CHIPS Statement of Interest Information Collection

Forms and Documents

Forms and supporting documents for this ICR

Document	Type	Status	Availability
Supporting Statement B - SOI.docx	Supporting Statement B	Uploaded 2023-08-18	Repair queued
Chips SOI Supporting Statement A Final.docx	Supporting Statement A	Uploaded 2023-08-21	Repair queued

IC Document Collections

Information collection document groups

IC ID	Collection	Type	Status	Form
258420	CHIPS Statement of Interest Information Collection	Other-Application	Modified

ICR Details

OMB Control No: 0693-0091	ICR Reference No: 202308-0693-002
Status: Received in OIRA	Previous ICR Reference No: 202302-0693-002
Agency/Subagency: DOC/NIST	Agency Tracking No: MO
Title: CHIPS Statement of Interest Information Collection
Type of Information Collection: Extension without change of a currently approved collection	Common Form ICR:  No
Type of Review Request: Regular	Date Submitted to OIRA: 08/21/2023

table that charts list comparision

	Requested	Previously Approved
Expiration Date	36 Months From Approved	08/31/2023
Responses	500	350
Time Burden (Hours)	250	175
Cost Burden (Dollars)	0	0

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Abstract: The Creating Helpful Incentives to Produce Semiconductors for America Incentives Program (hereafter, “The CHIPS Incentives Program” or “CHIPS”) aims to catalyze long-term growth in the domestic semiconductor industry in support of U.S. economic resilience and national security. The CHIPS Incentives Program can provide direct funding (via grants, cooperative agreements, or other transactions), loans, and loan guarantees (collectively, “CHIPS Incentives”) for eligible projects. CHIPS Incentives will support investments in the construction expansion, and modernization of commercial facilities in the United States for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. The amounts available under the CHIPS Act are as follows: • for CHIPS Direct Funding, up to $38,217,700,000; and • for CHIPS Loans and CHIPS Loan Guarantees, up to $75,000,000,000 in direct loan or guaranteed principal In order to provide funding, CHIPS Incentives seeks applications for funding for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation and mature-node semiconductors. Application forms and instructions will be available at https://applications.chips.gov/. Application packages, or portions thereof, submitted by email , paper, or facsimile will not be accepted. Applications must be submitted electronically at https://applications.chips.gov/. To apply for CHIPS Incentives, each applicant must submit a statement of interest via a form available at https://applications.chips.gov/ at least 21 days before proceeding to the next step of the application process. . Applicants are encouraged to submit the statement of interest as soon as they have decided to pursue a CHIPS Incentive Program application. The statement of interest is designed to help CPO gauge interest in the program and the types of projects and applicants applying, and appropriately prepare staffing to review applications. The statement of interest should provide the following information: • Name of applicant organization and contact information • Estimated date of submission of a pre-application or full-application. • Basic project information, which will be elicited through multiple-choice questions and specific fields in the statement of interest form, including nature of project and potential scope

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Authorizing Statute(s): PL: Pub.L. 117 - 167 9902 Name of Law: The CHIPS and Science Act of 2022
  

Citations for New Statutory Requirements: None

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Associated Rulemaking Information
RIN:	Stage of Rulemaking:	Federal Register Citation:	Date:
	Not associated with rulemaking

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Federal Register Notices & Comments
60-day Notice:	Federal Register Citation:	Citation Date:
	88 FR 22011	04/12/2023
30-day Notice:	Federal Register Citation:	Citation Date:
	88 FR 56797	08/21/2023
Did the Agency receive public comments on this ICR? No

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Number of Information Collection (IC) in this ICR: 1

table that charts list of burden

IC Title	Form No.	Form Name
CHIPS Statement of Interest Information Collection

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ICR Summary of Burden

table that charts list of burden

	Total Request	Previously Approved	Change Due to New Statute	Change Due to Agency Discretion	Change Due to Adjustment in Estimate	Change Due to Potential Violation of the PRA
Annual Number of Responses	500	350	0	150	0	0
Annual Time Burden (Hours)	250	175	0	75	0	0
Annual Cost Burden (Dollars)	0	0	0	0	0	0

Burden increases because of Program Change due to Agency Discretion: Yes

Burden Increase Due to: Miscellaneous Actions

Burden decreases because of Program Change due to Agency Discretion: No

Burden Reduction Due to:

Short Statement: The CHIPS Program Office received more Statements of Interest for the Notice of Funding Opportunity than originally anticipated. As such, CPO has updated the PRA package burden statement.

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Annual Cost to Federal Government: $211,732

Does this IC contain surveys, censuses, or employ statistical methods? No

Does this ICR request any personally identifiable information (see OMB Circular No. A-130 for an explanation of this term)? Please consult with your agency's privacy program when making this determination.     Yes

Does this ICR include a form that requires a Privacy Act Statement (see 5 U.S.C. §552a(e)(3))? Please consult with your agency's privacy program when making this determination.     No

Is this ICR related to the Affordable Care Act [Pub. L. 111-148 & 111-152]? No

Is this ICR related to the Dodd-Frank Wall Street Reform and Consumer Protection Act, [Pub. L. 111-203]? No

Is this ICR related to the American Recovery and Reinvestment Act of 2009 (ARRA)? No

Is this ICR related to the Pandemic Response? No

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Common Form ICR:  No

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On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).

The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:

(a) It is necessary for the proper performance of agency functions;

(b) It avoids unnecessary duplication;

(c) It reduces burden on small entities;

(d) It uses plain, coherent, and unambiguous language that is understandable to respondents;

(e) Its implementation will be consistent and compatible with current reporting and recordkeeping practices;

(f) It indicates the retention periods for recordkeeping requirements;

(g) It informs respondents of the information called for under 5 CFR 1320.8 (b)(3) about:

(i) Why the information is being collected;

(ii) Use of information;

(iii) Burden estimate;

(iv) Nature of response (voluntary, required for a benefit, or mandatory);

(v) Nature and extent of confidentiality; and

(vi) Need to display currently valid OMB control number;

(h) It was developed by an office that has planned and allocated resources for the efficient and effective management and use of the information to be collected.

(i) It uses effective and efficient statistical survey methodology (if applicable); and

(j) It makes appropriate use of information technology.

If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.

Certification Date: 08/21/2023

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