This collection
is approved for 6 months only based on the revised materials
provided by the Department. Should the Department want to use the
collection for more than 6 months, it must publish a 60 and 30 day
notice.
Inventory as of this Action
Requested
Previously Approved
01/31/2025
6 Months From Approved
56
0
0
560
0
0
0
0
0
The CHIPS Research and Development
(R&D) Office is seeking to collect information needed for
implementation of the CHIPS Act of 2022 (Division A of P.L.
117-167) (the Act). The Act tasks the Secretary of Commerce with
carrying out sections 9904 and 9906 of the William M. (Mac)
Thornberry National Defense Authorization Act for Fiscal Year 2021
(15 U.S.C. 4652, 4654, and 4656). This statute aims to catalyze
long-term growth in the domestic semiconductor industry in support
of U.S. economic resilience and national security. Both the
National Semiconductor Technology Center (NSTC) and the National
Advanced Packaging Manufacturing Program (NAPMP), the two largest
research and development programs established by Congress through
the CHIPS Act of 2022, have a need to expeditiously identify
facilities in order to accomplish their statutory missions, which
are fundamentally national security initiatives. This Emergency
information collection is needed in conjunction with a phased site
selection process that will be used to identify a flagship research
and development prototyping facility that is anticipated to become
the lynchpin of both the NSTC and NAPMP. The information is
important for the Department of Commerce and Natcast—the
purpose-built nonprofit entity which serves as the operator of the
NSTC, and which is anticipated to serve as the operator of this
flagship facility—in order to establish at the outset of the site
selection process which states and/or territories have existing
semiconductor ecosystems that could support this facility. The
Department of Commerce is requesting emergency approval of a new
information collection that is essential to the mission of the
Department of Commerce—namely, swift and robust implementation of
the CHIPS Act of 2022 (Division A of P.L. 117-167) (the Act). Both
the NSTC and NAPMP have an urgent need to identify facilities in
order to accomplish their statutory missions, which are
fundamentally economic and national security missions. The NSTC is
required “to conduct advanced semiconductor manufacturing, design
and packaging research, and prototyping that strengthens the entire
domestic ecosystem.” 15 U.S.C. 4656(c)(2)(A).
Please see the submitted
Supporting Statement for the emergency justification, in its
entirety: The Department of Commerce is requesting emergency
approval of a new information collection that is essential to the
mission of the Department of Commerce—namely, swift and robust
implementation of the CHIPS Act of 2022 (Division A of P.L.
117-167) (the Act). The Department has determined that collecting
this information promptly, prior to expiration of the ordinary time
periods established in the Paperwork Reduction Act, is necessary to
prevent public harm that would be reasonably likely to result if
those time periods were followed. See 44 U.S.C. 3507(j); 5 C.F.R.
1320.13(a). The Act tasks the Secretary of Commerce with carrying
out section 9906 of the William M. (Mac) Thornberry National
Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4652,
4654, and 4656). This statute aims to catalyze long-term growth in
the domestic semiconductor industry in support of U.S. economic
resilience and national security. An expeditious collection of this
information is needed in conjunction with a phased site selection
process that will be used to identify a flagship research and
development prototyping and packaging facility that is anticipated
to become the lynchpin of both the National Semiconductor
Technology Center (NSTC) and the National Advanced Packaging
Manufacturing Program (NAPMP), the two largest research and
development programs established by Congress through the CHIPS Act
of 2022. The information is important for the Department of
Commerce and Natcast—the purpose-built nonprofit entity which
serves as the operator of the NSTC, and which is anticipated to
serve as the operator of this flagship facility—in order to
establish at the outset of the site selection process which states
and/or territories have existing semiconductor ecosystems that
could support this facility. Both the NSTC and NAPMP have an urgent
need to identify facilities in order to accomplish their statutory
missions, which are fundamentally economic and national security
missions. The NSTC is required “to conduct advanced semiconductor
manufacturing, design and packaging research, and prototyping that
strengthens the entire domestic ecosystem.” 15 U.S.C.
4656(c)(2)(A). The NSTC is expected to “significantly reduce the
time and cost of moving from design idea to commercialization
through access to shared facilities, digital assets and technical
expertise for advancing design, prototyping, manufacturing,
packaging, and scaling of semiconductors and semiconductor-related
products.” The NAPMP is expected to “include an Advanced Packaging
Piloting Facility (APPF) where successful development efforts will
be transitioned and validated for scaled transition to U.S.
manufacturing. This is a key facility for technology transfer to
high-volume manufacturing.” The Department of Commerce and Natcast
have determined that co-locating many NSTC- and NAPMP-related
capabilities in a single facility would be a significant added
value to both programs. Having state-of-the-art semiconductor
research and development capabilities in the same location as
advanced packaging capabilities would be transformative for the
semiconductor ecosystem in the United States, because the
boundaries between semiconductor wafer/chip processing and next
generation advanced packaging are blurring. Today, technology and
researchers in these different domains are separated, and no
independent research facilities for such innovations in packaging
exist in the United States. A flagship facility with co-located
chip/package solutions would accelerate co-optimized solutions at a
pace that is not currently possible and set the United States on a
path for continued leadership—at a time when public and private
investment in semiconductor research and development by foreign
adversaries is substantially increasing.
On behalf of this Federal agency, I certify that
the collection of information encompassed by this request complies
with 5 CFR 1320.9 and the related provisions of 5 CFR
1320.8(b)(3).
The following is a summary of the topics, regarding
the proposed collection of information, that the certification
covers:
(i) Why the information is being collected;
(ii) Use of information;
(iii) Burden estimate;
(iv) Nature of response (voluntary, required for a
benefit, or mandatory);
(v) Nature and extent of confidentiality; and
(vi) Need to display currently valid OMB control
number;
If you are unable to certify compliance with any of
these provisions, identify the item by leaving the box unchecked
and explain the reason in the Supporting Statement.
Published FRN.pdf
Supporting Statement_Emergency Clearance Ecosystem Questionnaire_Post FRN_7.15.24 - CLEAN.docx
Ecosystem Questionnaire for States and Territories to Inform CHIPS R&D Facility Site Selection Process