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 9a: Research & Development
Return to Table of Contents
Next Page
A. Does this facility/organization conduct research and development (R&D)?
If No, proceed to Section 10.
In Question B, record this facility's total dollar R&D expenditure and type of R&D expenditure for each of the years 2012 to 2015.
In Question C, identify this facility's R&D funding sources, by percent of total R&D dollars sourced.
Note: Facility level data is preferred. If you do not keep this information at a facility level, provide data at the closest level available.
Source of R&D Data:
Reporting Schedule:
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2012
2013
2014
2015
1 Total R&D Expenditures
2 Basic Research (as a percent of B1)
3 Applied Research (as a percent of B1)
B.
4 Product/Process Development (as a percent of B1)
5 Total of 2 - 4 (must equal 100%)
0%
0%
0%
0%
6 Bare Circuit Board R&D Expenditures (as a percent of B1)
7 Defense-Related Bare Circuit Board R&D Expenditures (as a percent of B1)
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2012
2013
2014
2015
C.
1
2
3
4
5
6
7
8
Total R&D Funding Sources
Internal/Self-Funded/IRAD (as a percent of C1)
Total Federal Government (as a percent of C1)
Total State and Local Government (as a percent of C1)
Universities - Public and Private (as a percent of C1)
U.S. Industry, Venture Capital, Non-Profit (as a percent of C1)
Non-U.S. Investors (as a percent of C1)
Other
(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 25 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 9b: Research & Development (continued)
Return to Table of Contents
Next Page
Identify this facility/organization's anticipated top R&D priorities over the next five years and provide a brief explanation.
Priority
A.
Description
1
2
3
4
5
Identify the key factors driving this facility's investment in research and development and explain how these factors shape this facility's research and
development projects.
Factor
B.
C.
Explain
-Yes/No-
Need for competitive advantage
Customer requirements
Industry roadmap
Other
(specify here)
Other
(specify here)
Other
(specify here)
From 2012-2015, were your organization's R&D expenditures adversely impacted by reductions in U.S. Government defense
spending?
Explain:
Are there specific R&D areas related to bare circuit board manufacturing that DOD could support to improve board performance?
D.
Explain:
What advanced bare circuit board-related technologies should DOD support in order to better enable manufacturers to meet future national security
requirements?
E.
1
Explain:
2
Explain:
3
Explain:
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 26 of 36
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 10: Capital Expenditures
Record this facility's capital expenditures corresponding to the select categories below.
Next Page
Note: Facility level data is preferred. If you do not keep this information at a location level, provide data at the closest level available.
Source of Capital Expenditure Data:
Capital Expenditure Reporting Schedule:
Capital Expenditure Category
A Total Capital Expenditures
1 Machinery, Equipment, and Vehicles [as a % of A]
2 IT, Computers, Software [as a % of A]
3 Land, Buildings, and Leasehold Improvements [as a % of A]
4 Other (specify)
5 Other (specify)
Lines 1 through 5 must total 100%
6
B
Record $ in Thousands, e.g. $12,000.00 = survey input of $12
2012
2013
2014
2015
0%
0%
0%
0%
Bare circuit board-related capital expenditures
[as a % of A]
From 2012-2015, were your organization's bare circuit board-related capital expenditures adversely
impacted by reductions in U.S. Government defense spending?
Explain:
Identify your facility/organization's anticipated top bare circuit board-related capital expenditure priorities over the next five years and provide a
brief explanation.
Priority
Description
1
C
2
3
4
5
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 27 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 11a: Workforce
Return to Table of Contents
Next Page
Record the total number of full time equivalent (FTE) employees in your U.S.-based operations for the 2012-2015 period. Then, estimate the percentage of these
employees that perform the occupations indicated in part A, lines a-i
Note: Facility level data is preferred. If you do not keep this information at a location level, provide data at the closest level available.
