This collection is approved for 6 months only based on the revised materials provided by the Department. Should the Department want to use the collection for more than 6 months, it must publish a 60 and 30 day notice.
table that charts list comparision
Inventory as of this Action
Requested
Previously Approved
01/31/2025
6 Months From Approved
56
0
0
560
0
0
0
0
0
The CHIPS Research and Development (R&D) Office is seeking to collect information needed for implementation of the CHIPS Act of 2022 (Division A of P.L. 117-167) (the Act). The Act tasks the Secretary of Commerce with carrying out sections 9904 and 9906 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4652, 4654, and 4656). This statute aims to catalyze long-term growth in the domestic semiconductor industry in support of U.S. economic resilience and national security. Both the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP), the two largest research and development programs established by Congress through the CHIPS Act of 2022, have a need to expeditiously identify facilities in order to accomplish their statutory missions, which are fundamentally national security initiatives.
This Emergency information collection is needed in conjunction with a phased site selection process that will be used to identify a flagship research and development prototyping facility that is anticipated to become the lynchpin of both the NSTC and NAPMP. The information is important for the Department of Commerce and Natcastâthe purpose-built nonprofit entity which serves as the operator of the NSTC, and which is anticipated to serve as the operator of this flagship facilityâin order to establish at the outset of the site selection process which states and/or territories have existing semiconductor ecosystems that could support this facility. The Department of Commerce is requesting emergency approval of a new information collection that is essential to the mission of the Department of Commerceânamely, swift and robust implementation of the CHIPS Act of 2022 (Division A of P.L. 117-167) (the Act). Both the NSTC and NAPMP have an urgent need to identify facilities in order to accomplish their statutory missions, which are fundamentally economic and national security missions. The NSTC is required âto conduct advanced semiconductor manufacturing, design and packaging research, and prototyping that strengthens the entire domestic ecosystem.â 15 U.S.C. 4656(c)(2)(A).
Please see the submitted Supporting Statement for the emergency justification, in its entirety:
The Department of Commerce is requesting emergency approval of a new information collection that is essential to the mission of the Department of Commerceânamely, swift and robust implementation of the CHIPS Act of 2022 (Division A of P.L. 117-167) (the Act). The Department has determined that collecting this information promptly, prior to expiration of the ordinary time periods established in the Paperwork Reduction Act, is necessary to prevent public harm that would be reasonably likely to result if those time periods were followed. See 44 U.S.C. 3507(j); 5 C.F.R. 1320.13(a). The Act tasks the Secretary of Commerce with carrying out section 9906 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4652, 4654, and 4656). This statute aims to catalyze long-term growth in the domestic semiconductor industry in support of U.S. economic resilience and national security. An expeditious collection of this information is needed in conjunction with a phased site selection process that will be used to identify a flagship research and development prototyping and packaging facility that is anticipated to become the lynchpin of both the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP), the two largest research and development programs established by Congress through the CHIPS Act of 2022. The information is important for the Department of Commerce and Natcastâthe purpose-built nonprofit entity which serves as the operator of the NSTC, and which is anticipated to serve as the operator of this flagship facilityâin order to establish at the outset of the site selection process which states and/or territories have existing semiconductor ecosystems that could support this facility.
Both the NSTC and NAPMP have an urgent need to identify facilities in order to accomplish their statutory missions, which are fundamentally economic and national security missions. The NSTC is required âto conduct advanced semiconductor manufacturing, design and packaging research, and prototyping that strengthens the entire domestic ecosystem.â 15 U.S.C. 4656(c)(2)(A). The NSTC is expected to âsignificantly reduce the time and cost of moving from design idea to commercialization through access to shared facilities, digital assets and technical expertise for advancing design, prototyping, manufacturing, packaging, and scaling of semiconductors and semiconductor-related products.â The NAPMP is expected to âinclude an Advanced Packaging Piloting Facility (APPF) where successful development efforts will be transitioned and validated for scaled transition to U.S. manufacturing. This is a key facility for technology transfer to high-volume manufacturing.â The Department of Commerce and Natcast have determined that co-locating many NSTC- and NAPMP-related capabilities in a single facility would be a significant added value to both programs. Having state-of-the-art semiconductor research and development capabilities in the same location as advanced packaging capabilities would be transformative for the semiconductor ecosystem in the United States, because the boundaries between semiconductor wafer/chip processing and next generation advanced packaging are blurring. Today, technology and researchers in these different domains are separated, and no independent research facilities for such innovations in packaging exist in the United States. A flagship facility with co-located chip/package solutions would accelerate co-optimized solutions at a pace that is not currently possible and set the United States on a path for continued leadershipâat a time when public and private investment in semiconductor research and development by foreign adversaries is substantially increasing.
On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).
The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:
(i) Why the information is being collected;
(ii) Use of information;
(iii) Burden estimate;
(iv) Nature of response (voluntary, required for a benefit, or mandatory);
(v) Nature and extent of confidentiality; and
(vi) Need to display currently valid OMB control number;
If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.
Published FRN.pdf
Supporting Statement_Emergency Clearance Ecosystem Questionnaire_Post FRN_7.15.24 - CLEAN.docx
Ecosystem Questionnaire for States and Territories to Inform CHIPS R&D Facility Site Selection Process