CHIPS Full-Application Information Collection

Forms and Documents

Document Name	Status
Statement B - Full App.docx Supporting Statement B	2023-09-06
Statement A - Full App Final.docx Supporting Statement A	2023-09-06

IC Document Collections

IC ID	Document Title	Status
258879	CHIPS Full-Application Information Collection Other-Cover Page Instruction Guide	Modified

ICR Details

OMB Control No: 0693-0094	ICR Reference No: 202308-0693-006
Status: Received in OIRA	Previous ICR Reference No: 202304-0693-001
Agency/Subagency: DOC/NIST	Agency Tracking No: MO
Title: CHIPS Full-Application Information Collection
Type of Information Collection: Extension without change of a currently approved collection	Common Form ICR:  No
Type of Review Request: Regular	Date Submitted to OIRA: 09/06/2023

	Requested	Previously Approved
Expiration Date	36 Months From Approved	09/30/2023
Responses	140	140
Time Burden (Hours)	17,500	17,500
Cost Burden (Dollars)	0	0

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Abstract: A potential applicant must submit a full application to be officially considered for a CHIPS Incentive Award. The full application will contain extensive, detailed information on the proposed project(s) to enable evaluation of its merits. Because the full application is resource-intensive, the applicant should strongly consider any pre-application feedback when deciding whether to prepare and submit a full application. The Department will engage with the applicant, to seek further information or clarifications, provide feedback, including on the scope of the proposed project(s) and the amount of CHIPS Incentives request, and, ultimately, to negotiate the preliminary terms of a potential award. In connection with moving into comprehensive due diligence, the Department will prepare and offer the applicant a non-binding Preliminary Memorandum of Terms and invite the applicant to the due diligence phase. If a potential applicant has submitted a pre-application, it should not submit a full application until after it receives written feedback on the pre-application. CHIPS Incentive Program will initially prioritize incentives for the fabrication of leading-edge semiconductors. Leading Edge applicants may access the application upon release and may submit a Full-Application no earlier than 31 Mar 2023 or 21 days after submitting a Statement of Interest whichever is later. All other applicants may access the application upon release but will not be able to submit a Full-Application until 26 June 2023 or 21 days after submitting a Statement of Interest whichever is later.

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Authorizing Statute(s): None

Citations for New Statutory Requirements: None

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Associated Rulemaking Information
RIN:	Stage of Rulemaking:	Federal Register Citation:	Date:
	Not associated with rulemaking

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Federal Register Notices & Comments
60-day Notice:	Federal Register Citation:	Citation Date:
	88 FR 22009	04/12/2023
30-day Notice:	Federal Register Citation:	Citation Date:
	88 FR 60932	09/06/2023
Did the Agency receive public comments on this ICR? No

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Number of Information Collection (IC) in this ICR: 1

IC Title	Form No.	Form Name
CHIPS Full-Application Information Collection

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ICR Summary of Burden

	Total Request	Previously Approved	Change Due to New Statute	Change Due to Agency Discretion	Change Due to Adjustment in Estimate	Change Due to Potential Violation of the PRA
Annual Number of Responses	140	140	0	0	0	0
Annual Time Burden (Hours)	17,500	17,500	0	0	0	0
Annual Cost Burden (Dollars)	0	0	0	0	0	0

Burden increases because of Program Change due to Agency Discretion: No

Burden Increase Due to:

Burden decreases because of Program Change due to Agency Discretion: No

Burden Reduction Due to:

Short Statement:

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Annual Cost to Federal Government: $873,032

Does this IC contain surveys, censuses, or employ statistical methods? No

Does this ICR request any personally identifiable information (see OMB Circular No. A-130 for an explanation of this term)? Please consult with your agency's privacy program when making this determination.     Yes

Does this ICR include a form that requires a Privacy Act Statement (see 5 U.S.C. §552a(e)(3))? Please consult with your agency's privacy program when making this determination.     No

Is this ICR related to the Affordable Care Act [Pub. L. 111-148 & 111-152]? No

Is this ICR related to the Dodd-Frank Wall Street Reform and Consumer Protection Act, [Pub. L. 111-203]? No

Is this ICR related to the American Recovery and Reinvestment Act of 2009 (ARRA)? No

Is this ICR related to the Pandemic Response? No

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Common Form ICR:  No

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On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).

The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:

(a) It is necessary for the proper performance of agency functions;

(b) It avoids unnecessary duplication;

(c) It reduces burden on small entities;

(d) It uses plain, coherent, and unambiguous language that is understandable to respondents;

(e) Its implementation will be consistent and compatible with current reporting and recordkeeping practices;

(f) It indicates the retention periods for recordkeeping requirements;

(g) It informs respondents of the information called for under 5 CFR 1320.8 (b)(3) about:

(i) Why the information is being collected;

(ii) Use of information;

(iii) Burden estimate;

(iv) Nature of response (voluntary, required for a benefit, or mandatory);

(v) Nature and extent of confidentiality; and

(vi) Need to display currently valid OMB control number;

(h) It was developed by an office that has planned and allocated resources for the efficient and effective management and use of the information to be collected.

(i) It uses effective and efficient statistical survey methodology (if applicable); and

(j) It makes appropriate use of information technology.

If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.

Certification Date: 09/06/2023

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