Full-Application Template Sources, Uses Front-end, Back-end.xlsx

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Overview

S&U - Project 1
S&U - Project 2
S&U - Summation across projects

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Sheet 1: S&U - Project 1

Template for Sources and Uses of Funds - Front-End and Back-End Commercial Fabrication Facilities
Full Application Stage
	Sources and Uses project template
	Please refer to the Sources & Uses template instruction guide available for download in the full application section of the CHIPS Incentives Portal and at https://www.nist.gov/document/chips-nofo-commercial-fabrication-facilities-sources-and-uses-funds-instructions.
	Please complete one template for each proposed project. Shared costs related to infrastructure improvements, workforce development, and other areas should be allocated across projects.
	Add additional rows into the schedules as needed
	Facility 1 - Name
	Facility 1 - Description
	Schedule A: Project 1 - Uses Schedule				Schedule B: Project 1 - Funding Sources Schedule
	Uses of Funds	Amount (USD)	Percentage eligible for ITC		Sources of Funds	Amount (USD)
	1. Capital Investment	0.00			1. Equity Funding	0.00
	1.a. Land	0.00			Sponsor Equity (Applicant and/or Corporate Parent)
	Land acquisition (incl. appraisal costs, right-of-way acquisitions, relocation expenses)				Third-Party Equity
	Land improvements and site restoration (including demolition and removal)				Other Equity Funding
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	1.b. Construction	0.00			2. Debt Funding	0.00
	Building - Labor				Intercompany Debt from Corporate Parent
	Building - Materials				Third-Party Debt (e.g., Bonds or Loans)
	[Insert description]				Unguaranteed portion of Third-Party Loans Guaranteed by CHIPS Program
	[Insert description]				Other Debt Funding
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	1.b.i Clean Room Construction	0.00			[Insert description]
	Clean room construction labor				[Insert description]
	Delivery systems				3. Government Support	0.00
	Lighting Equipment				CHIPS Direct Funding
	[Insert description]				CHIPS Loans
	[Insert description]				Third-party Loans Guaranteed by CHIPS Program
	[Insert description]				Investment Tax Credit (estimated)
	[Insert description]				State and Local Government Grants
	[Insert description]				State and Local Government Loans
	[Insert description]				State and Local Tax Credits
	1.c. Equipment	0.00			Other State and Local Government Incentives
	1.c.i Clean Room Level Manufacturing Equipment	0.00			Other Federal grants, loans or guarantees
	Initial semiconductor manufacturing equipment purchase (including spare parts)				[Insert description]
	Semiconductor manufacturing equipment installation				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				4. Other Sources of Funds (examples provided below)	0.00
	[Insert description]				Equipment Financing
	[Insert description]				Sale Leaseback or Other Real Estate Financing
	1.c.ii Interstitial and Fan Deck Equipment	0.00			Customer Funding
	Recirculating air handler units				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				Total Project Funding	0.00
	1.c.iii. Clean Sub-fab Level Equipment	0.00
	Pumps and abatement systems
	Power Supply System
	Ultrapure water systems
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.iv Utility Level Equipment	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.v Other Stand-alone Facilities Equipment	0.00
	R&D Equipment
	Prototyping Equipment
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.vi Ramp	0.00
	Ramp - Piloting and Prototyping
	Ramp - Process Engineering / Foundry Enablement
	Ramp - Technology Transfer
	Ramp - Yield Ramp Up
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.d. Infrastructure Improvements	0.00
	Energy Infrastucture
	Wastewater treatment plants
	Access Infrastructure (e.g., roads)
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.e. Administrative Expenses directly attributable to facility construction	0.00
	Administrative fees (e.g., legal, licensing and permitting, inspection, bond)
	Architecture and Engineering fees
	Safety and environmental protection costs
	Costs associated with receiving CHIPS funding
	Insurance costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.f. Other	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	2. Operating losses and other cash outflows until project cash flows breakeven (Complete Schedule C below)	0.00
	3. Workforce Development Costs	0.00
	Equipment Costs
	Construction of Training Center
	Training and Education Costs
	Wrap-Around Support Costs
	Childcare Costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	4. Other Uses of Funds	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Total Project Costs	0.00
	Schedule C: Project 1 - Schedule for Operating Cash Flows until Project breaks even on a Cash Flow basis
		Amount (USD)
	1. Net sales until project breaks even on cash flow basis	0.00
	Gross sales until project breaks even on cash flow basis
	Price discounts (if applicable)
	2. Total operating expenses until project breaks even on a cash flow basis	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Operating Income / Losses (excluding other operating income)	0.00
	3. Other operating income until project breaks even on a cash flow basis	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Operating Income / Losses	0.00
	4. Other cash flow items until project breaks even on a cash flow basis	0.00
	Semiconductor Manufacturing Equipment Replacement through breakeven
	Upgrades / Modifications to Semiconductor Manufacturing Equipment through Breakeven
	Net Working Capital
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Earnings Before Interest and Taxes	0.00
	5. Total financing costs and taxes until project breaks even on a cash flow basis	0.00
	Interest Paid to Service Debt
	Payments to Third-Party Partners
	Other Financing Costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Corporate Taxes
	Other Taxes
	[Insert description]
	[Insert description]
	[Insert description]
	Operating losses and other cash outflows until project breaks even on a cash flow basis	0.00

