CHIPS Statement of Interest Information Collection
New collection (Request for a new OMB Control Number)
No
Emergency
02/24/2023
Approved with change
02/24/2023
02/08/2023
This collection is approved based on the revised materials provide by Commerce for 6 months only. Should the Department want to use this collection for more than 6 months, a 60 and 30 notice must be published.
table that charts list comparision
Inventory as of this Action
Requested
Previously Approved
08/31/2023
6 Months From Approved
350
0
0
175
0
0
0
0
0
The Creating Helpful Incentives to Produce Semiconductors for America Incentives Program (hereafter, âThe CHIPS Incentives Programâ or âCHIPSâ) aims to catalyze long-term growth in the domestic semiconductor industry in support of U.S. economic resilience and national security.
The CHIPS Incentives Program can provide direct funding (via grants, cooperative agreements, or other transactions), loans, and loan guarantees (collectively, âCHIPS Incentivesâ) for eligible projects. CHIPS Incentives will support investments in the construction expansion, and modernization of commercial facilities in the United States for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors.
The amounts available under the CHIPS Act are as follows:
⢠for CHIPS Direct Funding, up to $38,217,700,000; and
⢠for CHIPS Loans and CHIPS Loan Guarantees, up to $75,000,000,000 in direct loan or guaranteed principal
In order to provide funding, CHIPS Incentives seeks applications for funding for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation and mature-node semiconductors.
Application forms and instructions will be available at https://applications.chips.gov/. Application packages, or portions thereof, submitted by email , paper, or facsimile will not be accepted. Applications must be submitted electronically at https://applications.chips.gov/.
To apply for CHIPS Incentives, each applicant must submit a statement of interest via a form available at https://applications.chips.gov/ at least 21 days before proceeding to the next step of the application process. . Applicants are encouraged to submit the statement of interest as soon as they have decided to pursue a CHIPS Incentive Program application. The statement of interest is designed to help CPO gauge interest in the program and the types of projects and applicants applying, and appropriately prepare staffing to review applications.
The statement of interest should provide the following information:
⢠Name of applicant organization and contact information
⢠Estimated date of submission of a pre-application or full-application. ⢠Basic project information, which will be elicited through multiple-choice questions and specific fields in the statement of interest form, including nature of project and potential scope
The Administration and Congress have identified the low U.S. production of semiconductor chips as a national security risk that must be addressed as quickly as possible. See FACT SHEET: CHIPS and Science Act Will Lower Costs, Create Jobs, Strengthen Supply Chains, and Counter China (Aug. 9, 2022), avail. at https://www.whitehouse.gov/briefing-room/statements-releases/2022/08/09/fact-sheet-chips-and-science-act-will-lower-costs-create-jobs-strengthen-supply-chains-and-counter-china/ (Semiconductor chip technology âforms the foundation of everything from automobiles to household appliances to defense systems. America invented the semiconductor, but today produces about 10 percent of the worldâs supplyâand none of the most advanced chips. Instead, we rely on East Asia for 75 percent of global production. The CHIPS and Science Act will unlock hundreds of billions more in private sector semiconductor investment across the country, including production essential to national defense and critical sectors.â) In order to help address the risk posed by this low U.S. production, Congress passed the CHIPS Act of 2022 (Division A of P.L. 117-167) (the Act). The Act tasks the Secretary of Commerce with carrying out sections 9904 and 9906 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4652, 4654, and 4656) by establishing a semiconductor incentives program to support the domestic production of semiconductors. The program will provide financial assistance awards to incentivize investment in facilities and equipment in the United States for semiconductor fabrication, assembly, testing, advanced packaging, and research and development, thereby increasing U.S. economic and national security by supporting a sustainable, competitive domestic semiconductor industry. Because both Congress and the Administration has identified the current low U.S. production of semiconductor chips as a matter of national security and defense, the Secretary of Commerce is implementing this program on an expedited timeline to meet the identified U.S. economic and national security needs.
Thus, emergency approval of the CHIPS Statement of Interest (SOI) by [February 28, 2023] is essential to prevent public harm under 5 C.F.R. 1320.13(a)(2). Normal clearance would delay implementation of the program, thereby extending the national security and economic risk presented by the U.S. low semiconductor chip production.
On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).
The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:
(i) Why the information is being collected;
(ii) Use of information;
(iii) Burden estimate;
(iv) Nature of response (voluntary, required for a benefit, or mandatory);
(v) Nature and extent of confidentiality; and
(vi) Need to display currently valid OMB control number;
If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.