Source of Workforce Data:
Reporting Schedule:
A
1 Circuit Board-Related Full Time Equivalent (FTE) Employees
a Administrative, Management, & Legal Staff [as a % of line 1]
b Engineers, Scientists, and R&D Staff [as a % of line 1]
c Facility & Maintenance Staff [as a % of line 1]
d Information Technology Professionals [as a % of line 1]
e Marketing & Sales [as a % of line 1]
f Production Line Workers [as a % of line 1]
g Testing Operators, Quality Control, and Support Technicians [as a % of line 1]
(specify here)
h Other
(specify here)
i Other
Lines a through i must total 100%
2012
2013
2014
2015
0%
0%
0%
0%
Does this facility have difficulty hiring and/or retaining any types of employees?
If yes, identify which occupations, type of difficulty, and provide an explanation.
Occupation
Difficulty
Explanation
Chemist
Chemical Engineer
Electrical Engineer
Mechanical Engineer
Industrial Engineer
Safety Engineer
B Graphic Arts Engineer
Process Engineer
Product Engineer
CAM Software - Job Tooling Tech
Imaging Tech
Silk Screening Tech
Plating Tech
Electrical Testing Tech
Mechanical Drilling Tech
Laser Drilling Tech
Testing Tech
Other
(specify here)
Identify the key workforce issues you anticipate in the next five years.
Issue
Finding U.S. citizens
Finding qualified workers
Finding experienced workers
C Finding workers able to get security clearances
Attracting workers to location
Significant portion of workforce retiring
Employee turnover
Other
(specify here)
Other
(specify here)
-Yes/No-
Explanation
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 28 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 11b: Workforce (continued)
Return to Table of Contents
Next Page
What percentage of this facility's technical staff do you expect to retire within the next five years?
A. What percentage of this facility's technical staff do you expect to have to replace over the next five years?
Explain:
First, estimate the total number of employees you have with each level of work experience and estimate the percentage that are U.S. citizens.
Then, for each technical role, estimate the number of employees you have with each level of work experience.
Over 20 Years
All Employees
Applicable Working Experience
11-20 Years
6-10 Years
Five or Fewer Years
# of Employees
% U.S. Citizens
Note: Double counting is permitted for this section. For example, if an employee serves as both a mechanical drilling tech and a laser drilling tech, she
would be included in both lines.
# of Employees
# of Employees
# of Employees
Chemist
Chemical Engineer
Electrical Engineer
B Mechanical Engineer
Industrial Engineer
Safety Engineer
Graphic Arts Engineer
Process Engineer
Product Engineer
CAM Software - Job Tooling Tech
Imaging Tech
Silk Screening Tech
Plating Tech
Electrical Testing Tech
Mechanical Drilling Tech
Laser Drilling Tech
Testing Tech
Other
(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 29 of 36
# of Employees
OMB 0694-0119 PRA ROCIS Submission
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Section 12a: Competitive Factors
Next Page
What is the primary, if any, significant change in operations that is expected at this facility in the next five years?
A.
Explain:
1
Have recent changes in environmental control regulations adversely affected this facility's capability to compete against circuit board
manufacturers in other countries?
Explain:
Will environmental regulations force this facility to cease manufacturing tin-lead circuit boards?
B.
2
3
If yes, what year is this facility expected to cease
producing tin-lead circuit boards?
Comments:
Do environmental regulations cause this facility to keep smaller quantities of circuit board manufacturing materials in inventory than
what you might otherwise consider optimal?
Explain:
Indicate whether the following factors affect this facility's interest in USG business.
Factor
Reduce Interest in
USG Business
May Cause Facility to
Stop Producing for
USG
Explain
Paperwork/Requirements
C. Slow Payment
Small Production Lots
Insufficient Profit Margin
Infrequent Orders
Intellectual Property Protection
One-off orders
Other
(specify here)
Indicate how DOD requirements to use MIL-PRF-31032 standards affect your costs relative to other existing standards?
Estimated Change Estimated Change
Relative to MIL-P- Relative to IPC-6012
50884C
Class 3
D.
