CHIPS Full-Application Information Collection

ICR 202308-0693-006

OMB: 0693-0094

Federal Form Document

Forms and Documents
Supporting Statement B
Supporting Statement A
IC Document Collections
ICR Details
0693-0094 202308-0693-006
Received in OIRA 202304-0693-001
CHIPS Full-Application Information Collection
Extension without change of a currently approved collection   No
Regular 09/06/2023
  Requested Previously Approved
36 Months From Approved 09/30/2023
140 140
17,500 17,500
0 0

A potential applicant must submit a full application to be officially considered for a CHIPS Incentive Award. The full application will contain extensive, detailed information on the proposed project(s) to enable evaluation of its merits. Because the full application is resource-intensive, the applicant should strongly consider any pre-application feedback when deciding whether to prepare and submit a full application. The Department will engage with the applicant, to seek further information or clarifications, provide feedback, including on the scope of the proposed project(s) and the amount of CHIPS Incentives request, and, ultimately, to negotiate the preliminary terms of a potential award. In connection with moving into comprehensive due diligence, the Department will prepare and offer the applicant a non-binding Preliminary Memorandum of Terms and invite the applicant to the due diligence phase. If a potential applicant has submitted a pre-application, it should not submit a full application until after it receives written feedback on the pre-application. CHIPS Incentive Program will initially prioritize incentives for the fabrication of leading-edge semiconductors. Leading Edge applicants may access the application upon release and may submit a Full-Application no earlier than 31 Mar 2023 or 21 days after submitting a Statement of Interest whichever is later. All other applicants may access the application upon release but will not be able to submit a Full-Application until 26 June 2023 or 21 days after submitting a Statement of Interest whichever is later.


Not associated with rulemaking

  88 FR 22009 04/12/2023
88 FR 60932 09/06/2023

IC Title Form No. Form Name
CHIPS Full-Application Information Collection

  Total Request Previously Approved Change Due to New Statute Change Due to Agency Discretion Change Due to Adjustment in Estimate Change Due to Potential Violation of the PRA
Annual Number of Responses 140 140 0 0 0 0
Annual Time Burden (Hours) 17,500 17,500 0 0 0 0
Annual Cost Burden (Dollars) 0 0 0 0 0 0

Cierra Bean 202 815-2677


On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).
The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:
    (i) Why the information is being collected;
    (ii) Use of information;
    (iii) Burden estimate;
    (iv) Nature of response (voluntary, required for a benefit, or mandatory);
    (v) Nature and extent of confidentiality; and
    (vi) Need to display currently valid OMB control number;
If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.

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