New collection (Request for a new OMB Control Number)
No
Emergency
03/20/2023
Approved with change
03/24/2023
03/03/2023
This collection is approved for 6 months based on the revised materials provided by the Department. Should the Department plan to use this collection for more than 6 months, a 60 and 30 day notice must be published.
table that charts list comparision
Inventory as of this Action
Requested
Previously Approved
09/30/2023
6 Months From Approved
140
0
0
8,400
0
0
0
0
0
The submission of a Pre-application is highly encouraged but not required. The purpose of a Pre-application is to create an opportunity for the Department to provide a preliminary assessment of the likelihood of a potential application receiving CHIPS Incentives, and to provide meaningful feedback to applicants before they prepare a full application package, as well as an opportunity for dialogue between CPO and the applicant to ensure the applicant is ready to meet program requirements and address program priorities.
CHIPS Incentive Program will initially prioritize incentives for the fabrication of leading-edge semiconductors. Leading Edge applicants may access the application upon release and may submit a Pre-application no earlier than 31 Mar 2023 or 21 days after submitting a Statement of Interest, whichever is later. All other applicants may access the application upon release but will not be able to submit a Pre-application until 1 May 2023 or 21 days after submitting a Statement of Interest, whichever is later.
The CHIPS Program must fund a variety of projects to achieve its economic resilience and national security objectives. Projects will vary in technology, scale, cost, location, risk, and other factors. Over the last six months the Department has been work diligently to under the determine the best way to incentivize manufacturing through a series of requests for information. Input from these activities has helped design a program that will provide financial assistance awards to incentivize investment in facilities and equipment in the United States for semiconductor fabrication, assembly, testing, advanced packaging, and research and development, thereby increasing U.S. economic and national security by supporting a sustainable, competitive domestic semiconductor industry. Because both Congress and the Administration have identified the current low U.S. production of semiconductor chips as a matter of national security and defense, the Secretary of Commerce is implementing this program on an expedited timeline to meet the identified U.S. economic and national security needs.
The Department is requesting emergency approval of the CHIPS Pre-Application by March 20, 2023. The CHIPS Pre- Application is required to be officially considered for a CHIPS Incentive Award. The submission of a Pre-application is highly encouraged but not required. The purpose of a Pre-application is to create an opportunity for the Department to provide a preliminary assessment of the likelihood of a potential application receiving CHIPS Incentives, and to provide meaningful feedback to applicants before they prepare a full application package, as well as an opportunity for dialogue between CPO and the applicant to ensure the applicant is ready to meet program requirements and address program priorities.
CHIPS Incentive Program will initially prioritize incentives for the fabrication of leading-edge semiconductors. Leading Edge applicants may access the application upon release and may submit a Pre-application no earlier than 31 Mar 2023 or 21 days after submitting a Statement of Interest, whichever is later. All other applicants may access the application upon release but will not be able to submit a Pre-application until 1 May 2023 or 21 days after submitting a Statement of Interest, whichever is later.
A Federal Register notice was published on March 3, 2023 for a public comment period which will end on March 17th. Commerce understands OMB clearance would be for 6 months only and would publish a 60 day notice very quickly after OMB approves the emergency collection.
On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).
The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:
(i) Why the information is being collected;
(ii) Use of information;
(iii) Burden estimate;
(iv) Nature of response (voluntary, required for a benefit, or mandatory);
(v) Nature and extent of confidentiality; and
(vi) Need to display currently valid OMB control number;
If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.