CHIPS Pre-Application Information Collection

The submission of a Pre-application is highly encouraged but not required. The purpose of a Pre-application is to create an opportunity for the Department to provide a preliminary assessment of the likelihood of a potential application receiving CHIPS Incentives, and to provide meaningful feedback to applicants before they prepare a full application package, as well as an opportunity for dialogue between CPO and the applicant to ensure the applicant is ready to meet program requirements and address program priorities. CHIPS Incentive Program will initially prioritize incentives for the fabrication of leading-edge semiconductors. Leading Edge applicants may access the application upon release and may submit a Pre-application no earlier than 31 Mar 2023 or 21 days after submitting a Statement of Interest, whichever is later. All other applicants may access the application upon release but will not be able to submit a Pre-application until 1 May 2023 or 21 days after submitting a Statement of Interest, whichever is later.

The latest form for CHIPS Pre-Application Information Collection expires 2026-12-31 and can be found here.