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Sheet 2: S&U - Project 2

Template for Sources and Uses of Funds - Front-End and Back-End Commercial Fabrication Facilities
Full Application Stage
	Sources and Uses project template
	Please refer to the Sources & Uses template instruction guide available for download in the full application section of the CHIPS Incentives Portal and at https://www.nist.gov/document/chips-nofo-commercial-fabrication-facilities-sources-and-uses-funds-instructions
	Please complete one template for each proposed project. Shared costs related to infrastructure improvements, workforce development, and other areas should be allocated across projects.
	Add additional rows into the schedules as needed
	Facility 2 - Name
	Facility 2 - Description
	Schedule A: Project 2 - Uses Schedule				Schedule B: Project 2 - Funding Sources Schedule
	Uses of Funds	Amount (USD)	Percentage eligible for ITC		Sources of Funds	Amount (USD)
	1. Capital Investment	0.00			1. Equity Funding	0.00
	1.a. Land	0.00			Sponsor Equity (Applicant and/or Corporate Parent)
	Land acquisition (incl. appraisal costs, right-of-way acquisitions, relocation expenses)				Third-Party Equity
	Land improvements and site restoration (including demolition and removal)				Other Equity Funding
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	1.b. Construction	0.00			2. Debt Funding	0.00
	Building - Labor				Intercompany Debt from Corporate Parent
	Building - Materials				Third-Party Debt (e.g., Bonds or Loans)
	[Insert description]				Unguaranteed portion of Third-Party Loans Guaranteed by CHIPS Program
	[Insert description]				Other Debt Funding
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	1.b.i Clean Room Construction	0.00			[Insert description]
	Clean room construction labor				[Insert description]
	Delivery systems				3. Government Support	0.00
	Lighting Equipment				CHIPS Direct Funding
	[Insert description]				CHIPS Loans
	[Insert description]				Third-party Loans Guaranteed by CHIPS Program
	[Insert description]				Investment Tax Credit (estimated)
	[Insert description]				State and Local Government Grants
	[Insert description]				State and Local Government Loans
	[Insert description]				State and Local Tax Credits
	1.c. Equipment	0.00			Other State and Local Government Incentives
	1.c.i Clean Room Level Manufacturing Equipment	0.00			Other Federal grants, loans or guarantees
	Initial semiconductor manufacturing equipment purchase (including spare parts)				[Insert description]
	Semiconductor manufacturing equipment installation				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				4. Other Sources of Funds (examples provided below)	0.00
	[Insert description]				Equipment Financing
	[Insert description]				Sale Leaseback or Other Real Estate Financing
	1.c.ii Interstitial and Fan Deck Equipment	0.00			Customer Funding
	Recirculating air handler units				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				Total Project Funding	0.00
	1.c.iii. Clean Sub-fab Level Equipment	0.00
	Pumps and abatement systems
	Power Supply System
	Ultrapure water systems
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.iv Utility Level Equipment	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.v Other Stand-alone Facilities Equipment	0.00
	R&D Equipment
	Prototyping Equipment
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.vi Ramp	0.00
	Ramp - Piloting and Prototyping
	Ramp - Process Engineering / Foundry Enablement
	Ramp - Technology Transfer
	Ramp - Yield Ramp Up
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.d. Infrastructure Improvements	0.00
	Energy Infrastucture
	Wastewater treatment plants
	Access Infrastructure (e.g., roads)
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.e. Administrative Expenses directly attributable to facility construction	0.00
	Administrative fees (e.g., legal, licensing and permitting, inspection, bond)
	Architecture and Engineering fees
	Safety and environmental protection costs
	Costs associated with receiving CHIPS funding
	Insurance costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.f. Other	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	2. Operating losses and other cash outflows until project cash flows breakeven (Complete Schedule C below)	0.00
	3. Workforce Development Costs	0.00
	Equipment Costs
	Construction of Training Center
	Training and Education Costs
	Wrap-Around Support Costs
	Childcare Costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	4. Other Uses of Funds	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Total Project Costs	0.00
	Schedule C: Project 2 - Schedule for Operating Cash Flows until Project breaks even on a Cash Flow basis
		Amount (USD)
	1. Net sales until project breaks even on cash flow basis	0.00
	Gross sales until project breaks even on cash flow basis
	Price discounts (if applicable)
	2. Total operating expenses until project breaks even on a cash flow basis	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Operating Income / Losses (excluding other operating income)	0.00
	3. Other operating income until project breaks even on a cash flow basis	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Operating Income / Losses	0.00
	4. Other cash flow items until project breaks even on a cash flow basis	0.00
	Semiconductor Manufacturing Equipment Replacement through breakeven
	Upgrades / Modifications to Semiconductor Manufacturing Equipment through Breakeven
	Net Working Capital
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Earnings Before Interest and Taxes	0.00
	5. Total financing costs and taxes until project breaks even on a cash flow basis	0.00
	Interest Paid to Service Debt
	Payments to Third-Party Partners
	Other Financing Costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Corporate Taxes
	Other Taxes
	[Insert description]
	[Insert description]
	[Insert description]
	Operating losses and other cash outflows until project breaks even on a cash flow basis	0.00

