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Biomedical Engineering Summer Intership Program (BESIP)
NIH Office of Intramural Training & Education Application (OD)
OMB: 0925-0299
IC ID: 200079
OMB.report
HHS/NIH
OMB 0925-0299
ICR 201605-0925-001
IC 200079
( )
⚠️ Notice: This information collection may be referencing outdated material. More recent filings for OMB 0925-0299 can be found here:
2024-05-21 - No material or nonsubstantive change to a currently approved collection
2024-02-23 - Revision of a currently approved collection
Documents and Forms
Document Name
Document Type
Form 2
Biomedical Engineering Summer Intership Program (BESIP)
Form and Instruction
2 BESIP
A02-BESIP.pdf
Form and Instruction
Information Collection (IC) Details
View Information Collection (IC)
IC Title:
Biomedical Engineering Summer Intership Program (BESIP)
Agency IC Tracking Number:
Is this a Common Form?
No
IC Status:
Removed
Obligation to Respond:
Voluntary
CFR Citation:
Information Collection Instruments:
Document Type
Form No.
Form Name
Instrument File
URL
Available Electronically?
Can Be Submitted Electronically?
Electronic Capability
Form and Instruction
2
BESIP
A02-BESIP.pdf
Yes
Yes
Fillable Fileable
Federal Enterprise Architecture Business Reference Module
Line of Business:
Workforce Management
Subfunction:
Training and Employment
Privacy Act System of Records
Title:
FR Citation:
Number of Respondents:
80
Number of Respondents for Small Entity:
0
Affected Public:
Individuals or Households
Percentage of Respondents Reporting Electronically:
0 %
Approved
Program Change Due to New Statute
Program Change Due to Agency Discretion
Change Due to Adjustment in Agency Estimate
Change Due to Potential Violation of the PRA
Previously Approved
Annual Number of Responses for this IC
0
0
-80
0
0
80
Annual IC Time Burden (Hours)
0
0
-80
0
0
80
Annual IC Cost Burden (Dollars)
0
0
0
0
0
0
Documents for IC
Title
Document
Date Uploaded
No associated records found
Blank fields in records indicate information that was not collected or not collected electronically prior to July 2006.