CHIPS Full-Application Information Collection

A potential applicant must submit a full application to be officially considered for a CHIPS Incentive Award. The full application will contain extensive, detailed information on the proposed project(s) to enable evaluation of its merits. Because the full application is resource-intensive, the applicant should strongly consider any pre-application feedback when deciding whether to prepare and submit a full application. The Department will engage with the applicant, to seek further information or clarifications, provide feedback, including on the scope of the proposed project(s) and the amount of CHIPS Incentives request, and, ultimately, to negotiate the preliminary terms of a potential award. In connection with moving into comprehensive due diligence, the Department will prepare and offer the applicant a non-binding Preliminary Memorandum of Terms and invite the applicant to the due diligence phase. If a potential applicant has submitted a pre-application, it should not submit a full application until after it receives written feedback on the pre-application. CHIPS Incentive Program will initially prioritize incentives for the fabrication of leading-edge semiconductors. Leading Edge applicants may access the application upon release and may submit a Full-Application no earlier than 31 Mar 2023 or 21 days after submitting a Statement of Interest whichever is later. All other applicants may access the application upon release but will not be able to submit a Full-Application until 26 June 2023 or 21 days after submitting a Statement of Interest whichever is later.

The latest form for CHIPS Full-Application Information Collection expires 2027-02-28 and is listed under ICR 202308-0693-006.