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Sheet 3: S&U - Summation across projects

Template for Sources and Uses of Funds - Front-End and Back-End Commercial Fabrication Facilities
Full Application Stage
	Sources and Uses summation across projects template
	Please refer to the Sources & Uses template instruction guide available for download in the full application section of the CHIPS Incentives Portal and at https://www.nist.gov/document/chips-nofo-commercial-fabrication-facilities-sources-and-uses-funds-instructions
	Each cell in the "Summation across Projects Sources and Uses" template should be a basic summation across each of the corresponding cells in every project template completed.
	Add additional rows into the schedules as needed
	Schedule A: Summation across projects - Uses Schedule				Schedule B: Summation across projects - Funding Sources Schedule
	Uses of Funds	Amount (USD)	Percentage eligible for ITC		Sources of Funds	Amount (USD)
	1. Capital Investment	0.00			1. Equity Funding	0.00
	1.a. Land	0.00			Sponsor Equity (Applicant and/or Corporate Parent)
	Land acquisition (incl. appraisal costs, right-of-way acquisitions, relocation expenses)				Third-Party Equity
	Land improvements and site restoration (including demolition and removal)				Other Equity Funding
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	1.b. Construction	0.00			2. Debt Funding	0.00
	Building - Labor				Intercompany Debt from Corporate Parent
	Building - Materials				Third-Party Debt (e.g., Bonds or Loans)
	[Insert description]				Unguaranteed portion of Third-Party Loans Guaranteed by CHIPS Program
	[Insert description]				Other Debt Funding
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	1.b.i Clean Room Construction	0.00			[Insert description]
	Clean room construction labor				[Insert description]
	Delivery systems				3. Government Support	0.00
	Lighting Equipment				CHIPS Direct Funding
	[Insert description]				CHIPS Loans
	[Insert description]				Third-party Loans Guaranteed by CHIPS Program
	[Insert description]				Investment Tax Credit (estimated)
	[Insert description]				State and Local Government Grants
	[Insert description]				State and Local Government Loans
	[Insert description]				State and Local Tax Credits
	1.c. Equipment	0.00			Other State and Local Government Incentives
	1.c.i Clean Room Level Manufacturing Equipment	0.00			Other Federal grants, loans or guarantees
	Initial semiconductor manufacturing equipment purchase (including spare parts)				[Insert description]
	Semiconductor manufacturing equipment installation				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				4. Other Sources of Funds (examples provided below)	0.00
	[Insert description]				Equipment Financing
	[Insert description]				Sale Leaseback or Other Real Estate Financing
	1.c.ii Interstitial and Fan Deck Equipment	0.00			Customer Funding
	Recirculating air handler units				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				[Insert description]
	[Insert description]				Total Project Funding	0.00
	1.c.iii. Clean Sub-fab Level Equipment	0.00
	Pumps and abatement systems
	Power Supply System
	Ultrapure water systems
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.iv Utility Level Equipment	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.v Other Stand-alone Facilities Equipment	0.00
	R&D Equipment
	Prototyping Equipment
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.c.vi Ramp	0.00
	Ramp - Piloting and Prototyping
	Ramp - Process Engineering / Foundry Enablement
	Ramp - Technology Transfer
	Ramp - Yield Ramp Up
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.d. Infrastructure Improvements	0.00
	Energy Infrastucture