Direct change in fixed costs per slash sheet
Change in recurring costs for maintenance
Added administrative cost of compliance
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
Page 30 of 36
Explain
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Return to Table of Contents
Section 12b: Competitive Factors (continued)
To what extent is this facility's continued ability to manufacture bare circuit boards for USG customers dependent on the viability of your commercial circuit
board business?
Explain
To what extent is this facility's continued ability to manufacture bare circuit boards for commercial customers dependent on the viability of your USG
business?
A.
Explain
Is the return-on-investment (ROI) associated with this facility's DEFENSE-RELATED bare circuit board manufacturing business sufficient relative to capital
requirements and business risk?
Is the return-on-investment (ROI) associated with this facility's COMMERCIAL bare circuit board manufacturing business sufficient relative to capital
requirements and business risk?
Explain
What level of overall industry consolidation do you expect to occur in the U.S. bare circuit board industry in the next five years?
What two key factors do you see driving such a consolidation?
B. Explain:
What level of foreign acquisition of U.S. bare circuit board manufacturers do you expect in the next five years?
Explain:
Which of the following impacts do you anticipate from consolidation in the number of U.S. bare circuit board manufacturing facilities?
Impact
Explain
-Yes/No-
Fewer U.S. materials manufacturers
Greater dependence on non-U.S. materials
Higher material costs
C. Pricing advantage for larger board manufacturers
Small companies less able to compete
Reduced domestic board capability
Shrinkage in manufacturing workforce
Increased market share for non-U.S. companies
Higher prices for bare board customers
Other
Other
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Ac
Page 31 of 36
Next Page
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 12c: Competitive Factors (continued)
Next Page
What impact would each of the following potential USG actions have on your business?
Expected Impact on
Organization
Action
Increased funding of targeted bare circuit board manufacturing technology
R&D
DOD requirement that electronic systems (not ITAR controlled) use circuit
boards made in manufacturing facilities located in the U.S.
A.
DOD adds circuit board laminate and related materials to the Defense
National Stockpile
USG requirement that circuit boards produced for critical systems be
manufactured with laminate and related materials made in the U.S.
DOD requirement for designated types of defense systems to use bare circuit
boards manufactured in the U.S. by certified "trusted" suppliers
DOD requirement that bare circuit board manufacturers of products for
designated defense systems be registered on the Qualified Manufacturers
List (QML) and/or Qualified Products List (QPL)
Other
Other
(specify here)
(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 32 of 36
Explanation
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 13a: Cyber Security
Return to Table of Contents
Next Page
Internal Network
(drop-down)
A. Does your organization's internal network connect to the Internet?
B.
Indicate who is responsible for your organization's internal IT networks:
Indicate who is responsible for your organization's external IT networks:
Does this facility have defined, structured methods for actively protecting the following types of Commercially Sensitive Information (see definitions)?
Commercially Sensitive Information (CSI) Type
-Yes/No-
Explanation
Customer/client information
Financial information and records
Human resources information/employee data
Information subject to export control regulations (EAR and/or ITAR)
C. Intellectual property related information
Internal communications including negotiation points, merger and
acquisition plans, and/or corporate strategy
Manufacturing and production line information
Patent and trademark information
Regulatory/compliance information
Research and development (R&D) related information
Supply chain and sourcing information
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 33 of 36
OMB 0694-0119 PRA ROCIS Submission
Previous Page
Section 13b: Cyber Security (continued)
A.
B.
Return to Table of Contents
Next Page
Have recent cyber incidents across the marketplace caused your organization to increase its information security budget?
Estimate the percentage of your organization's commercially sensitive information that
is stored with:
External Cloud Service Providers
External Data Storage Providers
Does your organization restrict or prohibit your external cloud service or external data storage provider(s) from storing commercially
sensitive information outside of the U.S.?
Indicate the level of impact each of the following types of events attributed to malicious cyber activity has had on this facility since 2012.
Event
Impact Level
Explanation
User idle time and lost productivity because of
downtime or systems performance delays
Disruption to normal operations because of system
availability problems
Damage or theft of IT assets and infrastructure
Incurred cost of damage assessment and remediation
Business interruption
Exfiltration of CSI data
C.
