CHIPS Streamlined Supply Chain Information Collection Request

Forms and Documents

Forms and supporting documents for this ICR

Document	Type	Status	Availability
published 30 Day FRN.pdf	Supplementary Document	Uploaded 2023-10-18	Repair queued
Statement A - Streamlined Supply Chain V3.docx	Supporting Statement A	Uploaded 2023-10-18	Repair queued
Supplemental Info from NOFO Streamlined Environmental Questionnaire Interior Modernization.docx	Supplementary Document	Uploaded 2023-10-16	Available
published 60 Day FRN.pdf	Supplementary Document	Uploaded 2023-10-16	Repair queued
Statement B - Streamlined Supply Chain.docx	Supporting Statement B	Uploaded 2023-10-16	Missing upstream

IC Document Collections

Information collection document groups

IC ID	Collection	Type	Status	Form
262825	CHIPS Streamline Supply Chain Full Application	Other-ICR Screen Shots	New
262823	CHIPS Streamlined Supply Chain Concept Plan	Other-Information Collection Screen Shots	New

ICR Details

OMB Control No:	ICR Reference No: 202310-0693-001
Status: Received in OIRA	Previous ICR Reference No:
Agency/Subagency: DOC/NIST	Agency Tracking No: ER
Title: CHIPS Streamlined Supply Chain Information Collection Request
Type of Information Collection: New collection (Request for a new OMB Control Number)	Common Form ICR:  No
Type of Review Request: Regular	Date Submitted to OIRA: 10/18/2023

table that charts list comparision

	Requested	Previously Approved
Expiration Date	36 Months From Approved
Responses	210	0
Time Burden (Hours)	8,820	0
Cost Burden (Dollars)	0	0

---

Abstract: The CHIPS Incentives Program Facilities for Semiconductor Materials and Manufacturing Equipment Notice of Funding Opportunity (NOFO) seeks applications that will support investments in the construction, expansion, or modernization of commercial facilities in the United States for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million. This NOFO seeks applications in the following categories. Semiconductor Materials Facilities for the manufacture or production, including growth or extraction, of materials used to manufacture semiconductors, which are the chemicals, gases, raw and intermediate materials, and other consumables used in semiconductor manufacturing. Specific examples include but are not limited to polysilicon; photoresists and ancillaries (developers, strippers, litho solvents, and anti-reflective and hardmask layers); sputtering targets (including tantalum, titanium, and aluminum); and materials specifically used in quantum information systems (such as hafnium and niobium). Semiconductor Manufacturing Equipment Facilities for the physical production of specialized equipment integral to the manufacturing of semiconductors and subsystems that enable or are incorporated into the manufacturing equipment. Specific examples of semiconductor manufacturing equipment include but are not limited to deposition equipment, including chemical vapor deposition, physical vapor deposition, and atomic layer deposition; etching equipment (wet etch, dry etch); lithography equipment (steppers, scanners, extreme ultraviolet); wafer slicing equipment, wafer dicing equipment, and wire bonders; inspection and measuring equipment, including scanning electron microscopes, atomic force microscopes, optical inspection systems, and wafer probes; certain metrology and inspection systems; and ion implantation and diffusion/oxidation furnaces.

---

Authorizing Statute(s): None

Citations for New Statutory Requirements: None

---

Associated Rulemaking Information
RIN:	Stage of Rulemaking:	Federal Register Citation:	Date:
	Not associated with rulemaking

---

Federal Register Notices & Comments
60-day Notice:	Federal Register Citation:	Citation Date:
	88 FR 47481	07/24/2023
30-day Notice:	Federal Register Citation:	Citation Date:
	88 FR 71839	10/18/2023
Did the Agency receive public comments on this ICR? Yes

---

Number of Information Collection (IC) in this ICR: 2

table that charts list of burden

IC Title	Form No.	Form Name
CHIPS Streamline Supply Chain Full Application
CHIPS Streamlined Supply Chain Concept Plan

---

ICR Summary of Burden

table that charts list of burden

	Total Request	Previously Approved	Change Due to New Statute	Change Due to Agency Discretion	Change Due to Adjustment in Estimate	Change Due to Potential Violation of the PRA
Annual Number of Responses	210	0	0	210	0	0
Annual Time Burden (Hours)	8,820	0	0	8,820	0	0
Annual Cost Burden (Dollars)	0	0	0	0	0	0

Burden increases because of Program Change due to Agency Discretion: Yes

Burden Increase Due to: Miscellaneous Actions

Burden decreases because of Program Change due to Agency Discretion: No

Burden Reduction Due to:

Short Statement: This is new information collection

---

Annual Cost to Federal Government: $873,032

Does this IC contain surveys, censuses, or employ statistical methods? No

Does this ICR request any personally identifiable information (see OMB Circular No. A-130 for an explanation of this term)? Please consult with your agency's privacy program when making this determination.     Yes

Does this ICR include a form that requires a Privacy Act Statement (see 5 U.S.C. §552a(e)(3))? Please consult with your agency's privacy program when making this determination.     No

Is this ICR related to the Affordable Care Act [Pub. L. 111-148 & 111-152]? No

Is this ICR related to the Dodd-Frank Wall Street Reform and Consumer Protection Act, [Pub. L. 111-203]? No

Is this ICR related to the American Recovery and Reinvestment Act of 2009 (ARRA)? No

Is this ICR related to the Pandemic Response? No

---

Common Form ICR:  No

---

On behalf of this Federal agency, I certify that the collection of information encompassed by this request complies with 5 CFR 1320.9 and the related provisions of 5 CFR 1320.8(b)(3).

The following is a summary of the topics, regarding the proposed collection of information, that the certification covers:

(a) It is necessary for the proper performance of agency functions;

(b) It avoids unnecessary duplication;

(c) It reduces burden on small entities;

(d) It uses plain, coherent, and unambiguous language that is understandable to respondents;

(e) Its implementation will be consistent and compatible with current reporting and recordkeeping practices;

(f) It indicates the retention periods for recordkeeping requirements;

(g) It informs respondents of the information called for under 5 CFR 1320.8 (b)(3) about:

(i) Why the information is being collected;

(ii) Use of information;

(iii) Burden estimate;

(iv) Nature of response (voluntary, required for a benefit, or mandatory);

(v) Nature and extent of confidentiality; and

(vi) Need to display currently valid OMB control number;

(h) It was developed by an office that has planned and allocated resources for the efficient and effective management and use of the information to be collected.

(i) It uses effective and efficient statistical survey methodology (if applicable); and

(j) It makes appropriate use of information technology.

If you are unable to certify compliance with any of these provisions, identify the item by leaving the box unchecked and explain the reason in the Supporting Statement.

Certification Date: 10/18/2023

---