	Wastewater treatment plants
	Access Infrastructure (e.g., roads)
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.e. Administrative Expenses directly attributable to facility construction	0.00
	Administrative fees (e.g., legal, licensing and permitting, inspection, bond)
	Architecture and Engineering fees
	Safety and environmental protection costs
	Costs associated with receiving CHIPS funding
	Insurance costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	1.f. Other	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	2. Operating losses and other cash outflows until project cash flows breakeven (Complete Schedule C below)	0.00
	3. Workforce Development Costs	0.00
	Equipment Costs
	Construction of Training Center
	Training and Education Costs
	Wrap-Around Support Costs
	Childcare Costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	4. Other Uses of Funds	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Total Project Costs	0.00
	Schedule C: Summation across projects - Schedule for Operating Cash Flows until Project breaks even on a Cash Flow basis
		Amount (USD)
	1. Net sales until project breaks even on cash flow basis	0.00
	Gross sales until project breaks even on cash flow basis
	Price discounts (if applicable)
	2. Total operating expenses until project breaks even on a cash flow basis	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Operating Income / Losses (excluding other operating income)	0.00
	3. Other operating income until project breaks even on a cash flow basis	0.00
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Operating Income / Losses	0.00
	4. Other cash flow items until project breaks even on a cash flow basis	0.00
	Semiconductor Manufacturing Equipment Replacement through breakeven
	Upgrades / Modifications to Semiconductor Manufacturing Equipment through Breakeven
	Net Working Capital
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Earnings Before Interest and Taxes	0.00
	5. Total financing costs and taxes until project breaks even on a cash flow basis	0.00
	Interest Paid to Service Debt
	Payments to Third-Party Partners
	Other Financing Costs
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	[Insert description]
	Corporate Taxes
	Other Taxes
	[Insert description]
	[Insert description]
	[Insert description]
	Operating losses and other cash outflows until project breaks even on a cash flow basis	0.00
	Question 1: Provide an explanation on how the equity injected into the projects legal entity (by the applicant, its corporate parent or third-party partners) is funded. If debt is raised on the corporate parent’s or third-party partner's balance sheet, outside of the project legal entity structure, and then downstreamed as equity, please provide details on the amount of debt attributable to this project.
	Question 2: If known, provide information on the key features and terms & conditions related to the debt funding raised by the applicant (e.g., Tenor, Fixed vs. Floating rate, Interest rate, Amortization features, pre-payment optionality).
	Question 3: Explain how you estimated the value of the benefit from the Investment Tax Credit.
	Question 4: Are there any other state or local incentives that provide funding in a form that is not a direct grant or loan, such as reduced utilities costs, reduced taxes, etc.? If yes, please describe and estimate incentive amount(s) through the life of the project, and through the time period until cash flows turn positive.
	Question 5: Is there any other information related to Sources of Funds for the facilities that we should know?
	Question 6: Is there any other information related to Uses of Funds for the facilities that we should know?