CHIPS Full-Application Information Collection

CHIPS Full-Application Information Collection

LEA Screenshots v2

CHIPS Full-Application Information Collection

OMB: 0693-0094

Document [pdf]
Download: pdf | pdf
Full Application Flex Cards

Full Application Burden Statement

Full Application Acknowledgement

Full Application Cover Page Confidentiality Statement

LEA Cover Page 01

LEA Cover Page 02

LEA Cover Page Dropdown Values 01

LEA Cover Page Dropdown Values 02

LEA Cover Page Applicant Point of Contact

LEA Cover Page Applicant Point of Contact Dropdown Values

LEA File Uploads 01

LEA File Uploads 02

LEA File Uploads 03

Covered Incentive

Description of Project(s)

Applicant Profile
- Descriptive Information About the Applicant

-

Company Financials

-

Equity Capital Structure

-

Outstanding Debt

Alignment with Economic and National Security Objectives

Commercial Strategy

Detailed Description of Financial Plan

Project Sources and Uses of Funds

Project Cash Flow, Income Statement, and Balance Sheet Projections and Relevant Metrics for
each Project

Scenario Analysis

CHIPS incentive request template

CHIPS Incentives Request Narrative

CHIPS Loan or Loan Guarantee Request

Project Technical Feasibility
- Description

-

Environmental Questionnaire

Organization Information
-

Ownership, Legal Entity, and Organizational Structure

-

Managerial Capability

-

Consortium Applicants

-

Past Project History

-

Intellectual Property Security

-

Litigation and/or Conflicts

-

Advisors and Key Partners

Workforce Development Plan

Broader Impacts

Standard Forms
-

SF-328, Certificate Pertaining to Foreign Interests

-

CD-511, Certificate Regarding Lobbying

-

SF-LLL, Disclosure of Lobbying Activities

-

Other Forms

File Upload Complete

Not Authorized

Attestation 01

Attestation 02


File Typeapplication/pdf
File TitleMicrosoft Word - LEA Screenshots v2.docx
Authorbcopello
File Modified2023-03-21
File Created2023-03-21

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