Theft of personnel information
Damage to software and/or source code
Theft of software and/or source code
Damage to company production capabilities or
systems
Destruction of information asset
Reputation loss, market share, and brand damages
Other
(specify here)
Other
(specify here)
Other
(specify here)
Note: The FBI encourages recipients to report information concerning suspicious or criminal activity to their local FBI field office or the FBI's 24/7 Cyber Watch
(CyWatch). Field office contacts can be identified at http://www.fbi.gov/contact-us/field. CyWatch can be contacted by phone at 855-292-3937 or e-mail at
[email protected]. When available, each report submitted should include the date, time, location, type of activity, number of people, and type of equipment
used for the activity, the name of the submitting company or organization, and a designated point of contact.
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 34 of 36
OMB 0694-0119 PRA ROCIS Submission
Return to Table of Contents
Previous Page
Section 14: Challenges and Outreach
Next Page
Identify the issues that have or are expected to impact this facility.
In column A, identify all issues that currently are affecting your business in an adverse way or that are expected to do so in the future.
In column B, rank your top five issues (one being the most important) by selecting numbers one through five, using each rank exactly once.
In column C, provide an explanation for the relevant issues.
C
A
B
Rank Top
Type of Issue
Explanation
Impact
5
Aging equipment, facilities, or infrastructure
Aging workforce
Competition - domestic
Competition - foreign
Counterfeit parts
Cyber security
Environmental regulations/remediation - domestic
Environmental regulations/remediation - foreign
Export controls/ITAR & EAR
Government acquisition process
A. Government purchasing volatility
Government regulatory burden
Healthcare costs
Health and safety regulations
Intellectual property/patent infringement
Labor availability/costs
Material input availability
Obsolescence
Pension costs
Proximity to customers
Proximity to suppliers
Qualifications/certifications
Quality of material inputs
R&D costs
Reduction in commercial demand
Reduction in USG demand
Taxes
Worker/skills retention
(specify here)
Other
There are many federal and state government programs and services available to assist your organization to better compete in the global marketplace. If your organization
would like more information regarding these government programs, select the specific areas of interest below. The Commerce Department will follow-up with your
organization regarding your selections.
Continuous Improvement/
Market Expansion/Business Growth
Lean Manufacturing
B.
Cyber Security
Product Design
Design for Assembly
Prototyping
Design for Manufacturability
Quality Management and Control
Energy and Environmentally Conscious Manufacturing
Small Business Innovation Research (SBIR) and Small Business Technology
Transfer (STTR) contracts
Export Assistance
Supply Chain Optimization
Export Licensing (ITAR/EAR)
Technology Acceleration
Government Procurement Guidelines
Vendor/Material Sourcing
Other
Other
(specify here)
(specify here)
Comments:
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
Page 35 of 36
OMB 0694-0119 PRA ROCIS Submission
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Section 15: Certification
The undersigned certifies that the information herein supplied in response to this questionnaire is complete and correct to the best of his/her
knowledge. It is a criminal offense to willfully make a false statement or representation to any department or agency of the United States
Government as to any matter within its jurisdiction (18 U.S.C.A. 1001 (1984 & SUPP. 1197))
Once this survey is complete, submit it via e-mail to: [email protected]. Be sure to retain a copy for your records and to facilitate any
necessary edits or clarifications.
Facility Name
Organization Name
Organization's Internet Address
Name of Authorizing Official
Title of Authorizing Official
E-mail Address
Phone Number and Extension
Date Certified
In the box below, provide any additional comments or any other information you wish to include regarding this survey assessment.
How many hours did it take to complete this survey?
BUSINESS CONFIDENTIAL - Per Section 705(d) of the Defense Production Act
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| File Type | application/pdf |
| File Title | Circuit Board Survey - Draft 1.53.xls |
| Author | dboylan |
| File Modified | 2015-12-14 |
| File Created | 2015-12-14 |